2010 - Not Available
Abstract: No abstract text available
Text: options for the DDR3 differential clocks. Option #1 (wider tracesâlower trace impedance ) ⢠Attempt , and Layout Design Considerations for DDR3 SDRAM Memory Interfaces This document provides general hardware and layout considerations and guidelines for hardware engineers implementing a DDR3 memory , Freescale Semiconductor, Inc. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. Contents DDR3 , . . . . . . . . . . . . . . . . . 16 DDR3 Designer Checklist 1 DDR3 Designer Checklist
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2011 - Design Guide for DDR3-1066
Abstract: DDR3 pcb layout DDR3 pcb layout guide DDR3 layout AN3940 DDR3 pcb layout guidelines DDR3 layout guidelines micron DDR3 pcb layout DDR3 udimm jedec DDR3 sdram pcb layout guidelines
Text: and spacings for the DDR3 data group. Option #1 (wider traces-lower trace impedance ) · Single-ended , DDR3 differential clocks. Option #1 (wider traces-lower trace impedance ) · Attempt to utilize wider , and Layout Design Considerations for DDR3 SDRAM Memory Interfaces by Networking and Multimedia , considerations and guidelines for hardware engineers implementing a DDR3 memory subsystem. The rules and , . 4. 5. 6. 7. 8. Contents DDR3 Designer Checklist . . . . . . . . . . . . . . . . . . . . . 2
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AN3940
Design Guide for DDR3-1066
DDR3 pcb layout
DDR3 pcb layout guide
DDR3 layout
AN3940
DDR3 pcb layout guidelines
DDR3 layout guidelines
micron DDR3 pcb layout
DDR3 udimm jedec
DDR3 sdram pcb layout guidelines
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2007 - "DDR3 SDRAM"
Abstract: ddr3 Designs guide DDR3 layout DDR3 layout guidelines DDR3 SDRAM Memory DDR3 timing diagram DDR3 phy Verilog DDR3 memory model ddr3 sdram stratix 4 controller DDR3 phy pin diagram
Text: on-die termination (ODT) selection and output driver impedance control. The high performance DDR3 SDRAM , DDR3 SDRAM memory. In this setup, the driver's ( DDR3 SDRAM memory) output impedance is set to 40 , reflection. Figure 17. Read Operation From DDR3 SDRAM Memory Using the Output Driver Impedance Control , Design Guidelines for Implementing DDR3 SDRAM Interfaces in Stratix III Devices Application Note 436 February 2007, v1.0 Introduction DDR3 SDRAM is the latest generation of DDR SDRAM
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2009 - Micron TN-47-01
Abstract: DDR3 pcb layout DDR3 pcb layout guide DDR3 phy DDR3 pcb layout guidelines DDR3 sodimm pcb layout "DDR3 SDRAM" DDR2 sdram pcb layout guidelines TN47-19 DDR3 layout
Text: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 Chapter 2. DDR3 , Guidelines Preliminary iv Comparing DDR3 and DDR2 . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . 22 Calibrated Output Impedance and ODT . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Termination for DDR3 SDRAM Unbuffered DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 DDR3
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2009 - DDR3 layout
Abstract: E0437E E0234E DDR3 timing diagram E0123N Elpida DDR3 users manual DDR3 DRAM layout ELPIDA DDR3 ELPIDA DDR manual DDR3 impedance
