SOT587 Search Results

MS-034

Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AK AJ AH AG AF AE AD AC

MS-034

Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA596 package SOT587-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

BGA-596

Abstract: sot587 3445 BGA596
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C

MS-034

Abstract: SOT587-2 sot587 BGA-596
Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which