LFBGA80 Search Results

sot751

Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot751

Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2

Contextual Info: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e

Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H

MTC20166

Abstract: ST70138T mtc-20174 MTK20170 MTC20174-TQ-C1 TR-048 MTC20174 ST20138 ST70137 ST70138
Contextual Info: ST20138 Unicorn II PCI/USB ADSL CHIPSET: ST70138 + MTC20174 FOR ULTRA LOW COST ADSL MODEM DATA BRIEF 1 DESCRIPTION The Unicorn II chipset is designed to simplify the development of low-cost ADSL CPE modems for Windows, Mac and Linux based environments and

shadow detector circuits

Abstract: 20532 C165UTAH PEB20534 SAB82532 infineon SAB 82532 Infineon Design Link
Contextual Info: P R O D U C T B R I E F 3.3 V, 2 Channel, Serial Optimized Communications Controller, with µP Interface Building on Infineon's expertise, the SEROCCO satisfies a system designer's need for a multiprotocol serial communications controller that operates at 3.3 V. Additionally, the SEROCCO

PCF87752

Abstract: PCF87750 Ericsson pbc PCF87755 BGB100 BGB101 BGB121 Bluetooth RSSI
Contextual Info: PCF87752 Blueberry DATA 2nd generation Bluetooth™ baseband controller optimized for hosted applications The PCF87752 is the most highly-integrated single-chip baseband solution designed for Bluetooth* applications. Known as ‘Blueberry* DATA,’ it contains everything required to provide

MTC20166

Abstract: ADSL2 Modem circuit diagram MTC20174 Diagram of ADSL CPE Analog Front End TQFP144 DIMENSION ST20138 ST70137 ST70138 ST70138B ST70138T
Contextual Info: ST20138 Unicorn II USB ADSL modem chipset: ST70138 + MTC20174 for ultra-low-BOM ADSL modem designs Data Brief Description The Unicorn II chipset consists of the ST70138 digital chip and the MTC20174 analog front end with integrated line driver. Performance, cost and time to market are key

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

circuit diagram adsl modem board

Abstract: mtc-2016
Contextual Info: ST20138 Unicorn II USB ADSL modem chipset: ST70138 + MTC20174 for ultra-low-BOM ADSL modem designs Data Brief Description The Unicorn II chipset consists of the ST70138 digital chip and the MTC20174 analog front end with integrated line driver. Performance, cost and time to market are key