TS0500W Search Results

TS0502W3s

Abstract: TS0505W3S TS05XXW3S TS0500W3S TS0514W3 TS0503W3S 755W002 TS0501W3S ts0505 TS0518
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS05W3S-DKIT DESCRIPTION: TS05XXW3S CHIP ATTENUATOR DESIGN KIT. 1 EMC CATALOG 25 PCS TS0500W3S 25 PCS TS0504W3S 25 PCS TS0508W3S 25 PCS TS0514W3S 25 PCS TS0501W3S 25 PCS TS0505W3S 25 PCS TS0509W3S 25 PCS TS0516W3S

TS0500W3S

Abstract: 10DB DC-18GHZ MIL-R-55342
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING TS0500W3S KIT PART IDENTIFIER: DESCRIPTION: ASSEMBLY DWG: 1.0 CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

10DB

Abstract: DC-18GHZ MIL-R-55342 TS0500W3
Contextual Info: TITLE: PART IDENTIFIER: SPECIFICATION CONTROL DRAWING TS0500W3 KIT DESCRIPTION: CHIP: ASSEMBLY DWG: 1.0 ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

10DB

Abstract: DC-18GHZ MIL-R-55342
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: DESCRIPTION: CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: 1.0 TS0500WB1 KIT N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

TS0500W3

Contextual Info: TS0500W3 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 5.05 Frequency (GHz) 10.05 12.4 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 5.05 Frequency (GHz) 10.05 12.4 S(1,1) 25C Swp Max 12.4GHz 2. 0. 6 0.8 1.0

Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

Contextual Info: THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film element on an alumina ceramic substrate with solderable terminals in two sizes. The larger TS03XX Series operates to 12.4 GHz and the

Contextual Info: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

d8693

Abstract: RYT Circulators amf-3d-008019.1 miteq amf-3f x-band waveguide isolators ps223 TS0303W3 JSD00114 H-BEND
Contextual Info: AST Lagerliste 2010 solange r u n f u a Verk icht! Vorrat re Hohlleiter- und Koaxialbauteile, vom Diplexer bis zu Leistungsverstärker, passive Bauteile wie z.B. Leistungswiderständen oder Dämpfungsglieder, und Kabel bis zu 65 GHz werden mit weit über 50% Preisnachlass angeboten.

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

ina 124

Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Contextual Info: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz

TS05XXW3

Abstract: TS0500 marking code wb1 TS05XX ts0506 TS0507 EMC TS-050
Contextual Info: ATTENUATORS THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film Impedance: 50 Q element on an alumina ceramic substrate with solderable terminals Operating Temperature: -55°C to +150°C