FBGA 63 Search Results

vr7pu

Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
Contextual Info: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module

SODIMM DDR3 Mechanical Dimensions

Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
Contextual Info: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

MT41K256M32

Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
Contextual Info: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA

FBGA 63

Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
Contextual Info: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)

224-PIN

Abstract: 224 J
Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 224 PIN PLASTIC BGA-224P-M03 224-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 18 Sealing method Plastic mold BGA-224P-M03 224-pin plastic FBGA (BGA-224P-M03) 16.00±0.10(.630±.004)SQ

MTFC4G

Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
Contextual Info: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)

HYMP512S64CP8-Y5

Abstract: HYMP564S64CP6-Y5 H5TQ1G63BFR-H9C h5ps2g83afr-s6c H5PS1G63EFR-Y5C H5TQ1G83BFR-H9C HYMP564S64CP6-C4 HY5PS121621Cfp-y5 H5PS1G63EFR-S5C HY5PS12821CFP-Y5
Contextual Info: Q3’2009 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43AFP-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43BFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C

m312l

Contextual Info: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM

Diode 224

Abstract: fujitsu BGA-224P 224-PIN
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 224 PIN PLASTIC To Top / Package Lineup / Package Index BGA-224P-M01 224-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 18 Sealing method Plastic mold BGA-224P-M01 224-pin plastic FBGA (BGA-224P-M01)

H5TQ2G63BFR-H9C

Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
Contextual Info: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9

Contextual Info: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004

M312L2920BG0-CCC

Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
Contextual Info: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM

MT41K512M16

Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
Contextual Info: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)

Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a

hynix module suffix

Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a

Contextual Info: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm

Contextual Info: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz

DDR266

Abstract: DDR266B DDR333 DDR400 DDR400B HYMD512M646D
Contextual Info: 200pin DDR SDRAM SO-DIMMs based on 512Mb D ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb D ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb D ver. based unbuffered

NAND sample code for stm32f2xx

Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
Contextual Info: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features • ■ FBGA FBGA Core: ARM 32-bit Cortex -M3 CPU 120 MHz

hynix module suffix

Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a

Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a

FBGA DDR3 x32

Abstract: MT41K256M32 MT41K256M16 MT41K256M3 MICRON fBGA package code
Contextual Info: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D

Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a