BGA553 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA553 package SOT589-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ AG AE AC AA W U R N L J G E C A ∅v ∅w b e M M C A B C AH AF AD AB e Y V T e2 P M K H F D B

sot589

Contextual Info: PDF: 2000 Apr 13 Philips Semiconductors Package outline BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm SOT589-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AJ AG AE AC AA W U R N

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18