SOT584 Search Results

BGA456

Abstract: sot584
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K

BGA456

Abstract: MS-034 BGA-456
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB Y V T P M K H

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste