BGA304 Search Results

BGA304

Abstract: sot550
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E

P-BGA304-31x31-1

Abstract: PBGA-304 PRBG0304DA-A 304F7A
Contextual Info: JEITA Package Code P-BGA304-31x31-1.27 RENESAS Code PRBG0304DA-A D Previous Code 304F7A A A ZD A1 b S AB e y S Index mark S ZE AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B D1 MASS[Typ.] 3.1g Reference Symbol 1 2 3 4 5 6 7 8 9 1011 1213141516171819 2021 22 23

BGA304

Abstract: MS-034 sot550
Contextual Info: Package outline Philips Semiconductors BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm D SOT550-2 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 ∅v ∅w b e AC AB AA Y W V U T R P N M L K J H G F E D C B A M M y1 C C A B

SF-BGA304A-B-11

Abstract: BGA 23 x 23 array
Contextual Info: D Package Code: BGA304A C 27.94mm [1.100"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 27.94mm [1.100"] X 1.27mm [0.050"] Top View reference only 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

Contextual Info: Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b e y y1 C ∅v M C A B ∅w M C AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1 shape 2 optional 4x

LS-BGA304A-11

Contextual Info: BGA304A Tooling hole X2 0.64mm [0.025"] Ø 0.40mm (x2) [Ø 0.016"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] Ø 0.51mm [Ø 0.020"] pad 27.94mm [1.100"] Top View (reference only) X 0.64mm [0.025"] 1 5.33mm [0.210"] 0.64mm [0.025"]

BGA304

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 y y1 C ∅v M C A B b e ∅w M C AC AB AA Y W V U T R P N M L

FX-BGA304A-S-B-01

Abstract: hdlc transwitch pitch 0.3mm BGA Multi-Channel hdlc Controller
Contextual Info: 3.56mm [0.140"] typ. 3.56mm [0.140"] typ. Top View 33.53mm [1.320"] 1.27mm [0.050"] pitch typ. 33.53mm [1.320"] Side View 1 2.18mm [0.086"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

WLAN Module MII

Abstract: CNS1202 CNS1109 RGMII to MII CNS1105 CNS11XX BGA304 CNS12XX CAVIUM cns12
Contextual Info: Networks That ThinkTM. Embedded ARM Processors STAR CNS11XX and CNS12XX Connected Home and Office Processors Product Brief OVERVIEW The STAR CNS11XX/CNS12XX family of ARM processors target intelligent, gigabit networking, storage and wireless applications in

XR2206 application notes

Abstract: pin diagram of ic xr2206 IC XR2206 XR2206 XR2206 pin details for function generator XR2206 monolithic function generator xr2206 circuit peb1756ae fsk modulation and demodulation using Xr2206 MXP2
Contextual Info: Communications OTN Multi-Service OTN Muxponder/Mapper Ethernet Transport Ethernet over PDH Ethernet over SONET/SDH PDH over SONET/SDH Port Expanders SONET/SDH Multi-Ch/Multi-Rate Framer+Serdes Mappers + Framers Transceivers/CDR PDH E1 LIUs T1/E1/J1 LIUs BITS Solutions

TR6878

Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

BGA304

Contextual Info: T—BGA304—3131—1.27C4 Uniti nn Mar,2003

FP-X4KPG223-01

Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators