STACKED Search Results
STACKED Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 54112-801300800LF |
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BERGSTIK STACKING | |||
| 54242-808202350LF |
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BERGSTIK STACKING | |||
| 54112-101260800LF |
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BERGSTIK STACKING | |||
| 54112-802201300LF |
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BERGSTIK STACKING | |||
| 76745-8AG-14LF |
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BERGSTIK STACKING HEADER |
STACKED Price and Stock
FlexiPanel Ltd BMR453 STACKERIsolated DC/DC Converters - Through Hole 711W 12.45V 60A 44-75Vin |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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BMR453 STACKER |
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TDK Corporation CKG57NX7T2E335M500JHSpecialty Ceramic Capacitors CKG 2220 250V 3.3uF X7T 20% T: 5mm |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CKG57NX7T2E335M500JH | Reel | 314,000 | 1,000 |
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TDK Corporation CKG57NX7S2A226M500JHSpecialty Ceramic Capacitors CKG 2220 100V 22uF X7S 20% T: 5mm |
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CKG57NX7S2A226M500JH | Reel | 305,000 | 1,000 |
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Murata Manufacturing Co Ltd KRM55WR72A226MH01LSpecialty Ceramic Capacitors 22UF 100V 20% 2220 |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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KRM55WR72A226MH01L | Reel | 91,200 | 200 |
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TDK Corporation CKG57NX7R2A106M500JHSpecialty Ceramic Capacitors CKG 2220 100V 10uF X7R 20% T: 5mm |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CKG57NX7R2A106M500JH | Reel | 48,000 | 1,000 |
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STACKED Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
54256AP
Abstract: TC54256AF 54256a TC54256P 54256AF tmm23256p 27256D tc54256ap
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TC54256AP/AF TC54256AP/AF 28-pin 200ns TC57256AD TC54256AP/AF. 54256AP TC54256AF 54256a TC54256P 54256AF tmm23256p 27256D tc54256ap | |
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Contextual Info: SILICON STACKED GATE MOS INTEGRATED CIRCUIT - TC57256AD-12,-120,-150 32 , 768 W O R D x 8 B I T C M O S UV ERASABLE A N D ELECTRICALLY PROGRAMMABLE READ ONLY MEMORY IDESCRIPTIONI The TC57256AD is a 32,768 word x 8 bit CMOS ultraviolet light erasable and electri |
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TC57256AD-12 TC57256AD 120ns, 30mA/8 TC57256AD. | |
TC5316200bP
Abstract: TC5316200BP/BF
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TC5316200BP/BF TC5316200BP/BF 600mil 42-pin 44-pin TC5316200BP TC5316200BF | |
TC57256ADContextual Info: TOSHIBA TC57256AD-12 TC57256AD-120 TC57256AD-150 SILICON STACKED GATE CMOS 32,768 WORD x 8 BIT CMOS UV ERASABLE AND ELECTRICALLY PROGRAMMABLE READ ONLY MEMORY Description The TC57256AD is a 32,768 word x 8 bit CMOS ultraviolet light erasable and electrically programmable read only memory. It |
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TC57256AD-12 TC57256AD-120 TC57256AD-150 TC57256AD 30mA/8 TC57256AD. | |
TC531621Contextual Info: TOSHIBA TC5316210CP/CF PRELIMINARY SILICON STACKED GATE CMOS 1,048,576 WORD x 16 BIT/2,097,152 WORD x 8 BIT CMOS MASK ROM Description TheTC 5316210C P/C F is a 16,777,216 bit read only m em ory organized as 1,048,576 w ords by 16 bits when BYTE is logical |
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TC5316210CP/CF 5316210C TC5316210CP/CF 5316210CP/CF 600mil 42-pin 44-pin TC531621OCP/CF TC531621 | |
TC5716200D-150
Abstract: 5716200D
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TC5716200D-150, 5716200D TC5716200D 42-pin 150ns/200ns 60rrvV6 5716200D TC5716200D. TC5716200D-150 | |
TC531024P-12Contextual Info: TOSHIBA TC531024P-12/15 TC531024F-12/15 SILICON STACKED GATE CMOS 65,536 WORD x 16 BIT CMOS MASK ROM Description The T C 5 3 1 0 2 4 P /F is a 1,048,576 bit read only m em ory organized as 65,536 words by 16 bits. The T C 5 3 1 0 2 4 P /F is fabricated using Toshiba’s advanced C M O S technology w hich results in high speed and low pow er features: |
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TC531024P-12/15 TC531024F-12/15 120ns/150ns, 600mil 40-pin 525mil TC531024P/F TC531024P-12/15, TC531024P-12 | |
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Contextual Info: SILICON STACKED GATE MOS INTEGRATED CIRCUIT TC531621OBP/BF/BFT 16M BIT 1M W O R D x 16 B IT / 2 M W ORD TENTATIVE x 8 B IT C M O S M A S K R O M DESCRIPTIO N T he T C 5316210B P / B F / BFT is a 16,777,216 bits read only m em ory organized as 1,048,576 words by |
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TC531621OBP/BF/BFT 5316210B 42pin TC5316210BP/BF/BFT A0-A19 | |
D1285
Abstract: binding post
