PRECONDITIONING Search Results

P-18585

Abstract: DS1233
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-96 9644 A5 CARSEM DM635839AAA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

16875

Abstract: ds1232 P-16852 16876
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1232 Jan-96 9547 C1 ANAM, K. DN537172ABA 3.0µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-16818 READPOINT (Sample Size/No. of Fails)

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Apr-97 9712 M3 ANAM, K. DN507374ABY 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

an 17820

Abstract: DS2107A
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jul-96 9623 A6 ANAM, K. DN604282AAB1 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

P-20460

Abstract: 20461 DS2181A
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~

LTM4602

Abstract: LTM4600 LTM4601 15X15 0623 IPC-9701 IPC 9701 power one date code
Contextual Info: RELIABILITY DATA LTM4600 / LTM4601 / LTM4602 1/15/2007 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS 1 EQV to +100°C LGA 15X15 551 0452 0645 2,820,404 551 2,820,404 • J-STD-020 LEVEL 4 PRECONDITIONING4 (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)

DS2165

Abstract: APR97
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-97 9651 B1 HYUNDAI DL622720AAA 1.2µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~

DS12885

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Nov-95 9538 A2 ANAM, K. DN531869AAD1 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

21103

Abstract: transistor HR DS1267 p21105 HR 250 P21103 P-21105
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Nov-97 9737 A1 ANAM, PI. DK727730AAA 1.2µ OX/NI 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): 0 Hr

DS1267

Abstract: P-17298
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Apr-96 9612 A1 HYUNDAI DL603183AAL 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-17251 READPOINT (Sample Size/No. of Fails)

1754-3

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 May-96 9617 A2 HYUNDAI DL607533AAI 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: Implementing FIR Filters January 1996, ver. 1 Introduction in FLEX Devices Application Note 73 The finite impulse response FIR filter is used in many digital signal processing (DSP) systems to perform signal preconditioning, antialiasing, band selection, decimation/interpolation, low-pass filtering, and

74 HTC 08

Abstract: 74 HTC 00 P-20606
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-97 9737 A6 CARSEM DM718527ABB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

40 RH 304

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Oct-95 9544 A1 HYUNDAI DL508411AAK 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : 85°C/85% RH, 168 hours HTC Vapor Phase, 3 Passes

18704

Abstract: P-18701
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2180A May-97 9712 B3 ANAM, K. DN704701AAJ 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Dec-96 9639 C2 OMEDATA DD631336AAA 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~

dk52

Abstract: P17318
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-96 9534 B1 ANAM, PI DK523559AAC 2.0µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Dec-95 9501 A2 ANAM, K. DN444456AAG 1.2µ OX/NI 28 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Cum % 0.0% Preconditioning (P/C):

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Dec-95 9546 A6 CARSEM DM534661ANA 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

16889

Abstract: B/TDA 16840
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jan-96 9552 A6 CARSEM DM510561AAA 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

P-18366

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-96 9546 M3 ANAM, K. DN531428AAA1 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-97 9738 B3 CARSEM DM722224AAB 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Electrical Cum % 203/0 0.0% Preconditioning (P/C):