SMT3737 Search Results

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737F DESCRIPTION: SURFACE MOUNT TERMINATION, BERYLLIA, LEAD FREE PLATING. ASSEMBLY DWG: 1101954 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737A DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM ALUMINA ASSEMBLY DWG: 1101714 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC – 2.5 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737 DESCRIPTION: SURFACE MOUNT TERMINATION, BERYLLIA ASSEMBLY DWG: 1101234 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX. 1.1.4

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737ALNF DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM, LEAD FREE ASSEMBLY DWG: 1102044 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

SMT3737TALNF

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737TALNF DESCRIPTION: SURFACE MOUNT TERMINATION, TUNED FOR TELECOM BAND, LEAD FREE ASSEMBLY DWG: 1102054 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: 800 MHZ – 2700 MHZ.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737TALN DESCRIPTION: SURFACE MOUNT TERMINATION, TUNED FOR TELECOM BAND ASSEMBLY DWG: 1101594 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: 800 MHZ – 2700 MHZ.

SMT3737A

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737A DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM ALUMINA ASSEMBLY DWG: 1101714 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC – 2.5 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

SMT3737

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737 DESCRIPTION: SURFACE MOUNT TERMINATION, BERYLLIA ASSEMBLY DWG: 1101234 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX. 1.1.4

SMT3737ALN

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737ALN DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM ASSEMBLY DWG: 1101494 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737S DESCRIPTION: SURFACE MOUNT TERMINATION, BERYLLIA ASSEMBLY DWG: 1101944 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX. 1.1.4

SMT3737TALN

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737TALN DESCRIPTION: SURFACE MOUNT TERMINATION, TUNED FOR TELECOM BAND ASSEMBLY DWG: 1101594 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: 800 MHZ – 2700 MHZ.

09-F0852

Abstract: SMT3737TALNF
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737TALNF DESCRIPTION: SURFACE MOUNT TERMINATION, TUNED FOR TELECOM BAND, LEAD FREE ASSEMBLY DWG: 1102054 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: 800 MHZ – 2700 MHZ.

SMT3737ALNF

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737ALNF DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM, LEAD FREE ASSEMBLY DWG: 1102044 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: SMT3737ALN DESCRIPTION: SURFACE MOUNT TERMINATION, THICK FILM ASSEMBLY DWG: 1101494 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.35:1 MAX.

SMT2525

Abstract: SMT3725
Contextual Info: TERMINATIONS AND RESISTORS The EMC Difference: Using the patented asymmetrical wrap geometry U.S. Patent # 5739743 , the thermal dissipation of the surface mount terminations are improved by increasing their solderable terminal area. This eliminates the need

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

CT3523

Contextual Info: H I G H P O W E R C H I P T E R M I N A T I O N S EMC's high power chip terminations are optimized for RF performance. Since most types are printed to value, the variability of capacitive reactance and localized hot spots associated with trimming are eliminated. Reduced lot variation

MTVA0300N07

Abstract: MTVA0300
Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

Contextual Info: TERMINATIONS AND RESISTORS ^ Using The patented asymmetrical wrap geometry iU.5. Patent # 5739743 , the thermal a ssipation ot the surface mount terminations are improved by increasing their solderable terminal area This eliminates the need for bolt down heat sinks and tabs, recucing assembly costs

trm a55

Contextual Info: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-­Flex Lab-­Flex® S Lab-­Flex® AF Semi-­Rigid, Conformable & Flexible Semi-­Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV

smt2010aln

Abstract: SMT2010TALN SMT2010A SMT2525 0372
Contextual Info: im Technobgi/ S urface M ount Term inations Using EMC's patented asymmetrical wrap geometry U.S. Patent # 5,739,743 , the thermal dissipation o f the surface mount terminations is improved by increasing the solderable terminal area. This eliminates the need for bolt