Text: SDRAM (COMPARISON OF MAIN SPECIFICATIONS OF DDR, DDR2, AND DDR3 ) 1.1.9 Output Driver Impedance (Ron , USER'S MANUAL New Features of DDR3 SDRAM Document No. E1503E10 (Ver.1.0) Date Published , using double data rate 3 synchronous DRAM ( DDR3 SDRAM). Readers of this manual are required to have , understanding of basic functions and usage of DDR3 SDRAM. Descriptions in this document are provided only for , data sheet. CONTENTS CHAPTER 1 FEATURES OF DDR3 SDRAM (COMPARISON OF MAIN SPECIFICATIONS OF
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E1503E10
M01E0706
DDR3 layout
E0437E
E0234E
DDR3 timing diagram
E0123N
Elpida DDR3 users manual
DDR3 DRAM layout
ELPIDA DDR3
ELPIDA DDR manual
DDR3 impedance
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2004 - ELPIDA DDR3
Abstract: "DDR3 SDRAM" Elpida EDJ1108BBSE DDR3 DIMM elpida ELPIDA ELPIDA mobile DDR DDR3 DDR3 pins ddr3 tsop ddr3 datasheet
Text: DDR3 SDRAM Feature Comparison of DDR3 , DDR2, and DDR SDRAM Items Data rate/pin CLK Freq. Power , ZQ pin /Reset pin DQ Driver impedance (Ron) DQ Driver calibration ODT function ODT calibration Dynamic ODT CLK-DQS De-skew mechanism Package DDR3 SDRAM 800/1066/1333/1600Mbps (400/533/667/800MHz , self-calibration in which DDR3 performs all the measurement and adjustment automatically.) 2. OCD (Off Chip Driver Calibration): Calibrate DRAM Ron over PVT. External device connected to DRAM performs impedance
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800/1066/1333/1600Mbps
400/533/667/800MHz)
400/533/667/800Mbps
200/266/333/400MHz)
DDR3-1600/1333
EBJ21UE8BASA-AE-E
DDR3-1066)
EBJ21UE8BASA-8C-E
DDR3-800)
EBJ11UE6BASA-AE-E
ELPIDA DDR3
"DDR3 SDRAM"
Elpida EDJ1108BBSE
DDR3 DIMM elpida
ELPIDA
ELPIDA mobile DDR
DDR3
DDR3 pins
ddr3 tsop
ddr3 datasheet
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2010 - DDR3 pcb layout guidelines
Abstract: DDR3 pcb layout guide AN3940 Design Guide for DDR3-1066 DDR3 pcb layout DDR3 layout DDR3 sdram pcb layout guidelines micron ddr3 hardware design consideration DDR3 x16 rank pcb layout DDR3 pcb layout motherboard
Text: and Layout Design Considerations for DDR3 SDRAM Memory Interfaces by Networking and Multimedia , note apply to products that leverage the DDR3 SDRAM IP core, and they are based on a compilation of , check it off in the rightmost column of Table 1. Table 1. DDR3 Designer's Checklist Item , used, have data lanes been isolated from the other DDR3 signal groups? Note: Because on-die termination is the preferred method for DDR3 data signals, external resistors for the data group should not
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AN3940
DDR3 pcb layout guidelines
DDR3 pcb layout guide
AN3940
Design Guide for DDR3-1066
DDR3 pcb layout
DDR3 layout
DDR3 sdram pcb layout guidelines
micron ddr3 hardware design consideration
DDR3 x16 rank pcb layout
DDR3 pcb layout motherboard
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2008 - IDSH1G-02A1F1C-13H
Abstract: DDR3-1600H DDR3-1600G IDSH1G-04A1F1C-13G
