IC26 Search Results

FCP-40-03

Abstract: FCP-1403 FCP-1603-07 FCP-1603-0701 FCP-2806-07 FCP-2606-07 FCP-16-03 FCP-1403-0701 IC26 FCP-4003
Contextual Info: FC Series 1.27mm pitch Rat Cable IDC Connector Contact pitch 2.54mm FC Series (icv*-yMR&*«<7) 2 .5 4 m m p it c h ( ja Y A M A IC H I 'O ^ U = C T R 0 N IC 5 ( 1 .2 7 m m p it c h 7 7 7 Features • ICv * r y h < r—-7J\,z • ^ m w c v 'r v h&IC26:> U- X PP)JC30S/ U- X PP)

IC26-1403-GG4

Abstract: IC26-1603-GG4 ic26a IC26-2003-G d803 IC26-3206-GG4 IG26-4B06-GG4 IC26-1803-GG4 24G6 1013
Contextual Info: IC26 Series DIP 2.54mm Pitch GUBCTR0NIC5 Features 7 7 ’y ^X ® S A fc B & ih R o H S it ^ W Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant

Contextual Info: FEATURES ORDERING CODE • IC26—2010—GS3L Round pin contacts with four leaf springs. • Screw machined sleeves prevent solder or flux penetration. L : 12.84 tor wrapping use only • Standoffs prevent blow holes. Terminal length option Unmarked : 3.20 (standard)

Contextual Info: BGA _ IC264 Series Characteristics Insulation Resistance: Withstanding Voltage: 1000M Q or more at 100 VDC 100 VAC for 1 Minute Contact Resistance: 1Q or less at 10mA/20mV Initial -40’ C - +150'C Operating Temperature: Material

Contextual Info: M IC2660 IC2660 IttyBitty Charge Pump Preliminary Information General Description Features The IC2660 IttyBitty™ charge pump functions as a lowcurrent, step-up converter where conventional inductor based, dc-to-dc converters are too complex and expensive. This

IC264

Contextual Info: IC264 - Open Top Ball Grid Array BGA Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Contact Force: 1,000MΩ min. at 100V DC 100V AC for 1 minute 1 Ω max. at 10mA/20mV max.

Contextual Info: IC264 Series Open Top Ball Grid Array (BGA, 1.50mm Pitch) Part Number (Details) IC264 - 225 01 - 1 - * - MF Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 Ω max. at 10mA/20mV max.

IC26V-0603-GG4

Contextual Info: IC26V Series DIP 2.54mm Pitch Features w m x v -7 ti\ & a ,/ cs y ^ ' y ^ x < D m x ^ m ± RoHSJt^*MS Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant

ic26

Contextual Info: 6/4/2014 IC26 Series DIP Dimensions | YAMAICHI ELECTRONICS Home | Site Map | Japanese | Our Worldwide Sites Search Dimension drawing Contact cross section Print board layout (Reference only) Table of dimensions Unit: mm Part Number No. of Contacts Pitch

Contextual Info: PS SERIES r ^ F # f BOARD-to-BOARD SIP, DIP, PGA 1 .d k- AW •D IP TYPE •S IP TYPE FEATURES • Plugs designed to implement stack mounting of PC boards using conventional 1C sockets (IC26 and IC140 series for SIP/DIP, IC122 series for PGA). • A wide variety of terminal lengths available (3 types for DIP, 4 types

Contextual Info: FC SERIES 2.54mm p i& lh ^ fer UTswi pitch flat cakte cowiecfioft, JCsocket maitog type FEATURES S P E C IFIC A TIO N S • •PERFORMANCE Flat cable connectors for mating with 1C socket. • Applicable IC sockets: IC26 series (DIP , see page 7 IC30 series (DIP), see page 9

