BGA352 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: E-BGA352-3535-1.27D4 Uniti nn - - H - - 1 April 2004

Contextual Info: BGA352-T-3535-1.27C4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo

Contextual Info: E-BGA352-3535-1.27D4

BGA352

Abstract: sot581
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E

SF-BGA352A-B-11

Contextual Info: D Package Code: BGA352A C 31.75mm [1.250"] 0.64mm [0.025"] typ. See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] typ. 31.75mm [1.250"] X 1.27mm [0.050"] Top View reference only 2 Ø 0.40mm [Ø 0.0156"] tooling hole X2 (optional)

353512

Contextual Info: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Oct. 28, 1996

Contextual Info: BGA352-T-3535-1.27D4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo

PBGA352

Abstract: BGA352 P-BGA-352 PBGA3523535
Contextual Info: P-BGA352-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SF-BGA352B-B-11

Contextual Info: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads

Contextual Info: T-BGA352-3535-1.27-4 Unit : mm T-BGA352-3535-1.27-4 j»0.75±0.15 l ^ jÿ 0 i m [S [ ABI C1.0 10.635 I OOOOOOOOOOOO OIOOOOOOOOOOOOO o o o o o o o o o o o o olo o o o o o o o o o o o o OOOOOOOOOOOO O'Oo o o o o o o o o o o o o o o o o o o o o o o o olo o o o o o o o o o o o o

BGA352

Abstract: MS-034 ED-7311-9A
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W

LS-BGA352B-11

Contextual Info: Tooling hole X2 BGA352B Ø 0.0156" (2x) (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] Top View (reference only) 1.00mm [0.039"] pitch typ. X Variable 0.508 mm [0.020"] dia pads 0.50mm [0.020"] 1 5.33mm [0.210"]

PRBG0352DA-A

Contextual Info: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Contextual Info: P-BGA352-P-3535-1.27 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 3.90 TYP. 2 版/96.8.12

IEC968

Abstract: Equator BSP-15 sad transistor A11b BSP-15-400 DRGB 001 A ac3 decoder toslink PAL to ITU-R BT.601/656 Decoder BSP15 BSP-15 IEC958
Contextual Info: Datasheet BSP-15 Processor Datasheet Equator Technologies, Inc. Revision H September 6, 2002 Document Number: HWR.BSP15.DS.REV.H Datasheet BSP-15 Processor Datasheet Revision H September 6, 2002 Copyright 2002 Equator Technologies, Inc. All rights reserved.

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

CG46713

Abstract: CG46194 CG46533 CG46134 CG46104
Contextual Info: FUJITSU Novem ber 1995 Edition 1.5 DATA S H E E T : CG/CE46 0.65 Micron High Performance, Low Power CMOS Gate Arrays Description The Fujitsu CG46 is a high performance, 0.65 |im drawn channel length, digital CMOS gate array family. The CE46 is a 0.65 urn drawn channel length, digital CMOS embedded gate array

130 nm CMOS standard cell library

Abstract: 130 nm CMOS standard cell library fujitsu 130 nm CMOS standard cell library ST
Contextual Info: June 1996 Edition 1.1 DATA SHEET : FU JITSU CE56 SERIES 0.5 MICRON HIGH PERFORMANCE/LOW POWER CMOS EMBEDDED ARRA YS DESCRIPTION CE56 SERIES PRODUCT SUMMARY The Fujitsu CE56 is a series of high performance CMOS embedded arrays offering diffused high speed RAMS, ROMS

PXB 4325

Abstract: PXB 4310 W25 smd siemens k25 PXB4325E
Contextual Info: ICs for Communications ATM Switching Preprocessor ASP PXB 4325 E Version 1.1 Preliminary Data Sheet 08.98 DS 1 PXB 4325 E Revision History: Current Version: 08.98 Previous Version: None Page Page in previous (in current Version Version) Subjects (major changes since last revision)

Device-List

Abstract: cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2
Contextual Info: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

C495 transistor

Abstract: r3272 MB2100H SN74LVC244A 14pin mc-156 32,768khz m1535d M1535 ah1 c541 c5470 EG-2121CA-125
Contextual Info: 4 3 2 1 D C B A D PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE PAGE

Bluetooth Energy Meter ckt diagram

Abstract: 94vo r29 Batteries Varta 500 rst 124 Touch pad synaptics Realistic sa-150 rotary encoder EC11 VT82C694X UB133X01 ALC200 humidity temperature sensor sh11
Contextual Info: SERVICE MANUAL & TROUBLESHOOTING GUIDE FOR 7170 BY： Richard Wang TESTING TECHNOLOGY DEPARTMENT / TSSC JUL. 2001 7170 N/B MAINTENANCE CONTENTS 1. Hardware Engineering Specification- 3