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    SOT550 Search Results

    SOT550 Datasheets (1)

    NXP Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT550-1
    NXP Semiconductors Plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm Original PDF 263.36KB 1
    SF Impression Pixel

    SOT550 Price and Stock

    Vishay Intertechnologies

    Vishay Intertechnologies FSOT5509E45R00JENI

    Res Wirewound 45Ohm 5% 55W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT5509E45R00JENI)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT5509E45R00JENI Bulk 17 Weeks 10
    • 1 -
    • 10 $94.58
    • 100 $16.21
    • 1000 $14.41
    • 10000 $14.41
    Buy Now
    Newark FSOT5509E45R00JENI Bulk 10
    • 1 -
    • 10 $94.58
    • 100 $14.31
    • 1000 $12.57
    • 10000 $12.57
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    Vishay Intertechnologies FSOT5509E4K000JE

    Res Wirewound 4KOhm 5% 55W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT5509E4K000JE)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT5509E4K000JE Bulk 17 Weeks 10
    • 1 -
    • 10 $95.40
    • 100 $11.25
    • 1000 $10.03
    • 10000 $10.03
    Buy Now

    Vishay Intertechnologies FSOT5509E5R000JE

    Res Wirewound 5Ohm 5% 55W 400ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT5509E5R000JE)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT5509E5R000JE Bulk 17 Weeks 10
    • 1 -
    • 10 $95.40
    • 100 $11.25
    • 1000 $10.03
    • 10000 $10.03
    Buy Now

    Vishay Intertechnologies FSOT5509E90R00JENI

    Res Wirewound 90Ohm 5% 55W 260ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT5509E90R00JENI)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT5509E90R00JENI Bulk 17 Weeks 10
    • 1 -
    • 10 $95.40
    • 100 $16.85
    • 1000 $15.01
    • 10000 $15.01
    Buy Now

    Vishay Intertechnologies FSOT5509E3R900JE

    Res Wirewound 3.9Ohm 5% 55W 400ppm/?C Silicone Coated Standard Oval Screw Terminal Bulk - Bulk (Alt: FSOT5509E3R900JE)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas FSOT5509E3R900JE Bulk 17 Weeks 10
    • 1 -
    • 10 $95.40
    • 100 $11.25
    • 1000 $10.03
    • 10000 $10.03
    Buy Now

    SOT550 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA304

    Abstract: sot550
    Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E


    Original
    bga304ot550-1sot550 PDF

    BGA304

    Abstract: MS-034 sot550
    Contextual Info: Package outline Philips Semiconductors BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm D SOT550-2 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 ∅v ∅w b e AC AB AA Y W V U T R P N M L K J H G F E D C B A M M y1 C C A B


    Original
    bga304ot550-2ms-034sot550 PDF

    Contextual Info: Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b e y y1 C ∅v M C A B ∅w M C AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1 shape 2 optional 4x


    Original
    bga304ot550-1ms-034 PDF

    BGA304

    Abstract: MS-034
    Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 y y1 C ∅v M C A B b e ∅w M C AC AB AA Y W V U T R P N M L


    Original
    bga304ot550-1ms-034 PDF

    b0239c

    Abstract: diode GG 66 diode 2U 66 MEAB to-53 2U 39 diode
    Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N5000 2N5150 2N5602 2N5154 2N6717 92GU06 92PU06 B0379-16 ~~~~~ 30 SOT5513 SOT5513 SOT5913 B0379-25 2SC3474 2S01914 2S01981 SK3512 - :g~~:~ - 25 35 -40 45 -50 RCA1A03 S2N4863-2 S2N4863-3 SMl5509 SMl5514


    Original
    ot5503ot59032n64092s01516+6b0239cdiode gg 66diode 2u 66meabto-532u 39 diode PDF

    b0345

    Abstract: B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288
    Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N1711B 2SC1419 2SC1419 2Nl085 2S0330 2S0331 BSS1S NSOS179 ~~g~~~oo 25 30 SK32SS 2S011S0Y 92GU45A 2S0288 2S0289 KT9340 KT934V B0827-10 ~~~~~~7 35 40 SML5512 SML5902 SML5907 SML5912 ST440 ST450 2S013


    Original
    b0373a2ns70592pe37ab0375-10+10b037mo-12sb0345b0815to-53to532sc840kt934vmatsua 2sc8402s0288 PDF

    B0813

    Abstract: PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857
    Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 NA31KY NA31MH NA31 MY SK3248 NA31KI NA31MI NA31KJ NA31MJ ~~~~g: 25 30 2NS204 S15-28 SMl5501 SMl550S SMl5511 SMl5901 SMl590S SMl5911 ~~~j~~ 35 40 80Y10 80Y10 PT9787 PT9787A 2N4431 2S022S 2S0226 SOT4301


    Original
    2sc109s2ns71492pu012s0180s+14mpsu01nsou0192gu01na31kyb0813pt97878c440mj3237trw pt9787mm4048mje42cmj2841 motorolamm1758mmt2857 PDF

    handbook philips ic26 packaging

    Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
    Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


    Original
    an01026bga256ot466-1ot471-1+13bga292ot489-1bga304ot550-1bga316handbook philips ic26 packagingland pattern bga 0.75bga outline drawingbga and qfp packagelfbga80lr-735stencil tensionland pattern bga 0,50 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original
    manuf86tqfp80ot357tqfp64+12ot543tfbga64jedec tray dimensionshssop20ic packagestray tssop20 14 x 35so16 package traysbga304hlqfp100msd504lqfp64 reel sizeplcc84 package PDF