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Abstract: BGA388
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 2.15 mm SOT582-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA