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    SOT751 Search Results

    SOT751 Datasheets (4)

    NXP Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT751-1
    NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm Original PDF 245.36KB 1
    SOT751-1
    NXP Semiconductors Footprint for reflow soldering SOT751-1 Original PDF 11.34KB 1
    SOT751-2
    NXP Semiconductors Footprint for reflow soldering SOT751-2 Original PDF 11.34KB 1
    SOT751-2
    NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm Original PDF 245.73KB 1

    SOT751 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    sot751

    Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J


    Original
    lfbga80ot751-1sot751 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    lfbga80ot751-2 PDF

    sot751

    Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A


    Original
    lfbga80ot751-2sot751 PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    lfbga80ot751-1 PDF

    Contextual Info: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2


    Original
    lfbga80ot751-2 PDF

    Contextual Info: Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C M L K J H G F E D C B A ball A1 index area e e2 1/2 e


    Original
    ot751-1lfbga80 PDF

    Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline SOT751-1 LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1 mm A B D ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J H


    Original
    ot751-1lfbga80 PDF

    bgb102

    Abstract: block diagram bluetooth headset Bluetooth Module adc circuit diagram for wireless headsets "bluetooth system" applications of vlsi in antennas CRC Bluetooth microcontroller controlling wireless headset BGB101 PCF87852
    Contextual Info: PCF87852 Bluetooth baseband controller Rev. 01 — 23 April 2004 Preliminary data 1. General description The PCF87852 combines the Bluetooth protocol stack, Link Controller LC , Link Manager (LM), and Host Controller Interface (HCI) firmware of the Bluetooth system


    Original
    pcf87852bgb102block diagram bluetooth headsetbluetooth module adc+6circuit diagram for wireless headsetsbluetooth systemapplications of vlsi in antennascrc bluetoothmicrocontroller controlling wireless headsetbgb101 PDF