SOT589 Search Results
SOT589 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT589-1 |
|
Footprint for reflow soldering SOT589-1 | Original | 11.54KB | 1 | ||
| SOT589-1 |
|
Plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm | Original | 289.81KB | 1 |
SOT589 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA553 package SOT589-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
BGA553 OT589-1 OT589-1 | |
|
Contextual Info: Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ AG AE AC AA W U R N L J G E C A ∅v ∅w b e M M C A B C AH AF AD AB e Y V T e2 P M K H F D B |
Original |
OT589-1 BGA553: MS-034 | |
sot589Contextual Info: PDF: 2000 Apr 13 Philips Semiconductors Package outline BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm SOT589-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AJ AG AE AC AA W U R N |
Original |
BGA553: OT589-1 sot589 |