CQFP 80 Search Results

RTAX2000S

Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Contextual Info: RTAX-S/SL RadTolerant FPGAs Package Pin Assignments 208 207 206 205 160 159 158 157 208-Pin CQFP Pin 1 1 2 3 4 156 155 154 153 Ceramic Tie Bar 208-Pin CQFP 108 107 106 105 101 102 103 104 53 54 55 56 49 50 51 52 Figure 3-1 • 208-Pin CQFP Top View Note

CLCC68

Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors

emcp 162

Abstract: DL10 DL12 emcp TEA 2111 WT111 eMCP qualification dh29 code
Contextual Info: WC64P603EV-XQ3X RISC 603e MODULE, SECONDARY L2 CACHE ADVANCED * MAIN FEATURES • Based on RISC 603e 3.3V Microprocessor ■ Processor Clock Frequencies: 66.6, 80, 100 MHz ■ Footprint compatible with 603e µp CQFP package ■ Bus Clock Frequencies: Up to 66.6 MHz

5271SC

Abstract: military mcm 1553 military mcm cpu R4400 RM5271
Contextual Info: Standard Products ACT5271SC Multichip Module Microprocessor with 2MB Secondary Cache www.aeroflex.com/Avionics May 5, 2005 FEATURES ❑ Footprint Compatible with Aeroflex-Plainview original ACT4431SC 1MB Secondary Cache MCM in a 280 lead Ceramic Quad Flat Pack CQFP

p332

Abstract: 68332 microcontroller qsm 66 WC16P332-16GX WC16P332-16GM
Contextual Info: White Electronic Designs WC16P332-16GX PRELIMINARY* 68332 MONOLITHIC MICROCONTROLLER 68020 Monolithic Microcontroller also available. Please call factory for more information. Packaging • 132 lead, 24mm 0.950” sq., Hermetic CQFP (Package 505) (shipped with leads cut and formed).

Contextual Info: WS128K48V-XG4WX 128Kx48 3.3V SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available Low Power Version ■ Access Times 15, 17, 20, 25ns ■ Packaging ■ TTL Compatible Inputs and Outputs • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ Weight

WC16P332-16GX

Abstract: 68332 instruction set 2Kx8 SRAM
Contextual Info: WC16P332-16GX White Electronic Designs PRELIMINARY* 68332 MONOLITHIC MICROCONTROLLER „ 68020 Monolithic Microcontroller also available. Please call factory for more information. Packaging • 132 lead, 24mm 0.950” sq., Hermetic CQFP (Package 505) (shipped with leads cut and formed).

D2044

Contextual Info: AUSTIN SEMICONDUCTOR, INC. AS7S128K32/ AS8S128K32 128K X 32 SRAM SRAM MODULE AVAILABLE AS MILITARY SPECIFICATIONS • • • • PIN ASSIGNMENT Top View 68 Lead CQFP SMD 5962-95595: AS8S128K32 SMD 5962-93187: AS8S128K32 SMD 5962-98600: AS7S128K32 MIL-STD-883

WE512K16-XG4X

Contextual Info: White Electronic Designs WE512K16-XG4X 512Kx16 CMOS EEPROM MODULE FEATURES Access Time of 140, 150, 200ns Page Write Cycle Time: 10ms Max Packaging: Data Polling for End of Write Detection • 68 lead, 40mm Hermetic CQFP Package 501 Hardware and Software Data Protection

WS128K48-XG4WX

Contextual Info: WS128K48-XG4WX 128Kx48 SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available Low Power Version ■ Access Times 17, 20, 25, 35ns ■ Packaging: • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ TTL Compatible Inputs and Outputs ■ Weight

WF8M32-XG4DX5

Abstract: WF2M32-XHX5
Contextual Info: White Electronic Designs WF8M32-XG4DX5 ADVANCED* 8Mx32 5V FLASH MODULE FEATURES Packaging: Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. • 68 Lead, 40 mm 1.560" square hermetic CQFP, 5.2 mm (0.205") high (Package 503)

Contextual Info: White Electronic Designs WE512K16-XG4X 512Kx16 CMOS EEPROM MODULE FEATURES Access Time of 140, 150, 200ns Page Write Cycle Time: 10ms Max Packaging: Data Polling for End of Write Detection • 68 lead, 40mm Hermetic CQFP Package 501 Hardware and Software Data Protection

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

512Kx48

Contextual Info: WS512K48-XG4WX HI-RELIABILITY PRODUCT 512Kx48 SRAM MODULE ADVANCED* FEATURES • 2V Data Retention Devices Available WS512K48L-XXX Low Power Version ■ Access Times 17, 20, 25, 35ns ■ Packaging: • 116 Lead, 40.0mm Hermetic CQFP (Package 504) ■ TTL Compatible Inputs and Outputs

WE512K16-XG4X

Contextual Info: WE512K16-XG4X 512Kx16 CMOS EEPROM MODULE FEATURES • Access Time of 120, 150, 200ns ■ Automatic Page Write Operation ■ Packaging: ■ Page Write Cycle Time: 10ms Max ■ Data Polling for End of Write Detection • 68 lead, 40mm Hermetic CQFP Package 501

68332 instruction set

Abstract: vddsyn detail 68332 WC16P332-16GX
Contextual Info: WC16P332-16GX 68332 MONOLITHIC MICROCONTROLLER PRELIMINARY* • 68020 Monolithic Microcontroller also available. Please call factory for more information. FEATURES ■ Operating Temperature Range -55°C to 125°C ■ 100% CMOS ■ Packaging • 132 lead, 24mm 0.950" sq., Hermetic CQFP (Package 505)

g31 m7 te

Abstract: LC2-D LA4-DA adsp20 Socket AM2 AL-20 bmsa
Contextual Info: a Quad-SHARC DSP Multiprocessor Family AD14160/AD14160L OLE AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid

WS1M32-XG3X

Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

WS256K64-XG4WX

Contextual Info: WS256K64-XG4WX 256Kx64 SRAM MODULE ADVANCED* FEATURES • Access Times 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: ■ Commercial, Industrial and Military Temperature Range ■ 5 Volt Power Supply ■ Low Power CMOS • 116 lead, 40mm, Hermetic CQFP Package 504

Contextual Info: FLASH AS8F512K32 Austin Semiconductor, Inc. 512K x 32 FLASH PIN ASSIGNMENT FLASH MEMORY ARRAY Top View AVAILABLE AS MILITARY SPECIFICATIONS • • 68 Lead CQFP (Q & Q1) SMD 5962-94612 MIL-STD-883 FEATURES • • • • • • • • • • • •

Contextual Info: PRELIMINARY SPECIFICATION EEPROM Austin Semiconductor, Inc. PIN ASSIGNMENT 128K x 32 Radiation Tolerant EEPROM Top View 68 Lead CQFP RES\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 Vcc AVAILABLE AS MILITARY SPECIFICATIONS • MIL-STD-883, para 1.2.1 compliant

IEC-297-3

Abstract: IEC297-3 dsp56001 architecture DSP56000 DSP56001 MC68000 PB12 "saturation arithmetic"
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP5600I/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of Motorola’s family of

Contextual Info: WE256K32-XG2TXE HI-RELIABILITY PRODUCT 256Kx32 EEPROM MODULE PRELIMINARY* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)