GPA 76 Search Results

SXE-1089

Abstract: bt05cv SPA-1426 CMM6004 SPB2026 BT013 SOF-26 SPA-1526 MMG15241 SPB-2026
Contextual Info: Freescale Semiconductor General Purpose Amplifiers GPA Solutions Amplify your next design Expanded—Freescale’s General Purpose Amplifier Portfolio Freescale's GPA portfolio offers products Leveraging Freescale Semiconductor’s technologies. The HFET devices offer higher

7610-55AL

Abstract: BUK7506-55A BUK7510-55AL BUK7610-55AL electric motors
Contextual Info: BUK75/7610-55AL Optimized GPA TrenchMOS for linear mode circuits Philips’ extremely reliable General Purpose Automotive GPA TrenchMOS family is ideally suited to driving a wide range of automotive applications. The latest additions to the 55 V range, the BUK7510-55AL and BUK7610-55AL,

BUK7510-55AL

Abstract: BUK7610-55AL AEC-Q101 to220ab electric motors
Contextual Info: Optimized GPA TrenchMOS for Linear Mode Circuits BUK75/7610-55AL NXP’s extremely reliable General Purpose Automotive GPA TrenchMOS family is ideally suited to driving a wide range of automotive applications. The latest additions to the 55 V range, the BUK7510-55AL and BUK7610-55AL, offer added stability to drive electric motors in simple

BUK75150-55A

Abstract: BUK76150-55A
Contextual Info: BUK75/76150-55A TrenchMOS standard level FET Rev. 02 — 25 November 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using Philips General-Purpose Automotive GPA TrenchMOS™ technology.

BUK7L11-34ARC

Abstract: buk7l11
Contextual Info: BUK7L11-34ARC TrenchPLUS standard level FET Rev. 04 — 16 December 2005 Product data sheet 1. Product profile 1.1 General description N-channel enhancement mode field-effect power transistor in a plastic package using Philips General-Purpose Automotive GPA TrenchMOS technology.

darlington pair transistor

Abstract: Darlington pair AN3100 AN31001
Contextual Info: Freescale Semiconductor Application Note AN3100 Rev. 2, 7/2008 General Purpose Amplifier Biasing by: Jeff Gengler Freescale Semiconductor INTRODUCTION Freescale Semiconductor’s General Purpose Amplifier GPA devices are all designed to operate from a single

darlington pair power transistor

Abstract: AN31001 current amplifier note darlington AN3100 MMG3001NT1 MMG3002NT1 MMG3003NT1 freescale power RF products darlington pair transistor
Contextual Info: Freescale Semiconductor Application Note AN3100 Rev. 0, 3/2005 General Purpose Amplifier Biasing by: Jeff Gengler Freescale Semiconductor INTRODUCTION Freescale Semiconductor’s General Purpose Amplifier GPA devices are all designed to operate from a single

CMM6004

Abstract: SPB-2026 MML20242H MML09212H HITTITE cross reference 31 sot-89 BT05CV mmic sot-89 SXB-4089 SOF-26
Contextual Info: Freescale MMIC and GPA Cross Reference This cross reference is intended as a tool to aid your device selection. Each cross reference is based on published information and is subject to change without notice. This document should be used for reference purposes only.

7610-55AL

Abstract: 7610 BUK75 BUK7510-55AL BUK7610-55AL
Contextual Info: BUK75/7610-55AL N-channel TrenchMOS standard level FET Rev. 01 — 31 March 2005 Product data sheet 1. Product profile 1.1 General description N-channel enhancement mode field-effect power transistor in a plastic package using Philips General-Purpose Automotive GPA TrenchMOS™ technology specifically

MML20242H

Abstract: bt05cv MGA-30489 MML09212H ALM-31222 CMM6004 SPB-2026 mmic sot-89 SPA-1426 MMG3H21N
Contextual Info: Freescale MMIC and GPA Cross Reference This cross reference is intended as a tool to aid your device selection. Each cross reference is based on published information and is subject to change without notice. This document should be used for reference purposes only.

QFN 4X4

Abstract: MMG3004NT1 MMG3005NT1
Contextual Info: Freescale Semiconductor Document Number: Order from RF Marketing Rev. 4, 2/2008 General Purpose Amplifier GPA Board Assembly Instructions I. INTRODUCTION Freescale offers three different packages for its line of General Purpose Amplifiers (GPAs): the SOT - 89, QFN 4x4 and

BUK9006-55A

Abstract: 03nn86 11571
Contextual Info: BUK9006-55A TrenchMOS logic level FET Rev. 01 — 1 August 2003 Preliminary data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor available as a bare die using Philips General Purpose Automotive GPA TrenchMOS™ technology.

