SOT58 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot582

Abstract: BGA388
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 2.15 mm SOT582-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA

sot583

Abstract: BGA456 BGA-456
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 2.15 mm SOT583-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA

BGA352

Abstract: sot581
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E

BGA456

Abstract: sot584
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K

BGA456

Abstract: MS-034 BGA-456
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB Y V T P M K H

MS-034

Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AK AJ AH AG AF AE AD AC

MS-034

Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA553 package SOT589-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA596 package SOT587-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ AG AE AC AA W U R N L J G E C A ∅v ∅w b e M M C A B C AH AF AD AB e Y V T e2 P M K H F D B

BGA352

Abstract: MS-034 ED-7311-9A
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W

BGA-596

Abstract: sot587 3445 BGA596
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C

sot589

Contextual Info: PDF: 2000 Apr 13 Philips Semiconductors Package outline BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm SOT589-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AJ AG AE AC AA W U R N

sot586

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X e1 AJ AG AE AC AA W U R N L J G E C A v M B b e y ∅w M v M A AK

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA656 package SOT588-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

MS-034

Abstract: k 3683 BGA-596
Contextual Info: PDF: 2003 Jan 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A 1 detail X C e1 ∅v M C A B b 1/2 e e y1 C y ∅w M C AK AH AF AD AB Y V T

k 3683

Abstract: MS-034 BGA656
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AK AJ AH AG AF AE AD AC

BGA516

Abstract: sot585 BGA-516
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA516: plastic ball grid array package; 516 balls; body 35 x 35 x 2.15 mm SOT585-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AE AC AA W U R N L J G E C AD AB Y

MS-034

Abstract: SOT587-2 sot587 BGA-596
Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

Contextual Info: TDA2540 TDA2540Q TELEVISION I.F. AMPLIFIER AND DEMODULATOR The T D A 2 5 4 0 is an i.f. a m p lifie r and dem odu la tor c irc u it fo r co lo u r and black and w h ite television receivers using n-p-n tuners. It incorporates the fo llo w in g functions: —

Contextual Info: TDA2523 TDA2523Q CO LO U R DEM O D U LATO R COM BINATION The TDA2523 is an integrated synchronous dem odulator combination fo r colour television re c e iv e rs incorporating the following functions : - 8 , 8 MHz o sc illa to r followed by a divider giving two 4, 4 MHz signals used a s refe re n c e