CQFP 80 Search Results

TEA 1732

Abstract: A09 N03
Contextual Info: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package

RTAX2000S

Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

AX2000-CQ256

Abstract: RTAX2000S-CQ352
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Contextual Info: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Contextual Info: RTAX-S RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View A dv a nc ed v 0. 5

Contextual Info: TT 95-96 DATA BOOK ERRATA M/HITE / M I C R O E L E C T R O N I C S CHANGES TO 1995-1996 MEMORY/MICROPROCESSORS DATA BOOK Page What it is What it should be 1-20 68 Pin CQFP 5962-94613 01HWX* 68 Pin CQFP 5962-94613 02HWX* 68 Pin Low Profile CQFP 5962-94613 01HZX

actel FG484 package mechanical drawing

Abstract: RTAX2000S-CQ352 actel package mechanical drawing FG484 CQ352 2-CQFP SK-AX2000-CQ352RTFG896 sk-ax FG896 rtax2000* cqfp
Contextual Info: &4 3 WR )%*$ $GDSWHU 6RFNHWV July 2004 Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 CQFP to FBGA Adapter Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

8N07

Abstract: 030 b03 cn/A/U 237 BG
Contextual Info: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.

b09 n03

Abstract: B07 P03
Contextual Info: 1. 6 Pow erPC 604e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 604e C4-CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C 4 - C Q F P P a c k a g e Table 10 provides the pinout listing for the 604e C4-CQFP package.

SL-CQ352

Contextual Info: Application Note AC342 CQFP to CLGA Adapter Socket Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . CQ to LG Adapter Socket . . . . . . . . . . . . . . . CQ to LG Adapter Socket Assembly Procedure . . . CQ352 to LG1272 Adapter Socket Outline Drawing .

CLCC68

Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors

emcp 162

Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Contextual Info: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz

DSP56116

Abstract: PB10 PB12 PC10 MDB301 DSP56116 users manual "saturation arithmetic" F1359 dsp56001
Contextual Info: Order this document by DSP56116/D MOTOROLA •SEMICONDUCTOR DSP56116 TECHNICAL DATA Advance Information 16-bit General Purpose Digital Signal Processor Pin Grid Array PGA ^ f Available in an 101 pin ceramic through-hole! package package. through- Ceramic Quad Flat Pack (CQFP)

WE32K32-XXX

Contextual Info: White Electronic Designs WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES „ Access Times of 80*, 90, 120, 150ns „ Data Retention at 25°C, 10 Years „ MIL-STD-883 Compliant Devices Available „ Write Endurance, 10,000 Cycles Packaging: „ • 68 lead, Hermetic CQFP G2U , 122.4mm

p332

Abstract: 68332 microcontroller qsm 66 WC16P332-16GX WC16P332-16GM
Contextual Info: White Electronic Designs WC16P332-16GX PRELIMINARY* 68332 MONOLITHIC MICROCONTROLLER 68020 Monolithic Microcontroller also available. Please call factory for more information. Packaging • 132 lead, 24mm 0.950” sq., Hermetic CQFP (Package 505) (shipped with leads cut and formed).

DSP96000

Abstract: DSP56000 DSP56100 DSP56166 DSP56166ROM DSP96002 brand tai hen FE60 marking ha02 Nippon capacitors
Contextual Info: Freescale Semiconductor, Inc. Order this document by DSP56166/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56166 Advance Information 16-bit General Purpose Digital Signal Processor Ceramic Quad Flat Pack CQFP Available in a 112 pin, small footprint, surface mount package.

Contextual Info: Prototyping Microsemi Rad-Tolerant Devices Microsemi™ Prototyping CQFP PACKAGE Aldec RTAX-S/SL Prototyping Adaptors RTAX250S/SL RTAX1000S/SL RTAX2000S/SL RTAX4000S CQ208 CCGA/LGA PACKAGE Aldec and Microsemi have joined together, offering a new, innovative,

FBGA-484

Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly

Contextual Info: WS128K48V-XG4WX 128Kx48 3.3V SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available Low Power Version ■ Access Times 15, 17, 20, 25ns ■ Packaging ■ TTL Compatible Inputs and Outputs • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ Weight

MO-134

Contextual Info: MECHANICAL DATA MCQF008A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 (4 Places) 5,50 4,50 39,50 BSC 320 1 241 240 DETAIL “C” Heatsink 70,00 3,60 3,50 161 160 80 81 DETAIL “B”

WC16P332-16GX

Abstract: 68332 instruction set 2Kx8 SRAM
Contextual Info: WC16P332-16GX White Electronic Designs PRELIMINARY* 68332 MONOLITHIC MICROCONTROLLER „ 68020 Monolithic Microcontroller also available. Please call factory for more information. Packaging • 132 lead, 24mm 0.950” sq., Hermetic CQFP (Package 505) (shipped with leads cut and formed).

D2044

Contextual Info: AUSTIN SEMICONDUCTOR, INC. AS7S128K32/ AS8S128K32 128K X 32 SRAM SRAM MODULE AVAILABLE AS MILITARY SPECIFICATIONS • • • • PIN ASSIGNMENT Top View 68 Lead CQFP SMD 5962-95595: AS8S128K32 SMD 5962-93187: AS8S128K32 SMD 5962-98600: AS7S128K32 MIL-STD-883