nokia mobile battery
Abstract: nokia charger technophone nokia mobile charger nokia 700 antenna
Contextual Info: e Cellular, S M R . Data 800/900 M H z Retail pack R F power cord, battery R F power cord, battery eliminator/charger eliminator/charger w/antenna for Nokia 232, w/antenna for Nokia 232, A T & T 3850, Radio antenna for Nokia 232, A T & T 3850, Radio Shack
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ct352gp0009gp0005gp0023+8gpq025rg174rg-174nokia mobile batterynokia chargertechnophonenokia mobile chargernokia 700 antenna
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SM 630 finger print module
Abstract: ADP3208J RTS5158E SE330U2VDM-L-GP USB232 WPCE776 BQ24740 CT3528 ADP3208 EMC2102-DZK-GP
Contextual Info: A B C D SYSTEM DC/DC LZ2 Block Diagram 4 E Project code: PCB P/N Revision : : INPUTS Penryn SV 35W 3 5V_S5 3D3V_S5 EMC2102 DDR2 socket PCB 8-LAYER STACKUP INPUTS 15 DCBATOUT 1D8V_S3 667/800/1066MHz@1.05V GND R.G.B DDR2 socket 3 TPS51100 APL5912 1D8V_S3 APL5912
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4k1014j301tps51120emc2102+15tps51124667/800/1066mhztps51100667/800mhzapl5912sm 630 finger print moduleadp3208jrts5158ese330u2vdm-l-gpusb232wpce776bq24740ct3528adp3208emc2102-dzk-gp
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rb40 bridge
Abstract: TPT50 RB152 RT113 rt842 RTL8101L cb311 bridge rb60 Socket AM2 micro-star
Contextual Info: 5 4 3 2 1 SYS POWER MS1022 BLOCK DIAGRAM Rev. 0A Dothan SOCKET 479 478 uFCPGA PAGE 3,4,5 D CHARGER VRAM DC JACK & SELECTOR +1.1/1.25V VGA Power +1.2V PCI-E Power HOST BUS PAGE 44 , 45 , 46 PAGE 33 FSB 400 / 533 MHz PAGE 34 +1.5V +1.8VDDRM SMDDR_VTERM OZ816
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ms1022oz816sc1470lm1117mpx-adj+16sc1403max1907nv44m915pm14mhzfmt11rb40 bridgetpt50rb152rt113rt842rtl8101lcb311bridge rb60socket am2micro-star
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ultra FAST DMOS FET Switches
Abstract: 60659 B3520 B3520K4 B3540 B3540K4-XX CT-3520
Contextual Info: Bay Linear Inspire the Linear Power B3520/B3540 N-CHANNEL DMOS FET SWITCH High Gain Level Shifter Series Description Features The B3520 series consists of enhancement-mode MOSFETs designed for high speed low-glitch switching in audio, video, and high-frequency wireless
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b3520/b3540b3520ct3520ultra fast dmos fet switches+560659b3520k4b3540b3540k4-xxct-3520
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nokia 2110
Abstract: technophone
Contextual Info: Wir M A R G IN A L P E R F O R M A N C E PORTABLE PHONES BY THEMSELVES AREN’T ENOUGH! Larsen Electronics understands the unique difficulties portable cellular phone users face in their day-to-day lives. Too few cell sites, topography changes and underpowered phones all contribute to poor reception,
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gp0001232/atct352pcs15+7gpo002gp0003gp0016gp0017gp0q19nokia 2110technophone
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SJV50
Abstract: wpce773 G9091-330T11U-GP winbond WPCE773 G7922R61U N10M-GE1 WISTRON power sequence M08B1 DT2 UMA isl88731
Contextual Info: 5 D 4 3 2 1 SYSTEM DC/DC Project code: 91.4BU01.001 PCB P/N : 48.4BU01.0SB REVISION : 08244-SB SJV50 Block Diagram CLK GEN. ISL62392 INPUTS 41 OUTPUTS 5V_S5 6A DCBATOUT 3D3V_S5(7A) 5V_AUX_S5 3D3V_AUX_S5 GMT Mobile CPU G7922R61U Penryn ICS9LPRS365B 33 3 VRAM