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\Release\DataSheets\FlukeDataSheet\d1285 D1285 binding post | |
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Contextual Info: Type FCP Surface Mount Film Capacitors Stable Stacked Metallized Film PPS Chips for Reflow Soldering The Type FCP’s combination of high capacitance density and excellent high frequency response makes it a great choice for wireless and instrumentation applications. |
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90919Contextual Info: Model 6490 SMD Grabbers For ,025mm Lead Pitch FEATURES: • Use with SOIC, PLCC & PQFP packages with .025” lead pitch • Thin body style allows an unlimited number of clips to be stacked side by side MATERIALS: Body: ABS Plastic Tip: Nickel Plated Steel or Stainless Steel |
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025mm 30VAC/60VDC \d6490 90919 | |
DDR266Contextual Info: DDR SDRAM stacked 1Gb B-die x4/x8 DDR SDRAM Stacked 1Gb B-die DDR SDRAM Specification (x4/x8) Revision 1.1 Rev. 1.1 August. 2003 DDR SDRAM stacked 1Gb B-die (x4/x8) DDR SDRAM st. 1Gb B-die Revision History Revision 0.0 (May, 2003) - First version for internal review. |
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1113
Abstract: C1553-1 MIL-PRF-21038 MIL-T-10727 1517
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MIL-PRF-21038 MIL-PRF-21038/27 MIL-STD-1553 MIL-STD-1553B MIL-STD-202 MIL-T-10727 C1553-5* SFQC1553 1113 C1553-1 MIL-PRF-21038 MIL-T-10727 1517 | |
CompactCellTM Static RAMContextual Info: PRELIMINARY Am45DL6408G Stacked Multi-Chip Package MCP Flash Memory and SRAM 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) CompactCellTM Static RAM DISTINCTIVE CHARACTERISTICS |
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Am45DL6408G 16-Bit) 8-Bit/512 73-Ball limitation02 CompactCellTM Static RAM | |
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M390S2858DTU
Abstract: M390S2858DTU-C1H M390S2858DTU-C1L M390S2858DTU-C7A M390S2858DTU-C7C 10D4L PC133 registered reference design
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M390S2858DTU PC133/PC100 M390S2858DTU 128Mx72 128Mx4, 128Mx4 400mil 18-bits M390S2858DTU-C1H M390S2858DTU-C1L M390S2858DTU-C7A M390S2858DTU-C7C 10D4L PC133 registered reference design | |
GL032A
Abstract: S71GL032A S71GL032
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S71GL032A 16-bit) 1M/512K/256K GL032A S71GL032 | |
C3153 M
Abstract: C3474 B32520 C3332 c475 epcos B32529b C168 B32521 C1102 B32522C
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ECPU1C104MA5
Abstract: ECPU1C154MA5 ECPU1C224MA5 ECPU1C334MA5 ECPU1C474MA5 ECPU1C684MA5 Film Chip Capacitor
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16VDC ECPU1C334MA5 ECPU1C474MA5 ECPU1C684MA5 ECPU1C105MA5 ECPU1C104MA5 ECPU1C154MA5 ECPU1C224MA5 ECPU1C334MA5 ECPU1C474MA5 ECPU1C684MA5 Film Chip Capacitor | |
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Contextual Info: S98WS256PD0-003 Stacked Multi-chip Product MCP 256 Mbit (16 M x 16-Bit) 1.8 V Burst Mode Flash Memory 128 Mb (8M x 16-Bit) 1.8 V CellularRAM Type 2, Burst Mode Data Sheet S98WS256PD0-003 Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion |
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S98WS256PD0-003 16-Bit) S98WS256PD0-003 | |
S98WS512Contextual Info: S98WS512PE0FW005 Stacked Multi-chip Product MCP 512 Mbit (32M x 16-Bit) Stacked Burst Mode, Simultaneous Read/Write Flash Memory with 256 Mbit (16M x 16-bit) Mobile SDRAM on Shared Bus S98WS512PE0FW005 Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion |
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S98WS512PE0FW005 16-Bit) S98WS512PE0FW005 S98WS512 | |
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Contextual Info: SPECIFICATIONS SCSI III Connector Mechanical Contact Retention Force: 0.91Kg 2.01Lb min. Durability: 500 Cycles Electrical QA Series Right Angle, T/H Type 1.27mm [.050”] Pitch Stacked 68 Pos. Current Rating: 1A Contact Resistance: 35mΩ max. initial, 55mΩ max. after Test |
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00V/1min. 1000Mâ | |
HTPBContextual Info: PROFESSIONAL QUALITY PRINTED BOARD MOUNT TRI PORT VERTICALLY STACKED CONNECTOR ASSEMBLY FOR SHELTERED INDOOR/OUTDOOR ENVIRONMENTAL APPLICATIONS WHERE EMI SHIELDING IS REQUIRED 9 0 ° PRINTED BOARD MOUNT CONNECTOR 6 ROW CONNECTOR UNIT, 0 .2 8 3 7 ,1 9 CONTACT EXTENSION |
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AD7560
Abstract: OF IC 741 using opamp ad7540 2V reference voltage converter circuit dc to Dc 2V to 24V AD7560JN ad-7560s
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AD7560 AD7560 200mA OF IC 741 using opamp ad7540 2V reference voltage converter circuit dc to Dc 2V to 24V AD7560JN ad-7560s | |
KMM377S2857AT2-GH
Abstract: KMM377S2857AT2-GL
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KMM377S2857AT2 KMM377S2857AT2 128Mx4, 377S2857AT2 128Mx4 18-bits 24-pin 168-pin 0022uF KMM377S2857AT2-GH KMM377S2857AT2-GL | |