NP351 Search Results

NP351

Abstract: NP351-16914 NP351-28508 FBGA 1760 65113 NP351 yamaichi
Contextual Info: NP351 Series Open Top Fine Ball Grid Array (FBGA) Part Number (Details) NP351 - 120 14 - * - * Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: 1,000MΩ min. at 100V DC

NP351

Abstract: NP351-064-148 NP351-180-139 212207 NP351-21653 NP351-064-227 X3640 np351-532 AC-28179 ac14425
Contextual Info: Series NP351 BGA / CSP 0.80mm Pitch TH - Open Top Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Mating Cycles: 1,000MΩ min. at 100V DC 100V AC for 1 minute

NP351-064-148

Abstract: NP351-18464 NP351 NP351-080-128 20890 14422 NP351-180-139 NP35 400X400 NP351-11230
Contextual Info: NP351 Series Open Top Fine Ball Grid Array (FBGA, 0.80mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:

NP351

Abstract: NP351 yamaichi NP3510 yamaichi IC Test Socket
Contextual Info: µBGAª Open top NP351 Series Arrays Characteristics 1,000M½or more at 100 VDC 700 VAC for 1 Minute 100m½ or less at 10mA/20mV (Initial) -55ûC ~ +170ûC Material PEI (Glass Filled) Beryllium Copper Gold over Nickel Insulator: Contact: Plating: NP351- 196 02- *

MCM65256-35

Abstract: LGA Application Notes motorola MCM65256
Contextual Info: fà MOTOROLA SEM ICO NDUCTO RS MCM65256 3501 ED B LU ESTEIN BLVD., A U S TIN , TEXAS 78721 Product P re v ie w HCMOS 2 5 6 K B IT R E A D O N L Y M E M O R Y (C O M P L E M E N T A R Y M O S T h e M C M 6 5 2 5 6 is a c o m p te rp e n ta ry M O S m a s k -p ro g ra m m a b le byte o rg a n ize d Read O n ly M e m o ry (R O M ). T he M C M p 5 2 5 6 is o rg a n ize d as

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

IC51-2084-1052-36

Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

socket Yamaichi ic51 qfp

Abstract: DP-24N IC-86 Kogyo welcon DIP SOCKET AUGAT DIP SOCKETS IC386 Enplas fpq FP-54 IC51-1004-395
Contextual Info: Sockets for Evaluating Surface and Through-Hole Mount Packages 1. SOCKET LIST Table 1 lists the sockets available on the market for evaluating the characteristics o f surface and through-hole package devices. For details, please inquire directly to the socket manufacturer.

IC354

Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
Contextual Info: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8

A37W

Contextual Info: M M OTOROLA SEMICONDUCTORS MCM65256 3501 ED BLUESTEIN BLVD., AUSTIN, TEXAS 78721 Product P review HCMOS ^ v 2 5 6 K B IT R E A D O N L Y M E M O R Y (C O M P L E M E N T A R Y M O S ) T h e M C M 6 5 2 5 6 is a c o m p le rp e n ta ry M O S m a s k -p ro g ra m m a b le byteo rg a n iz e d Read O n ly M e m o ry (R O M ). T he M C M 6 5 2 5 6 is o rg a n ize d as

PC1-044050-016

Abstract: 213-044-602 IC51-1964-1952 CQFP 256 PIN actel PC1-068050-001 PC1-084050-003 Enplas drawings IC149-160-023-S5 IC51-1764-1505 NP89-12110-KS
Contextual Info: Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype their designs using Actel’s one-time-programmable FPGAs. These sockets have been manufactured for Actel by Yamaichi

PT740 AB

Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

MH16464

Abstract: NP200-12 NP-120 NP120-12FR NP7-12 NP65-12FR US-NP-RS-004 NP12-6 NP24-12 NP12-12FR
Contextual Info: Range Summary Publication No: US-NP-RS-004 • March 2008 Sealed Rechargeable, Valve Regulated Lead-Acid Batteries GENERAL SPECIFICATIONS GENESIS NPH BATTERY SERIES Type FR Type* Volts ————— NPH2-12FR NPH3.2-12 NPH3.2-12FR Nominal Capacity 10hr rate-Ah

NP352

Abstract: IC280-484-206 NP364 NP378 NP440 NP404 IC409 IC280-960-276 NP367 IC398
Contextual Info: \ - f ^ ' \ 0.4mmPitch P ro d u c t Line-up P K G S iz e m m G r id O p en T o p T y p e 4 5 6 7 8 8,9 10,11 12,13,14 15,16 17,18,19 BGA N P437 series ▼ Si/Features ? □ y ? ? h t.3 S R R T f E « H j R - j u m o y * ? t 'f e g ^ q r t g U -sh a p e c o n ta c t m in im iz e s c o n ta c t m a r k o n so ld e r b a ll.

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3

wells cti

Contextual Info: Socket Recommendation for Actel FPGA Packages S o c k e t s for Prototyping with A c t e l F P G A s Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

Contextual Info: Range Summary NP Powerful solutions for industrial applications SEALED RECHARGEABLE, VALVE REGULATED LEAD-ACID BATTERIES Layout Illustration 1 2 3 4 6 7 8 9 5 Terminal Illustration 0.031 0.059 0.098 0.313 0.020 0.031 0.187 Faston Tab: 187 B Faston Tab: 187 A

Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
Contextual Info: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of