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sjv50ics9lprs365b4bu0108244-sb+13isl62392g7922r61utps51124512mb667/800/1066mhzwpce773g9091-330t11u-gpwinbond wpce773n10m-ge1wistron power sequencem08b1dt2 umaisl88731
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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W574
Abstract: TFK 840 mag mount cellular antenna dual band blade antenna block diagram for amateur radio WR 137 antenna NMO470C WD30S WKG144 WT63
Contextual Info: When selecting a mobile antenna, there ate a number of factors to take into consideration that significantly effect the ultimate performance of the antenna Gain requirements, electrical type, ground plane availability vs. requirements, placement on vehicle temporaiyvs, permanent mounting,
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rb58/umaxhei68tw574tfk 840+8mag mount cellular antennadual band blade antennablock diagram for amateur radiowr 137 antennanmo470cwd30swkg144wt63
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CT3523
Contextual Info: H I G H P O W E R C H I P T E R M I N A T I O N S EMC's high power chip terminations are optimized for RF performance. Since most types are printed to value, the variability of capacitive reactance and localized hot spots associated with trimming are eliminated. Reduced lot variation
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smt3737smt3725smt2525smt2010+1ct3523
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ALC882H
Abstract: bridge rb60 PCB17 rb40 bridge CT198 ct511 CT-431 CT417 NVIDIA GPU RT247
Contextual Info: 4 3 Dothan SOCKET 479 478 uFCPGA DC JACK & SELECTOR CHARGER PAGE 3,4,5 VRAM 4M * 32 * 2 PAGE 33 PAGE 34 HOST BUS PAGE 44 , 45 , 46 FSB 400 / 533 MHz +1.1/1.25V (1.05V)VTT NVVDD +1.8VDDRM VGA Power SC1470 SMDDR_VTERM ( +1.2V ) +1.8VRUN PCI-E Power OZ813 APL5912
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ina 124
Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Contextual Info: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz
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42tvar0300hr0500ts0300+12ts0300wts0400ts0500ts0500w1ts0500wts0500wb1ina 124ct2525alnberyllium oxidect2335smt3725alnsc0066m
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ATI SB450
Abstract: max8736 XC-01 CI853 U113D CI846 ic max8736 ati sb400 ATI RC410ME MS-1412
Contextual Info: 5 4 3 2 1 +3V +5V MS-1412 VER:2.0 Intel Yonha CPU+ ATi RC410ME&SB450 Chipset D C 01:BLOCK DIAGRAM 02:PLATFORM 03:Yonah-1 CPU HOST BUS 04:Yonah-2 CPU (POWER/GND) 05:Yonah-3 06:RC410ME(HOST) 07:RC410ME(DDR) 08:RC410ME(VIDEO/PCI-E) 09:RC410ME(POWER/STRAPS)
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max8736
Abstract: CI846 CI853 CT360 CI845 CI847 ATI SB450 U113D CT349 CI855
Contextual Info: 5 4 3 2 1 +3V +5V MS-1412 VER:1.1 Intel Yonha CPU+ ATi RC410ME&SB450 Chipset D C 01:BLOCK DIAGRAM 02:PLATFORM 03:Yonah-1 CPU HOST BUS 04:Yonah-2 CPU (POWER/GND) 05:Yonah-3 06:RC410ME(HOST) 07:RC410ME(DDR) 08:RC410ME(VIDEO/PCI-E) 09:RC410ME(POWER/STRAPS)
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G9091-330T11U-GP
Abstract: DT2 UMA M08B1 winbond WPCE773 SCD1U10V2KX-5GP nvidia MXM gt6 RT137 WPCE773 CB235 G7922R61U
Contextual Info: 5 D 4 3 2 1 SYSTEM DC/DC Project code: 91.4BU01.001 PCB P/N : 48.4BU01.0SB REVISION : 08244-SB SJV50 Block Diagram CLK GEN. 41 ISL62392 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(7A) DCBATOUT 5V_AUX_S5 3D3V_AUX_S5 Mobile CPU 33 3 512MB HOST BUS DDR2 57,58 HDMI 667/800/1066MHz@1.05V
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CT-1005
Abstract: g 0247 0372
Contextual Info: lin T u l litologi/ Chips - Standard Term inations S election Table Power W Substrate Frequency Max. Avg. (GHz) VSWR Type 2 5 5 10 15 15 15 15 20 20 20 40 50 80 85 100 120 120 150 150 150 250 * BeO Alumina AIN BeO BeO AIN BeO AIN BeO AIN Alumina AIN BeO
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max8736
Abstract: CI846 CI867 CI-8348 SAMA5 ct305 CI845 foxconn CI854 ICS951413CGLFT
Contextual Info: 5 4 3 2 1 +3V +5V MS1024 EVT VER:0.B Intel Yonha CPU+ ATi RC410ME&SB450 Chipset D C 01:BLOCK DIAGRAM 02:PLATFORM 03:Yonah-1 CPU HOST BUS 04:Yonah-2 CPU (POWER/GND) 05:Yonah-3 06:RC410ME(HOST) 07:RC410ME(DDR) 08:RC410ME(VIDEO/PCI-E) 09:RC410ME(POWER/STRAPS)
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SE330U2VDM-L-GP
Abstract: SM 630 finger print module RTS5158E RT9025-25PSP-GP CT3528 alc269 r305 finger print module EMC2102-DZK-GP ADP3208 BQ24740
Contextual Info: A B C D SYSTEM DC/DC LZ2 Block Diagram 4 E Project code: PCB P/N Revision : : 91.4K101.001 ZY LZ2 91.4J301.001 XR LX2 07260-SB SA Mobile CPU CLK GEN. 3 PCB 8-LAYER STACKUP DDR3 socket CRT OUTPUTS DCBATOUT TPS51100 S 18 38 DDR_VREF_S0 1D5V_S3 1.5A PWR DDR_VREF_S3
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BC560
Abstract: bc337 pin out diagram SB315 CT3528 PHD3055 foxconn LS 36 usb YUHINA 78105 diode sb315 C2362
Contextual Info: A B C D E 2003/01/07 Clock Gen CY28409 3 Speed Step High 58 4 DDR-SDRAM K4D263238E-GC36 1M*32bit*4banks 16MB *4 19,20 Intel Desktop P4 Membership Frank John Summer Felix CRT CONN Project Code : 91.41I01.001 M/B:48.41I01.0SA (04201-SB) 21 3.06GHz 4,5 FSB
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cy2840906ghzk4d263238e-gc3632bit+1341i0104201-sb266mhzbc560bc337 pin out diagramsb315ct3528phd3055foxconn ls 36 usbyuhina78105diode sb315c2362
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RTL8101L
Abstract: PCB14 SAMA5 SC1470 PCB17 CT319 Socket AM2 RB-155 micro-star CB255
Contextual Info: 5 4 3 2 1 SYS POWER MS1022 BLOCK DIAGRAM Rev. 0B Dothan SOCKET 479 478 uFCPGA PAGE 3,4,5 D CHARGER VRAM DC JACK & SELECTOR +1.1/1.25V VGA Power +1.2V PCI-E Power HOST BUS PAGE 44 , 45 , 46 PAGE 33 FSB 400 / 533 MHz PAGE 34 +1.5V +1.8VDDRM SMDDR_VTERM OZ816
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ALC882H
Abstract: CT319 medion RT-53 NVIDIA GPU CB140 SAMA5 RTL8101L RT105 CT71
Contextual Info: 5 4 3 Dothan SOCKET 479 478 uFCPGA DC JACK & SELECTOR CHARGER PAGE 3,4,5 VRAM 4M * 32 * 2 PAGE 33 PAGE 34 HOST BUS PAGE 44 , 45 , 46 FSB 400 / 533 MHz +1.1/1.25V (1.05V)VTT NVVDD +1.8VDDRM VGA Power SC1470 SMDDR_VTERM ( +1.2V ) +1.8VRUN PCI-E Power OZ813
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CT2525ALN
Abstract: CT3523 CT2010A
Contextual Info: Chips – Standard Terminations EMC’s high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability of capacitive reactance. Localized hot spots associated with trimming have been eliminated. Reduced
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