RELIABILITY REPORT FORMAT Search Results

Heraeus SOLDER PASTE F645

Abstract: heraeus f816 heraeus F645 SA30C5-89M30 Heraeus paste profile SN63-90 Heraeus paste profile F645 heraeus heraeus f816 SN63-90 Heraeus pb free paste profile
Contextual Info: SLVA333 Application Report May 2009 BGA Package Component Reliability After Long-Term Storage R. Key, B. Lange, R. Madsen ABSTRACT The white paper Component Reliability After Long Term Storage Texas Instruments application report SLVA304, http://focus.ti.com/lit/wp/slva304/slva304.pdf detailed a risk analysis with

Transistor morocco 9740

Abstract: Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS 388BGA
Contextual Info: RELIABILITY REPORT Q98001 SICL BUSINESS UNIT REPORT NUMBER : Q98001 QUALIFICATION TYPE : NEW DEVICE - NEW PACKAGE DEVICE : STPC Client SIP101 SALES TYPES : STPCD0166BTC3 - STPCD0175BTC3 TECHNICAL CODE : MDBT*CHDT1BR PROCESS : HCMOS6 - CROLLES FAB LOCATION

xc68040

Abstract: xc68307 MC88110 mpc 1488 mc68185 Motorola M 9587 xc68lc040 XPC106 MC88100 XPC105
Contextual Info: BR1100/D REV 22 Microprocessor and Memory Technologies Group Reliability and Quality Report Third Quarter 1996 MICROPROCESSOR AND MEMORY TECHNOLOGIES GROUP RELIABILITY AND QUALITY REPORT QUARTER 3, 1996  MOTOROLA INC., 1996 To Our Valued Customers: Thank You! Thank you for selecting Motorola as your supplier of Microprocessor and Memory Products.

u2225b

Abstract: MCT12E U6204 U6202B U2829 U327M MC50K g1140 U2528B U427B
Contextual Info: Quality and Reliability Report 1998 TEMIC Semiconductors 06.98 Table of Contents TEMIC QUALITY POLICY .1 QUALITY SYSTEM .2

EIAJ-IC-121-17

Abstract: JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110
Contextual Info: Quality and Reliability Report 5. Reliability Testing The purpose of reliability testing is to ensure that The purpose of the high-temperature operating life products are properly designed and assembled by HTOL test is to determine the reliability of subjecting them to stress conditions that acceler-

DG300A-DG303A

Contextual Info: DG302A RELIABILITY REPORT FOR DG302AAK PLASTIC ENCAPSULATED DEVICES May 18, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

Contextual Info: MAX12528 RELIABILITY REPORT FOR MAX12528ETK+ PLASTIC ENCAPSULATED DEVICES November 22, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

outgoing material inspection format

Abstract: MAX31855 Thermocouple Type K material testing MAX31855ESA MAX31855E
Contextual Info: MAX31855 RELIABILITY REPORT FOR MAX31855ESA+ PLASTIC ENCAPSULATED DEVICES June 15, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

Contextual Info: MAX1123 RELIABILITY REPORT FOR MAX1123EGK+ PLASTIC ENCAPSULATED DEVICES September 12, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.

MAX8958

Abstract: MAX8958EWW MTTF Intel PROCESSOR INTEL MTTF
Contextual Info: MAX8958 RELIABILITY REPORT FOR MAX8958EWW+T WAFER LEVEL PRODUCTS October 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.

AN-944A

Abstract: AN944A AN934B IRF130 IRF430 IRF440 what is THERMAL RUNAWAY IN RECTIFIER MOSFET i-pak Package zener diode MOSFET reliability report format AN949A High frequency switching
Contextual Info: EXECUTIVE SUMMARY FIFTY FIFTH QUARTERLY REPORT This Quarterly Reliability Report is a summary of test data covering the previous twenty four months of component testing at International Rectifier's HEXFET America facility in Temecula, California. The products tested include HEXFETs packaged in TO-220,

MAX6902

Abstract: DW11 MAX6902EKA TC05
Contextual Info: MAX6902EKA Rev. A RELIABILITY REPORT FOR MAX6902EKA PLASTIC ENCAPSULATED DEVICES June 20, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl

DSA0025924

Abstract: outgoing material inspection format max6900 sot23 MAX6900 MAX6900ETT TC05 qfn 3x3 socket
Contextual Info: MAX6900ETT Rev. A RELIABILITY REPORT FOR MAX6900ETT PLASTIC ENCAPSULATED DEVICES May 13, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance

c9013

Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
Contextual Info: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.

