SF-BGA304A-B-11
Abstract: BGA 23 x 23 array
Contextual Info: D Package Code: BGA304A C 27.94mm [1.100"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 27.94mm [1.100"] X 1.27mm [0.050"] Top View reference only 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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bga304asf-bga304a-b-11bga 23 x 23 array |
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LS-BGA304A-11
Contextual Info: BGA304A Tooling hole X2 0.64mm [0.025"] Ø 0.40mm (x2) [Ø 0.016"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] Ø 0.51mm [Ø 0.020"] pad 27.94mm [1.100"] Top View (reference only) X 0.64mm [0.025"] 1 5.33mm [0.210"] 0.64mm [0.025"]
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bga304afr4/g10ls-bga304a-11 |
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FX-BGA304A-S-B-01
Abstract: hdlc transwitch pitch 0.3mm BGA Multi-Channel hdlc Controller
Contextual Info: 3.56mm [0.140"] typ. 3.56mm [0.140"] typ. Top View 33.53mm [1.320"] 1.27mm [0.050"] pitch typ. 33.53mm [1.320"] Side View 1 2.18mm [0.086"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.
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fr4/g10bga304atxc-05132fx-bga304a-s-b-01+4hdlctranswitchpitch 0.3mm bgamulti-channel hdlc controller
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Contextual Info: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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xc2018xc3020xc3064xc3042+11xc3090fp-x4kpg223-01reflow profile for lga componentsbga96bga165bga292so8aca-so18a-z-j-t-01sf-qfe352sa-l-01bga480bca-plcc44-d-p-t-01
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