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    TR6878

    Contextual Info: KMY Last update: 2012.8.30 No.RLC-K-HTS-0001-13 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLC10, 16, 20, 32, 35, 50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification


    Original     		rlc-k-hts-0001-13rlc10rlc-k-hts-0001coveure-12+1tr6878 PDF

    TR6878

    Contextual Info: KMY Last update: 2012.8.30 No.RLS-K-HTS-0001-5 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLS50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification


    Original     		rls-k-hts-0001-5rls50rls-k-hts-0001400mm+2100mmtr6878 PDF

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		1000-pinfdh-bga35215mhztr6878+10h1/1999fcbga package thermal resistanceebga672fcbga-160bga package thermal profilefr4 glass epoxy stiffenerfbga 12 x 12 thermal resistancebga-560p-m01fine bga thermal profilebga-576 PDF

    TR6878

    Contextual Info: KMY Last update: 2013.12.1 No.RLC-K-HTS-0001-14 Uncontrolled copy Sp e c i f i c a t i o n (Reference) Title: FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM Style: RLC10, 16, 20, 32, 35, 50, 63 RoHS COMPLIANCE ITEM Product specification contained in this specification


    Original     		rlc-k-hts-0001-14rlc10tr6878 PDF