receiving inspection procedure

Abstract: reliability report QA procedure failure analysis research data reliability data analysis report
Contextual Info: Quality and Reliability Report 4. Customer Return Handling Flow and Failure Analysis Procedures Customer Return Handling Flow Failure Analysis Procedures To ensure that customers receive prompt and ef- A successful failure analysis should indicate the ficient service, Winbond has developed a detailed

AN-7518

Contextual Info: Use of Life Tested Parts Application Note May 1999 AN-7518 Author: J. E. Vinson, Ph. D. History eyrds terrpoon, minctor mniions vin, e t, lility, reeni eful , ant rtalfails, arou Product Assumptions This report addresses high reliability product from an Intersil

pj 989

Abstract: PASIC 380 145026 14093 38980 report on PLCC solar cell Amorphous 144TQFP PACKAGE 84 pin plcc ic base QL8X12B-2
Contextual Info: pASIC 1 FAMILY Reliability Report SUMMARY The pASIC device is a highly reliable Field Programmable Gate Array. The addition of the ViaLink to a CMOS process does not measurably increase the failure rate of the pASIC devices above that of normal CMOS logic products. The following is the summary of the High

ACT1020

Abstract: JH05 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR 44 pin actel 1020b JEDEC-A113 ACTEL 1020B ACP55 smd U1p Jl03 JL-03
Contextual Info: Quality & Reliability Guide February 2001 2001 Actel Corporation All Rights Reserved. Actel and the Actel logo are trademarks of Actel Corporation. All other brand or product names are the property of their respective owners. Contents 1. Overview of Actel’s Quality and Reliability Guide . . . . . . . . . . . . . . . . . . . .1

IC ANA 618

Contextual Info: PRODU CT DAT ASH EET OMx – DCR Series of Optical Channel Monitors Dynamic Channel Recognition for Mixed 10Gb/s-100Gb/s Formats Introducing the OMx-DCR Optical Channel Monitor – for Mixed 10Gb/s, 40Gb/s, 100Gb/s and beyond To meet current and future modulation format challenges in high capacity,

ALTERA EPM7128SLC84

Abstract: FLUKE 8840a FLUKE 8840a specification EPM7128SLC84-7 atmel 160 pin EPM7128SLC84-7 part number atmel programming in c altera altera Date Code Formats ATMEL 340 EPM7128S
Contextual Info: White Paper ATF1500AS Analysis Report Introduction ® The Altera MAX 7000 family has many features that make it a leader in the programmable logic industry. MAX 7000 devices consume minimal power and are reliable at high frequencies. Additionally, these devices were designed for optimum timing characteristics and to support in-system programmability

Contextual Info: SII Group Overview SII Group products are used in a wide range of applications throughout society, including consumer products, devices used for orders at restaurants and payment for taxis, and electronic equipment in offices, laboratories and factories. Our parts are key components for

INCOMING RAW MATERIAL INSPECTION procedure

Abstract: INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION report format MATERIAL CONTROL PROCEDURE Sample form for INCOMING Inspection of RAW MATERIAL plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTIONs INCOMING MATERIAL INSPECTION procedure incoming material checklist
Contextual Info: ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. F 15-5 ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. F 15-6 ISO 9001 QUALITY MANUAL QUALITY SYSTEM FOR DESIGN, DEVELOPMENT, PRODUCTION, AND SERVICING 0 INTRODUCTION 3.0 DEFINITIONS This policy defines the organization and policies of Linear

Contextual Info: DS2282 PRELIMINARY DS2282 DALLAS SEMICONDUCTOR T1 FDL CONTROLLER/ MONITOR Stik FEATURES Stik LAYOUT • Fully implements the FDL message format as described in TR-TSY-000194 and T1.403-1989 • Supports both Scheduled Performance Report Messages and Unscheduled Messages

INCOMING RAW MATERIAL INSPECTION checklist

Abstract: INCOMING RAW MATERIAL INSPECTION procedure plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION report format ISO calibration certificate formats MATERIAL CONTROL PROCEDURE document standard operating procedure organizational chart
Contextual Info: ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. E 15-5 ISO 9001 QUALITY MANUAL Specification 06-09-0005, REV. E 15-6 ISO 9001 QUALITY MANUAL QUALITY SYSTEM FOR DESIGN, DEVELOPMENT, PRODUCTION, AND SERVICING 0 INTRODUCTION 3.0 DEFINITIONS This policy defines the organization and policies of Linear