Text: DDR3 SDRAM EU RoHS Compliant Products Advance Internet Data Sheet Rev. 0.65 Advance Internet , , Address and Control Signals" on Page 28 Changed CIO for DDR3 -1066 to 2.7 pF in chapter 3.8 Added errata data sheet Added output drive impedance of 40 Ohm Updated output slew rates Updated IDD tables Previous , Control Signals" on Page 28 Changed CIO for DDR3 -1066 to 2.7 pF in chapter 3.8 Previous Revision: Rev , ( DDR3 ) SDRAM component product family and describes its main characteristics. 1.1 Features ·
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02A1F1C
03A1F1C
04A1F1C
-000B
IDSH1G-02A1F1C-13H
DDR3-1600H
DDR3-1600G
IDSH1G-04A1F1C-13G
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2008 - Not Available
Abstract: No abstract text available
Text: H7 - I9 - J11 - K13 DDR3 -800 DDR3 -1066 DDR3 -1333 DDR3 -1600 DDR3 -1866 Clock , function SRT range : Normal/extended - - - Programmable Output driver impedance control , : G0240 TEMPERATURE 128Mx16, 8K : G0216 BLANK: 256Mx8, 8K : G0280 73 : DDR3 1Gx4, 8K , : RoHS-compliant and Halogen-Free 4Gb DDR3 SDRAM Addressing Configuration 256Mb x 16 # of Bank 8 , termination resistance internal to the DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and
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V73CBG04168RA
32Mbit
DDR3-800
DDR3-1066
DDR3-1333
DDR3-1600
DDR3-1866
tCK10,
tCK11,
V73CBG04168RA
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2013 - DDR3 SDRAM micron
Abstract: micron technology 2013 DDR3 impedance QuadDie DDR3
Text: Impedance It is imperative that the DDR3 SDRAM device's temperature specifications, shown in the following , Preliminary 16Gb: x4, x8 QuadDie DDR3 SDRAM Features QuadDie DDR3 SDRAM MT41J4G4 128 Meg x , °C: 8192 refresh cycles in 32ms Description The 16Gb QuadDie DDR3 SDRAM uses Micron's 4Gb DDR3 die and has , (Pb-free) 78-ball FBGA (9.5mm x 11.5mm x 1.45mm) · Timing cycle time1 1.25ns @ CL = 11 ( DDR3 -1600) 1.5ns @ CL = 9 ( DDR3 -1333) 1.87ns @ CL = 7 ( DDR3 -1066) · Self refresh Standard · Operating
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MT41J4G4
MT41J2G8
SAC305
09005aef850f7993
DDR3 SDRAM micron
micron technology 2013
DDR3 impedance
QuadDie DDR3
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2010 - socket lga 1156 pinout
Abstract: Socket 1156 VID pinout intel core i3 MOTHERBOARD CIRCUIT diagram DDR3 memory CATERR Catastrophic Error Intel 3400 LGA 1156 PIN diagram LGA 1156 PIN OUT diagram i3 desktop MOTHERBOARD CIRCUIT diagram Procesor pentium II register organization
Text: .20 DDR3 System Memory Timing Support , . 79 DDR3 Signal Group DC Specifications , Graphics (PEG) PCI Express* 1x16 OR Processor 2C hannels (2 UDIMM/C hannel) DDR3 DIMMs PCI Express* 2x 8 DDR3 DIMMs Note: Supported PCI Express configurations vary by processor and SKU , Support System memory features include: · One or two channels of unbuffered DDR3 memory with a maximum of
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i5-600,
i3-500
G6950
socket lga 1156 pinout
Socket 1156 VID pinout
intel core i3 MOTHERBOARD CIRCUIT diagram
DDR3 memory
CATERR Catastrophic Error
Intel 3400
LGA 1156 PIN diagram
LGA 1156 PIN OUT diagram
i3 desktop MOTHERBOARD CIRCUIT diagram
Procesor pentium II register organization
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2010 - Not Available
Abstract: No abstract text available
Text: . 19 DDR3 System Memory Timing Support , DDR3 Signal Group DC Specifications , Platform Diagram Discrete Graphics (PEG) PCI Express* 2x 8 Processor DDR3 DIMMs 2 Channels (2 UDIMM/Channel) DDR3 DIMMs DMI PECI Serial ATA Intel® Management Engine USB 2.0 , DDR3 memory with a maximum of two UDIMMs per channel ⢠Single- and dual-channel memory organization
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2008 - Not Available
Abstract: No abstract text available
Text: BANKS X 8Mbit X 16 - G6 - H7 - I9 - J11 - K13 DDR3 -800 DDR3 -1066 DDR3 -1333 DDR3 -1600 DDR3 -1866 Clock Cycle Time ( tCK5, CWL=5 ) 3.0ns 3.0ns 3.0ns 3.0ns 3.0ns Clock , /extended Programmable Output driver impedance control - - Device Usage Chart Operating , : G0240 TEMPERATURE 128Mx16, 8K : G0216 BLANK: 256Mx8, 8K : G0280 73 : DDR3 1Gx4, 8K , : RoHS-compliant and Halogen-Free 1Gb DDR3 SDRAM Addressing Configuration 128Mb x 8 64Mb x 16 8 8
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V73CBG01
16Mbit
DDR3-800
DDR3-1066
DDR3-1333
DDR3-1600
DDR3-1866
tCK10,
tCK11,
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2008 - IDSH1G-02A1F1C-13H
Abstract: IDSH1G-04A1F1C-13G
Text: DDR3 SDRAM RoHS Compliant Products Advance Internet Data Sheet Rev. 0.62 Advance Internet , Overview This chapter gives an overview of the Double-Data-Rate-Three ( DDR3 ) SDRAM component product , mm ball pitch The DDR3 SDRAM offers the following key features: · 1.5 V ± 0.075 V supply voltage , all possible products within the 1-Gbit DDR3 SDRAM first component generation. Availability depends on , 6-6-6 6-6-6 7-7-7 8-8-8 8-8-8 9-9-9 10-10-10 Supported CAS latencies Speed Sort Name DDR3 -800D DDR3
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02A1F1C
03A1F1C
04A1F1C
IDSH1G-03A1F1C-16H,
IDSH1G-03A1F1C-16J,
IDSH1G-03A1F1C-16K,
IDSH1G03A1F1C-16G
IDSH1G-02A1F1C-13H
IDSH1G-04A1F1C-13G
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2012 - Not Available
Abstract: No abstract text available
Text: pitch thermally enhanced, impedance matched, integrated packaging C DDR3 L9D31G16BG1 , integrated, impedance matched packaging thermally enhanced packaging DDR3 L9D3256M72SBG2 , Integrated Memory Modules L9D232MxxSBG5 L9D264MxxSBG5 DDR3 Integrated Memory Modules L9D3512M16BG1 , Incorporated Product Type 9D = DDR 2 = DDR2 3 = DDR3 Words 32M = 32 MB 64M = 64 MB 128M = 128 , 256M x 80 Single Channel 1866 Mbs 4Mb x 5 DDR3 L9D3256M32DBG2 L9D31G16BG1 16.0 Gb 256M
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L9D232MxxSBG5
L9D264MxxSBG5
L9D3512M16BG1
L9D31G16BG1
L9D364M64SBG2
L9D3256M32DBG2
L9D3512M32DBG2
L9D3256M72SBG2
L9D3256M80SBG2
L7C108Y/D;
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2008 - Not Available
Abstract: No abstract text available
Text: June 2008 IDSH1G02A1F1C IDSH1G03A1F1C IDSH1G04A1F1C 1-Gbit Double-Data-Rate-Three SDRAM DDR3 , , Address and Control Signals" on Page 27 Changed CIO for DDR3 -1066 to 2.7 pF in chapter 3.13 Added errata data sheet Added output drive impedance of 40 Ohm Updated output slew rates Updated IDD tables Previous , overview of the Double-Data-Rate-Three ( DDR3 ) SDRAM component product family and describes its main , packages: 96 ball (PG-TFBGA-84) for ×16 components, 0.8 × 0.8 mm ball pitch The DDR3 SDRAM offers the
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02A1F1C
03A1F1C
04A1F1C
DDR3-1066
2008ce.