GPA801

Abstract: GPA807 GPA805
Contextual Info: is TAIWAN SEMICONDUCTOR RoHS COMPLIANCE GPA801 - GPA807 8.0 AMPS. Glass Passivated Rectifiers TO-22QAC 412 105 M * 186(4 76) 172(4 42) DIA 156(4 0) *Y ~ TW 3 4I • 055(1 40) Ö45H 14 -I.2 7 (0.861 624(16 0) W 9(14 6) ZSQM) Features A UL Recognized File # E-326243

DVMT 4.0

Abstract: 4mb aimm 810/810E 810E 810E2 815E
Contextual Info: R Intel 810/810E/810E2/815/815E Chipset Dynamic Video Memory Technology Revision 1.3 January 2001 January 2001 1 R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in

MC2259

Abstract: MC880P MC9713P mc2257 1N4003 germanium diode specification 2N1256 S P 1N4465 MC9802P MC9718P 3N214
Contextual Info: Semiconductor Data Library Master Index prepared by Technical Information Center The information in this book has been carefully checked and is believed to be reliable; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the

SUS410

Abstract: analog displacement sensor for 0 to 50 mm GP-A10MI ca2t Contact Image Sensor Head Displacement Sensors eddy current GP-A10M GP-A12ML GP-A12MLI GP-A5S
Contextual Info: SERIES High Accuracy Eddy Current Type Displacement Sensor High Accuracy Analog Sensing of Minute Displacement Outer Diameter Measurement GP-A VI Displacement Sensing Image Sensor LD LA-300 LA Collimated Beam Sensors MEASUREMENT SENSORS GP-A High Resolution 0.04% F.S.

Contextual Info: 1035 FIBER SENSORS High Accuracy Eddy Current Type Displacement Sensor GP-A SERIES Related Information •■General terms and conditions. F-17 ■■Glossary of terms. P.1397 ■■Sensor selection guide. P.967~

Contextual Info: Preliminary Data Sheet PT8R1202 Bluetooth Digital Audio Streaming IC |

through beam sensor circuit diagram

Abstract: blue ray laser diode LA-510 P-862 dc welding machine circuit diagram collimated LA-300 LA-511 DC-12 DC-13
Contextual Info: SERIES Laser Collimated Beam Sensor ‘Class 1’ Laser Beam Sensor Safe for Your Eyes Outer Diameter Measurement GP-A VI Displacement Sensing Image Sensor LD LA-300 LA Collimated Beam Sensors MEASUREMENT SENSORS LA Marked Conforming to EMC Directive Excluding LA-C1

GDM1202

Abstract: USB SPDIF IC china DVD player card circuit diagram USB stereo sound solution 24bit 192KHz bluetooth usb adapter block diagram gdm1002 block diagram bluetooth headphone charmilles d10 CVSD bluetooth qualcomm OSC
Contextual Info: Data Sheet PT8R1202 PT Pericom Technology Inc. Bluetooth Digital Audio Streaming IC |

GPB13

Abstract: GPB11
Contextual Info: Nu_EVB_001 Board User’s Manual Nu_EVB_001 Board Rev 2.0 User’s Manual The above information is the exclusive intellectual property of Nuvoton Technology and shall not be disclosed, distributed or reproduced without permission from Nuvoton 4/22/2010 -1-

BUK120

Abstract: BUK9575-100A buk220 BUK7608-40B BUK215-50Y car BUK117-50DL BUK7560-100A buk222 BUK221-50DY BUK7605-30A
Contextual Info: Semiconductors In-Vehicle Power Powering your in-vehicle applications Philips Semiconductors offers you a highly flexible approach to in-vehicle power design covering virtually every imaginable power application in the car. An in-depth understanding of automotive systems

LA-310

Abstract: la-a1p shock sensor amplifier input 12v about synchro sensor TRANSISTOR A1p DC-12 DC-13 EN50081-2 EN50082-2
Contextual Info: SERIES LED Collimated Beam Sensor LED Collimated Beam Type Which Is as Accurate as a Laser Sensor, but Much Safer. Outer Diameter Measurement Marked Conforming to EMC Directive Compact Size Safe Red LED Beam Simple Beam Alignment Its emitter and receiver are much smaller compared to those of the amplifier

PCN0708

Abstract: hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing encapsulant material changes on the ball-grid array BGA Pb-free packages assembled in Amkor Korea and