BGA316 Search Results

Contextual Info: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x

PBGA-316

Abstract: PRBG0316DB-A 316F
Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DB-A D Previous Code 316F7A MASS[Typ.] 2.6g A ZD A B D1 φb φx M S AB e y S Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 1011121314151617181920 S Index mark Reference Symbol

PRBG0316DA-A

Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DA-A D Previous Code 316F7X-A A MASS[Typ.] 2.6g A B D1 ZD b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BGA316

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K

BGA316

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M Y W V U T R P N M L K J H G F E D C B A

SF-BGA316B-B-11

Abstract: BGA316 FR4 substrate with 0.762mm thickness
Contextual Info: D Package Code: BGA316B C 0.635mm See BGA pattern code to the right for actual pattern layout Y .0225" dia. tooling holes X2 non plated (optional) 0.762mm 0.025" dia. pad X Top View (reference only) 24.13mm 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

BGA316

Abstract: sot531
Contextual Info: PDF: 1999 Sep 14 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P N M L K J H G F E D C B A e 1 2

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

B0BC9R000008 DIODE

Abstract: B0BC6R100010 B0BC01700015 B0BC9R000008 varistor k271 Diode C65 004 LYNX3DM transistor C388 B0BC3R700004 3225 K30
Contextual Info: ORDER NO. CPD0207023C0 Personal Computer CF-R1 This is the Service Manual for the following areas. M …for U.S.A. and Canada E …for U.K. G …for Germany F …for France T …for Italy P …for Spain Model No. CF-R1P82ZV1 2 1: Operation System G: Microsoft Windows® XP Professional

kbc 1070 nu

Abstract: toshiba c850 JRC 386 amp LYNXEM4 D5024 hosiden DC motor 12V DFWP0125WA R5C475 Matsua inverter MID manual B9017
Contextual Info: ORDER NO. CPD0102001C0 Notebook Computer CF-28 This is the Service Manual for the following areas. M .for U.S.A. and Canada E .for U.K. G .for Germany F .for France S .for Sweden When this product is repaired, the Access Key is necessary to release security of electrical and mechanical.

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

diagram lcd tv Philips 32

Abstract: high level block diagram for i2c controller jpeg encoder block diagram of digital TV RS-232 to i2c converter saa8 SAA8122 PR3001 digital DSC controller digital still camera controller
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA8122 Digital Still Camera Preliminary specification Supersedes data of File under Integrated Circuits, ICXX 1999 sep 01 Philips Semiconductors Preliminary specification Digital Still Camera SAA8122 FEATURES • Support a wide range of CCD VGA,SVGA,QGA,XGA,EQGA

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors