NP276 Search Results

AC-27621

Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C

Contextual Info: Characteristics 1.000MQ or more at 100 VDC Insulation Resistance: Withstanding Voltage: Contact Resistance: NP276-372 0 6 A * 100 VAC for 1 Minute 30mQ or less at 10mA/20mV Initial -55'C - +150'C Operating Temperature: Material Insulator: Contact: Plating:

Contextual Info: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*

bga 576 socket

Abstract: 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327
Contextual Info: BGA NP276 Series Arrays Socket Series No. of Leads Material PEI Glass Filled UL94V-0 Beryllium Copper Gold over Nickel Design No. Positioning Pin Identification Depopulated Versions Available Quad Flat Packages ∅ ∅ ∅ ± Speciality Test Products ∅

DT-BGA633A-P-Z-01

Contextual Info: 3.19mm [0.126"] 0.46mm dia. [0.018"] 68.00mm [2.677"] sqr. NP276-75319-1 NP276-75319-1 2 4 2.54mm typ. [0.100"] 3 1 Bottom View NC 1.27mm typ. [0.050"] 2001 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: 651 452-8100 www.ironwoodelectronics.com

NP276-11904-3

Abstract: 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 30m Ω max. at 10mA/20mV max.

Contextual Info: A Table Of Contents ^Arrays Pages Pin Grid Arrays / Zero Insertion Force PG A/ZIF PG A/ZIF PG A/ZIF Open top PG A/ZIF (Interstitial) PGA / ZIF (Open Top, Interstitial) NP89 NP161 NP171 NP236 NP178 9-10 11-12 13-14 15-16 17-18 IC264 NP276 19 20-21 Ball Grid Arrays

IC51-2084-1052-11

Abstract: LCS-68-12 IC51-1004-814-2 IC51-0324-1498 QILE84P-410T LCS-84-12 IC51-1444-1354-7 CQFP 208 IC51-0444-1568 IC51-1604-845-4
Contextual Info: 1999年 1 月 ver. 3 イントロダク ション アルテラ・デバイス用 ソケットの選択方法 Application Note 80 表面実装用部品を使用するプリント基板（PCB）組立には従来とは異なる 手法が要求されます。まず、開発段階ではプリント基板のレイアウトに従来

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

Contextual Info: Receptacles Design Rules Part Number Ordering Procedure Acceptable Socket 51- 1004818- * 1 * 0 Terminal Length Socket Series Code Minimum Pin Length: Maximum Pin Length: Material Socket Contact Type Insulator: Inner Contact: Insulator Plate Thickness Outer Sleeve:

Contextual Info: Design Rules Acceptable Socket pefmJnaTCinpr^ ^Minimum Pin Lengtm Maximum Pin Length: Insulator:"^ Inner Contact: 2.4mm 3.8mm If above 3.8mm, groove is required on the insulator "Polyethenmide (PEI) Beryllium Copper (BeCu) 172 heat treated Gold plating (30p") over Nickel plating (50p”)

YAMAICHI ic234

Abstract: socket Yamaichi ic234 IC234 1004-814 millimeter design guide
Contextual Info: Receptacles Design Rules Acceptable Sockets Application: The receptacle is used as an additional adapter between the PCB and the Test and Burn-In socket, therefore making the socket removable Terminal Length: Minimum pin length 2.4mm Maximum pin length 3.8mm

PA-PGA181-02W

Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for

mother board lcd tv block diagram

Abstract: KDS8L HC49SUB C0805 100nf 74HCT74T ic 293D c9 sot353 32KHZ768 W17 sot23 rca IC12
Contextual Info: APPLICATION NOTE Digital Still Camera Evaluation Kit SAA812X <AN00061> Philips Semiconductors TP97036.2/W97 TRAD Philips Semiconductors Application Note <AN00061> Abstract Philips semiconductors has developed boards to demonstrate the possibilities of the SAA812X

Contextual Info: NP 276 SERIES b6a FEATURES • Open top type sockets for BGA packages. • Changes to the 1C ball flatness are minimized by contacting the ball from the side to protect it from damage. SPECIFICATIONS PERFORMANCE nsulation Resistance 1.000MQ min. at 100VDC

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

Yamaichi IC51-0444-1568

Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
Contextual Info: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production

BGA 6x6 tray

Abstract: daewon tray tray bga 6x6 PAR64 PC200 REQ64 daewon bga
Contextual Info: Intel 80321 I/O Processor Datasheet Advance Information Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache

PCE-5

Abstract: Intel 80321 P5 microarchitecture CC2538 BGA 6x6 tray daewon AE23 PAR64 PC200 544LE
Contextual Info: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface

PT740 AB

Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

Intel StrataFlash Memory j3

Abstract: BGA 6x6 tray daewon 273416 Intel 80321
Contextual Info: Intel 80321 I/O Processor Datasheet Product Features • ■ ■ ■ Core Features — Integrated Intel® XScale Core — ARM* V5T Instruction Set — ARM V5E DSP Extensions — 400 MHz and 600 MHz — Write Buffer, Write-back Cache PCI Bus Interface

NP352

Abstract: IC280-484-206 NP364 NP378 NP440 NP404 IC409 IC280-960-276 NP367 IC398
Contextual Info: \ - f ^ ' \ 0.4mmPitch P ro d u c t Line-up P K G S iz e m m G r id O p en T o p T y p e 4 5 6 7 8 8,9 10,11 12,13,14 15,16 17,18,19 BGA N P437 series ▼ Si/Features ? □ y ? ? h t.3 S R R T f E « H j R - j u m o y * ? t 'f e g ^ q r t g U -sh a p e c o n ta c t m in im iz e s c o n ta c t m a r k o n so ld e r b a ll.

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •