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TR6878 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
TR6878 Contextual Info: KMY Last update: 2012.8.30 No.RLC-K-HTS-0001-13 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLC10, 16, 20, 32, 35, 50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification	Original	RLC-K-HTS-0001-13 RLC10, RLC-K-HTS-0001 coveure-12 TR6878	PDF
TR6878 Contextual Info: KMY Last update: 2012.8.30 No.RLS-K-HTS-0001-5 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLS50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification	Original	RLS-K-HTS-0001-5 RLS50, RLS-K-HTS-0001 400mm 100mm TR6878	PDF
TR6878 Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576 Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution	Original	1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576	PDF
TR6878 Contextual Info: KMY Last update: 2013.12.1 No.RLC-K-HTS-0001-14 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLC10, 16, 20, 32, 35, 50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification	Original	RLC-K-HTS-0001-14 RLC10, TR6878	PDF