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2012 - NT5CB1024M4BN-DI
Abstract: DDR2 module Dimensions NT5CC256
Text: / NT5CC256M16BP 4. The DDR3 (L) DRAM will keep its on-die termination in high impedance state as long as is , The output driver impedance of the DDR3 (L) SDRAM device is selected by MR1 (bit A1 and A5) as shown in , 4Gb DDR3 SDRAM B-Die NT5CB1024M4BN / NT5CB512M8BN / NT5CB256M16BP NT5CC1024M4BN / NT5CC512M8BN , -bit prefetch architecture Output Driver Impedance Control Differential bidirectional data strobe Internal(self , -Ball BGA for x16 components 1 REV 1.0 01/ 2012 4Gb DDR3 SDRAM B-Die NT5CB1024M4BN
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NT5CB1024M4BN
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NT5CC1024M4BN
NT5CC512M8BN
NT5CC256M16BP
NT5CB1024M4BN-DI
DDR2 module Dimensions
NT5CC256
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2011 - NT5CB256M8DN
Abstract: NT5CB256m tl 555 c "2Gb DDR3 SDRAM" NT5CB256M8 NT5CB256 NT5CC256M8 NT5CC256
Text: . Output Driver Impedance Control The output driver impedance of the DDR3 SDRAM device is selected by MR1 , 2Gb DDR3 SDRAM D-Die NT5CB512M4DN / NT5CB256M8DN NT5CC512M4DN / NT5CC256M8DN Feature 1.5V ± 0.075V / 1.35V -0.0675V/+0.1V (JEDEC Output Driver Impedance Control Write Leveling OCD , 78-Ball BGA for x4 & x8 components Description The 2Gb Double-Data-Rate-3 ( DDR3 ) DRAMs is a , applications. The chip is designed to comply with all key DDR3 DRAM key features and all of the control and
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NT5CB512M4DN
NT5CB256M8DN
NT5CC512M4DN
NT5CC256M8DN
78-Ball
Rate32dex
78Balls
NT5CB256m
tl 555 c
"2Gb DDR3 SDRAM"
NT5CB256M8
NT5CB256
NT5CC256M8
NT5CC256
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2012 - NT5CB256M16BP
Abstract: NT5CC256 NT5CB512M8BN-DI NT5CB256M16BP-DI NT5CC1024M4BN-CG NT5CB256M16BP-CG
Text: / NT5CC256M16BP 4. The DDR3 (L) DRAM will keep its on-die termination in high impedance state as long as is , The output driver impedance of the DDR3 (L) SDRAM device is selected by MR1 (bit A1 and A5) as shown in , 4Gb DDR3 SDRAM B-Die NT5CB1024M4BN / NT5CB512M8BN / NT5CB256M16BP NT5CC1024M4BN / NT5CC512M8BN , -bit prefetch architecture Output Driver Impedance Control Differential bidirectional data strobe Internal(self , -Ball BGA for x16 components 1 REV 1.0 01/ 2012 4Gb DDR3 SDRAM B-Die NT5CB1024M4BN
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NT5CB1024M4BN
NT5CB512M8BN
NT5CB256M16BP
NT5CC1024M4BN
NT5CC512M8BN
NT5CC256M16BP
NT5CC256
NT5CB512M8BN-DI
NT5CB256M16BP-DI
NT5CC1024M4BN-CG
NT5CB256M16BP-CG
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2013 - Not Available
Abstract: No abstract text available
Text: driver impedance of the DDR3 /L SDRAM device is selected by MR1 (bit A1 and A5) as shown in MR1 definition , 1Gb DDR3 F-die SDRAM NT5CB128M8FN / NT5CB64M16FP NT5CC128M8FN / NT5CC64M16FP Feature ï¬ ï , -bit prefetch architecture - DHI ï¬ Output Driver Impedance Control REV 1.1 02/2013 1 1Gb DDR3 F-die SDRAM NT5CB128M8FN / NT5CB64M16FP NT5CC128M8FN / NT5CC64M16FP Table 1: CAS Latency Frequency -DH/DHI* -FK* DDR3 /L-1600 DDR3 -1866 DDR3 -2133 CL10 Speed Bins -EK* CL13
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NT5CB128M8FN
NT5CB64M16FP
NT5CC128M8FN
NT5CC64M16FP
x8/x16
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2010 - DDR3 pcb layout
Abstract: DDR2 sdram pcb layout guidelines DDR2 pcb layout DDR3 pcb layout guide DDR3 jedec DDR3 sodimm pcb layout dimm pcb layout JESD8-15A DDR3 DIMM 240 pin names DDR3 layout
Text: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Chapter 2. DDR3 , Guidelines Preliminary iv Comparing DDR3 and DDR2 . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . 22 Calibrated Output Impedance and ODT . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Termination for DDR3 SDRAM Unbuffered DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 DDR3
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2008 - IDSH51
Abstract: No abstract text available
Text: DDR3 SDRAM RoHS Compliant Products Advance Internet Data Sheet Rev. 0.92 Advance Internet , gives an overview of the 512-Mbit Double-Data-Rate-Three ( DDR3 ) SDRAM component product family and , ×8 components; 96 ball (PG-TFBGA-96) for ×16 components, 0.8 × 0.8 mm ball pitch The 512Mbit DDR3 , -Mbit Double-Data-Rate-Three SDRAM 1.2 Product List Table 1 shows all possible products within the 512 Mbit DDR3 SDRAM , nomenclature see Chapter 6. TABLE 1 Ordering Information for 512 Mbit DDR3 Components QAG Part Number Max
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IDSH51
02A1F1C
03A1F1C
04A1F1C
512-Mbit
mpth0535
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2010 - MSC8156
Abstract: DDR3 timing MSC8156 datasheet MT41J64M16BLA-15E MICRON ddr3 MT41J64M16 MT41J64M16 S25FL128P DDR3 layout 0x01801 RGMII MSC8156
Text: impedance SERDES C Power - Low impedance SERDES P Power - Low impedance VDDDD 1.5V DDR3 , . . . . . . . . . . . . . . . . . . . .7 3.3. MSC8156 DDR-3 . . . . . . . . . . . . . . . . . . . . , populated with the MSC8156 and DDR3 memory. All active interfaces, such as SRIO, Ethernet, control , interface (×4) connected to the HSC - 2× RGMII interfaces connected to the HSC - 2× DDR3 interfaces each with 512 Mbytes of 64-bit DDR3 memory - I2C interface for boot connected to the HSC - UART
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MSC8156MDDS
MSC8156
DDR3 timing
MSC8156 datasheet
MT41J64M16BLA-15E
MICRON ddr3 MT41J64M16
MT41J64M16
S25FL128P
DDR3 layout
0x01801
RGMII MSC8156
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2011 - intel core i3 MOTHERBOARD CIRCUIT diagram
Abstract: i354 socket lga 1156 pinout lga 1156 MSI G31 Motherboard LGA 1156 PIN OUT diagram LGA 1156 Socket diagram socket lga 1156 CATERR Catastrophic Error 1155 PINmap
Text: .20 DDR3 System Memory Timing Support , Transient DDR3 Signal , ) PCI Express* 1x16 OR Processor 2C hannels (2 UDIMM/C hannel) DDR3 DIMMs PCI Express* 2x 8 DDR3 DIMMs Note: Supported PCI Express configurations vary by processor and SKU. Intel® Flexible , Support System memory features include: · One or two channels of unbuffered DDR3 memory with a maximum of
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i5-600,
i3-500
intel core i3 MOTHERBOARD CIRCUIT diagram
i354
socket lga 1156 pinout
lga 1156
MSI G31 Motherboard
LGA 1156 PIN OUT diagram
LGA 1156 Socket diagram
socket lga 1156
CATERR Catastrophic Error
1155 PINmap
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2010 - socket lga 1156 pinout
Abstract: LGA 1156 Socket diagram intel core i3 MOTHERBOARD CIRCUIT diagram Procesor pentium II register organization LGA 1155 PIN diagram LGA 1155 Socket PIN diagram socket lga 1156 1155 PINmap CATERR Socket 1156 VID pinout
Text: . 20 DDR3 System Memory Timing Support , 78 DDR3 Signal Group DC Specifications , ) DDR3 DIMMs PCI Express* 2x 8 DDR3 DIMMs Note: Supported PCI Express configurations vary by , unbuffered DDR3 memory with a maximum of two UDIMMs per channel · Single- and dual-channel memory organization modes · Data burst length of eight for all memory organization modes · Memory DDR3 data transfer
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i5-600,
i3-500
G6950
socket lga 1156 pinout
LGA 1156 Socket diagram
intel core i3 MOTHERBOARD CIRCUIT diagram
Procesor pentium II register organization
LGA 1155 PIN diagram
LGA 1155 Socket PIN diagram
socket lga 1156
1155 PINmap
CATERR
Socket 1156 VID pinout
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