PBGA329 Search Results

54sx08

Abstract: THERMAL Fuse m20 tf 115 c
Contextual Info: v 3 .0 54SX Family FPGAs Leading Edge Performance • 100%Resource Utilization with 100%Pin Locking • 320 MHz Internal Performance • 3.3VOperation with 5.0VInput Tolerance • 3.7 nsClock-to-Out Pi n-to-Pi n • Very Low Power Consumption • 0.1 ns Input Set-Up

Contextual Info: 54SXFamily FPGAs Leadi ng Edge P e r f o r m a nc e • • 320 MHz Internal Performance • 3.3VOperation with 5.0YInput Tolerance • 3.7 ns Qock-to-Out Pin-to-Pin • • 0.1ns Input Set-Up • Deterministic, Ufcer-Controllable Timing • 0.25 ns d o c k Skew

FSQ510 Equivalent

Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Contextual Info: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178

54SX72

Abstract: A54SX32APQ FBGA-484 A54SX16A THERMAL Fuse m20 tf 115 c PAR64 REQ64 A54SX08A A54SX16 A54SX32A
Contextual Info: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin

PRBG0329DA-A

Contextual Info: JEITA Package Code P-BGA329-31x31-1.27 RENESAS Code PRBG0329DA-A D MASS[Typ.] 3.4g A ZD A D1 b S AB e A1 y S Index mark S ZE AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 329F7X-B 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 20 21 22 23

b23n20

Contextual Info: ^ c te -m v 2. 0 l 54SX Family FPGAs • • • • • 100%Resource Utilization with 100%Pin Locking 3.3VOperation with 5.0VInput Tolerance Very Low Power Consumption Deterministic, User-ControlIableTiming Unique, In-System Diagnostic and Debug capability with

sae 1850 vpw

Abstract: sak-tc1775 P54 0A08 0439N
Contextual Info: Data Sheet, V1.2, May 2002 TC1775 Single-Chip Microcontroller INFN S05039 -î-f • 32-Bit icrocontrollers Infineon Never stop 11 INFNS05039 Edition 2002-05 P ublished by Infineon Techno log ies AG, S t.-M artin-S trasse 53, D-81541 M ünchen, Germ any Infineon Techno log ies AG 2002.

transistor smd marking ka p7

Abstract: diode datasheet IN47 ic SMD MARKING CODE ad 5.9 IN60 diode smd p9 10-10 J1850 P813 SAK-TC1775-L40E TC1775 IN58 KE
Contextual Info: D at a S h e e t , V 1. 2 , M ay 2 00 2 TC1775 32-Bit Single-Chip Microcontroller Microcontrollers N e v e r s t o p t h i n k i n g . Edition 2002-05 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany Infineon Technologies AG 2002.

54SX72

Abstract: FBGA-484 A54SX32APQ208 A54SX16A
Contextual Info: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin

QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

sak-tc1775

Contextual Info: Da ta She et, V1. 1, Sep . 2 00 1 TC1775 32-Bit Single-Chip Microcontroller Microcontrollers N e v e r s t o p t h i n k i n g . Edition 2001-09 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany Infineon Technologies AG 2001.

Control of Starter-generator

Abstract: starter/generator J1850 TC1775
Contextual Info: Product Brief AUDO TC1775 Advanced 32bit TriCore TM -based microcon- troller for automotive embedded control applications. TM TC1775 Target applications architecture is driven by the demanding • Engine management requirements of powertrain systems. This architecture

TC1100

Abstract: TC1115 TC1130 TC1765N-L40EB TC1765T-L40EB TC1910 TC1912 TC1920 184CH TC1796 multican
Contextual Info: MLI + 2xASC + 2xSSC + I²C - Packaging On-Chip Bootstrap Loader Watch-dog Timer OCDS / JTAG Power Managment System Ethernet CAN Real Time Clock Serial I/O EBU DRAM 6-ch EBU (burst) 7 EBU PWM TC1100 Capture Compare Channels (ext.Int./ PWM) Timers / Counters

3310H transistor

Abstract: transistor sr52 IN60 PACKAGE P48ab TMS 2370 ltcc 3110h 3310H fpi bus Transistor 3310H
Contextual Info: U s e r ’ s M a n u a l , V 2 .0 , F e b . 2 0 0 1 TC1775 System Units 32-Bit Single-Chip Microcontroller Microcontrollers N e v e r s t o p t h i n k i n g . Edition 2001-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany

sx 2082

Contextual Info: v3.0 54SX Family FPGAs Lead ing E dge P er f or m ance Feat ur es • 320 MHz Internal Performance • 66 MHz PCI • 3.7 ns Clock-to-Out Pin-to-Pin • CPLD and FPGA Integration • 0.1 ns Input Set-Up • Single Chip Solution • 0.25 ns Clock Skew • 100% Resource Utilization with 100% Pin Locking

A54SX08A

Abstract: FBGA-484 LRD12 A54SX16 A54SX16A A54SX32A A54SX72A PAR64 REQ64 54SX72
Contextual Info: Æ ic te ! P r e l i m i n a r y v1 .1 - m SX-AFamily FPGAs L e a d i n g E d g e Pe r f o r m a n e e • Configurable I/O Support for 3.3V5.0VPC3, LVTTL, and TIL • 250 MHz System Performance • Configurable Wfcak Resistor Pullup or Pulldown for

PEF 24628

Abstract: PSB 21493 siemens PMB 6610 47n60c3 psb 21553 Pmb7725 PEF 22628 PMB6610 psb 50505 PMB 6819
Contextual Info: 2006/2007 Published by Infineon Technologies AG Ordering No. B192-H6780-G10-X-7600 Printed in Germany PS 080648. nb Infineon Product Catalog for Distribution 2006/2007 Product Catalog for Distribution www.infineon.com/distribution Edition July 2006 Published by

Contextual Info: D at a S h e e t , V 1. 2 , M ay 2 00 2 TC1775 32-Bit Single-Chip Microcontroller Microcontrollers N e v e r s t o p t h i n k i n g . Edition 2002-05 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany Infineon Technologies AG 2002.

BCM 4336

Abstract: 2A0565 C2335 2A280Z C1740 bipolar transistor transistor A1267 a1273 transistor c2335 r 2B0565 2b265
Contextual Info: 01.07.2005 11:10 Uhr Seite 2 Shor t Form Catalog for Distribution 2005/06 w w w. i n f i n e o n . c o m / d i s t r i b u t i o n Published by Infineon Technologies AG Ordering No. B192-H6780-G9-X-7600 Printed in Germany LM 060550. Shor t Form Catalog Distribution 2005/06

Tricore

Abstract: J1850
Contextual Info: PRODUCT BRIEF TC 1775 A d v a n c e d 3 2 - b i t Tr i C o re - b a s e d Microcontroller for Automotive Embedded Control Applications The AUDO™ architecture is driven by the demanding requirements of powertrain systems. This architecture is easily applicable to other embedded

54SX

Abstract: A54SX08 A54SX16 A54SX32 PAR64 REQ64 38VCC 54SX16P
Contextual Info: v3.0.1 54SX Family FPGAs Lead ing E dge P er f or m ance Feat ur es • 320 MHz Internal Performance • 66 MHz PCI • 3.7 ns Clock-to-Out Pin-to-Pin • CPLD and FPGA Integration • 0.1 ns Input Set-Up • Single Chip Solution • 0.25 ns Clock Skew • 100% Resource Utilization with 100% Pin Locking

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)