IC264 Search Results

Contextual Info: BGA _ IC264 Series Characteristics Insulation Resistance: Withstanding Voltage: 1000M Q or more at 100 VDC 100 VAC for 1 Minute Contact Resistance: 1Q or less at 10mA/20mV Initial -40’ C - +150'C Operating Temperature: Material

IC264

Contextual Info: IC264 - Open Top Ball Grid Array BGA Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Contact Force: 1,000MΩ min. at 100V DC 100V AC for 1 minute 1 Ω max. at 10mA/20mV max.

Contextual Info: IC264 Series Open Top Ball Grid Array (BGA, 1.50mm Pitch) Part Number (Details) IC264 - 225 01 - 1 - * - MF Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 Ω max. at 10mA/20mV max.

Contextual Info: BGA IC264 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage Contact Resistance Operating Temperature Contact Resistance 100M Q or m ore at 100VDC 100VAC for one m inute IQ or less at 10mA/20mV or less initial 40°C ~ +150°C 25g~35g per individual contact

Contextual Info: BGA IC264 Series IC264-22501-1- *-* Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No Mark: Both Pins 1 & 2 PN: Only Pin 1 NP: Only Pin 2 NN: No Pins Pin Count 225 Material PEI Glass Filled UL94V-0

Contextual Info: A Table Of Contents ^Arrays Pages Pin Grid Arrays / Zero Insertion Force PG A/ZIF PG A/ZIF PG A/ZIF Open top PG A/ZIF (Interstitial) PGA / ZIF (Open Top, Interstitial) NP89 NP161 NP171 NP236 NP178 9-10 11-12 13-14 15-16 17-18 IC264 NP276 19 20-21 Ball Grid Arrays

IC26-1403-GG4

Abstract: IC26-1603-GG4 ic26a IC26-2003-G d803 IC26-3206-GG4 IG26-4B06-GG4 IC26-1803-GG4 24G6 1013
Contextual Info: IC26 Series DIP 2.54mm Pitch GUBCTR0NIC5 Features 7 7 ’y ^X ® S A fc B & ih R o H S it ^ W Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant

BL p0d

Abstract: IC806 l51ii block diagram for EIO SLOT for Data Storage D17108 ekp 71 upd17108
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD17108 4 BIT SINGLE-CHIP MICROCONTROLLER The µPD17108, tiny microcontroller, consists of 1K-byte 512 x 16 bits ROM, 16 × 4 bit RAM, and 16 input/ output ports. The 17K architecture of the CPU uses general registers so that data memory can be manipulated directly

Contextual Info: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*

H8/2144

Abstract: Renesas H8/3644 microcontroller 7018f Renesas H8/3644 series microcontroller HS2190 E7000 SH7604 H8/3048BF 2128f6.inf 7055F H8S/2140
Contextual Info: Microcontroller & Microprocessor Product and Development Tool General Catalogue RMASIA-001-2003 Printed in Singapore Renesas Technology www.asia.renesas.com Crosstable Emulator Roadmap In-Circuit Emulator SuperH RISC Engine Processor Type E8000S SuperH RISC Engine

ic26

Contextual Info: 6/4/2014 IC26 Series DIP Dimensions | YAMAICHI ELECTRONICS Home | Site Map | Japanese | Our Worldwide Sites Search Dimension drawing Contact cross section Print board layout (Reference only) Table of dimensions Unit: mm Part Number No. of Contacts Pitch

Contextual Info: 1C 264 SERIES bga •Outline Dimensions FEATURES • Open top type sockets for B G A packages. • Pressing the 1C against contacts ensures high wiping reliability. • Changes to the 1C ball flatness are minimized by contacting the ball from the side to protect it from damage.

MSC 5518

Abstract: IC-8075 78p334 IC-8804 RA78K3 UPD78312 assembler 78P334LQ uPD78P334LQ upd78310 PPB2
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

TK74031

Abstract: TK74036 TK74017 TK74043 tk74013 TK74037 TK74030 TK74032 TK74014 TK74021
Contextual Info: TK740xxL DUAL LOW DROPOUT VOLTAGE REGULATOR FEATURES n n n n n n n n n n n n n APPLICATIONS 2 Channel LDO in one Package Outputs can be set by External Resistors High Precision Output Voltage ± 2.0 % or ± 60 mV Independent Active High On/Off Control for each LDO

8060c transistor

Abstract: 8060c transistor 8060c D17107
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD17107, 17107 A 4 BIT SINGLE-CHIP MICROCONTROLLER The µPD17107, tiny microcontroller, consists of 1K-byte (512 x 16 bits) ROM, 16 × 4 bit RAM, and 11 input/ output ports. The 17K architecture of the CPU uses general registers so that data memory can be manipulated directly

IC26-0803-GG4

Abstract: MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5
Contextual Info: YAMAICHI ELECTRONICS Production 1C Sockets IC26 S /y - X SIP IC 140$/'J-X (DIP) IC26Series(SIP) IC140Series(DIP) ►P02 1 I »-P09' IC30 î / ' J - X (SIP) IC1602/U—X(PLCC) IC30Series(SIP) IC160 Series(PLCC) IC140 $ /'J -X (SIP) IC 149S/U -X (QFP) IC140Series(SIP)