BGA596 Search Results

Contextual Info: Package outline BGA596: plastic ball grid array package; 596 balls SOT1150-1 B D J1 A ball A1 index area J2 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e X 1 3 5 7 9 11 13 15 17 19 21 23 25

MS-034

Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AK AJ AH AG AF AE AD AC

MS-034

Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA596 package SOT587-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

BGA-596

Abstract: sot587 3445 BGA596
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C

sot586

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X e1 AJ AG AE AC AA W U R N L J G E C A v M B b e y ∅w M v M A AK

SF-BGA596C-B-01

Contextual Info: SF-BGA596C-B-01 D Ø 0.40mm [0.0156"] Tooling Hole 36.83mm [1.450"] 0.64mm [0.025"] C See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 36.83mm [1.450"] X Top View (reference only) 1.27 mm [0.050"] 0.36mm dia. [0.014"] 2 0.64mm

MS-034

Abstract: k 3683 BGA-596
Contextual Info: PDF: 2003 Jan 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 2.15 mm SOT586-1 B D A D1 ball A1 index area A E1 E A2 A 1 detail X C e1 ∅v M C A B b 1/2 e e y1 C y ∅w M C AK AH AF AD AB Y V T

MS-034

Abstract: SOT587-2 sot587 BGA-596
Contextual Info: PDF: 2001 Jun 27 Philips Semiconductors Package outline BGA596: plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm SOT587-2 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C AJ AG AE AC AA W U R N

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

AMD Athlon 64 X2 5000

Abstract: MPT N095 40-A05100-D000 D5036 D552 IC digital clock lcd inverter for notebook CS3711 aA88 U505D ad07 mainboard
Contextual Info: A B C D E POWER PLANE LISTING : PWR +3.3V +5V +12V KBVCC NOM +2.5V +3.3VS +5VS ON ON ON ON ON ON ON ON ON ON ON ON POS ON ON ON ON ON ON ON ON ON ON ON ON 2.5V/VCCA_PLL STR ON OFF OFF OFF OFF ON ON ON ON ON OFF ON Thermal sensor OFF OFF OFF OFF OFF OFF OFF

FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators