TS0500 Search Results

TS0502W3s

Abstract: TS0505W3S TS05XXW3S TS0500W3S TS0514W3 TS0503W3S 755W002 TS0501W3S ts0505 TS0518
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS05W3S-DKIT DESCRIPTION: TS05XXW3S CHIP ATTENUATOR DESIGN KIT. 1 EMC CATALOG 25 PCS TS0500W3S 25 PCS TS0504W3S 25 PCS TS0508W3S 25 PCS TS0514W3S 25 PCS TS0501W3S 25 PCS TS0505W3S 25 PCS TS0509W3S 25 PCS TS0516W3S

TS0500W3S

Abstract: 10DB DC-18GHZ MIL-R-55342
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING TS0500W3S KIT PART IDENTIFIER: DESCRIPTION: ASSEMBLY DWG: 1.0 CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

TS0500

Contextual Info: TS0500 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 5.05 10.1 Frequency (GHz) 15.1 18 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 5.05 10.1 Frequency (GHz) 15.1 18.1 S(1,1) 25C Swp Max 12.4GHz 2. 0. 6 0.8

10DB

Abstract: DC-18GHZ MIL-R-55342 TS0500W3
Contextual Info: TITLE: PART IDENTIFIER: SPECIFICATION CONTROL DRAWING TS0500W3 KIT DESCRIPTION: CHIP: ASSEMBLY DWG: 1.0 ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

10DB

Abstract: DC-18GHZ MIL-R-55342
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0500 KIT DESCRIPTION: CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

10DB

Abstract: DC-18GHZ MIL-R-55342 TS0500G
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0500G KIT DESCRIPTION: IP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

10DB

Abstract: DC-18GHZ MIL-R-55342
Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: DESCRIPTION: CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: 1.0 TS0500WB1 KIT N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ

TS0500W3

Contextual Info: TS0500W3 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 5.05 Frequency (GHz) 10.05 12.4 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 5.05 Frequency (GHz) 10.05 12.4 S(1,1) 25C Swp Max 12.4GHz 2. 0. 6 0.8 1.0

ts0505

Abstract: TS0503 TS0506 marking code wb1 TS0510 TS0504
Contextual Info: A ttenuators General Specifications Teclutologi/ TS05 M arking Code Part # dB Value TS0500 TS0501 TS0502 TS0503 TS0504 TS0505 TS0506 TS0507 TS0508 TS0509 TS0510 TS0511 TS0512 TS0513 TS0514 TS0515 TS0516 TS0517 TS0518 TS0519 TS0520 0 dB 1 dB 2 dB 3 dB 4 dB

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

4160P

Abstract: 4161p
Contextual Info: NEW PRODUCTS HIGH POWER LOADS The performance of many of our standard, high power loads has been significantly improved. The 5307 and 5657 are now specified for operation through 2 GHz with 1.25:1 VSWR. The 5309 is now specified for operation through 4 GHz with 1.35:1 VSWR. The power

ts0505

Abstract: marking code wb1 mw 772 TS05XXW1 TS05XXW3 ts0506 TS0503 TS05 TS0518 TS0509
Contextual Info: Attenuators Introduction Features • Substrate - Alumina • Power Rating - 0.1 to 2 Watts • Frequency Range DC to 18 GHz • Tape and Reel Packaging Available • VSWR under 1.50:1 • Variety of Chip Sizes • Attenuation Values from 1 to 20 dB in 1 dB increments; consult the factory

Contextual Info: THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film element on an alumina ceramic substrate with solderable terminals in two sizes. The larger TS03XX Series operates to 12.4 GHz and the

tva0300n07

Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Contextual Info: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,

d8693

Abstract: RYT Circulators amf-3d-008019.1 miteq amf-3f x-band waveguide isolators ps223 TS0303W3 JSD00114 H-BEND
Contextual Info: AST Lagerliste 2010 solange r u n f u a Verk icht! Vorrat re Hohlleiter- und Koaxialbauteile, vom Diplexer bis zu Leistungsverstärker, passive Bauteile wie z.B. Leistungswiderständen oder Dämpfungsglieder, und Kabel bis zu 65 GHz werden mit weit über 50% Preisnachlass angeboten.

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ina 124

Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Contextual Info: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz

TS05XXW3

Abstract: TS0500 marking code wb1 TS05XX ts0506 TS0507 EMC TS-050
Contextual Info: ATTENUATORS THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film Impedance: 50 Q element on an alumina ceramic substrate with solderable terminals Operating Temperature: -55°C to +150°C

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

84-1LM

Abstract: ECF564A
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with