IC2660

Abstract: SOT-23-5 driver TI
Contextual Info: IC2660 miCREL IttyBitty Charge Pump Preliminary Information General Description Features The M IC2660 IttyBitty™ charge pum p functions as a lowcurrent, step-upconverterw hereconventionalinductorbased, dc-to-dc converters are too com plex and expensive. This

Contextual Info: IC26_CHAPTER_4_2000_2.copy Page 1 Tuesday, May 23, 2000 12:51 PM CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 IC26_CHAPTER_4_2000_2.copy Page 2 Tuesday, May 23, 2000 12:51 PM Philips Semiconductors

Contextual Info: IC26V Series SIP 2.54m m Pitch ypiffli Features w m x ' j - 7 b \ te htis y ^ v ^ X C D m A Z f f i l t x f y p j- x iC 'k - v T , i£A ,fc(D 7n-jt\-Ji,% iyjik &mwm rtab RoHSJI^^JS Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration

IC26-0310-GG4

Abstract: IC26-0510-GG4 IC26-0710-GG4 IC26-0410-GG4 IC26-1410-GG4 IC26-1310-GG4 IC26-1210-GG4 TY 1016
Contextual Info: IC26 Series SIP 2.54mm Pitch (@e£CTONIC5 ^ Features « X ' J - m t t A ,tc s 7 7 > y ^ X ig A € B & ih 7 , $ y \ t X 7 \ C . J ; ^ T N i* fv t c < D Z ? n - 7 b - ) l% m ± R o H S ^ W Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration

Contextual Info: BGA IC264 Series IC264-22501-1- *-* Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No Mark: Both Pins 1 & 2 PN: Only Pin 1 NP: Only Pin 2 NN: No Pins Pin Count 225 Material PEI Glass Filled UL94V-0

Contextual Info: 1C 26 SERIES DiP 2.54rmn pitch FEATURES ORDERING CODE • Round pin contacts with four leaf springs. • Screw machined sleeves prevent solder or flux penetration. • Standoffs prevent blow holes. IC26— 2003— GS3L L: 12.84 (ior wrapping use only! Terminal length option Unmarked : 3.20 (Standard)

Contextual Info: A Table Of Contents ^Arrays Pages Pin Grid Arrays / Zero Insertion Force PG A/ZIF PG A/ZIF PG A/ZIF Open top PG A/ZIF (Interstitial) PGA / ZIF (Open Top, Interstitial) NP89 NP161 NP171 NP236 NP178 9-10 11-12 13-14 15-16 17-18 IC264 NP276 19 20-21 Ball Grid Arrays

IC26-0803-GG4

Abstract: MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5
Contextual Info: YAMAICHI ELECTRONICS Production 1C Sockets IC26 S /y - X SIP IC 140$/'J-X (DIP) IC26Series(SIP) IC140Series(DIP) ►P02 1 I »-P09' IC30 î / ' J - X (SIP) IC1602/U—X(PLCC) IC30Series(SIP) IC160 Series(PLCC) IC140 $ /'J -X (SIP) IC 149S/U -X (QFP) IC140Series(SIP)

Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166I April 2001 – Revised January 2006 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not

Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166H April 2001 – Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not

SD 5143

Abstract: 5509A SPRS205K TMS320VC5509A XDS510 PORT14
Contextual Info: TMS320VC5509A Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS205K November 2002 − Revised January 2008 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments

TMS320

Abstract: TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp
Contextual Info: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

circuit diagram for 7.1 home theatre amplifier

Abstract: simple 5.1 home theatre amplifier circuit diagram with usb philips home theatre tea7000 5.1 home theatre audio system diagram for making 7.1 home theatre schematic diagram SmD TRANSISTOR 1fs circuit schematic for wireless headphone with mic schematic diagram of bluetooth headphone circuit for 7.1 home theatre system
Contextual Info: SAA8200HL Ensation Base integrated wireless audio baseband Rev. 02 — 17 October 2005 Preliminary data sheet 1. General description The Ensation Base, SAA8200HL, is part of the integrated wireless audio system chip set offered by Philips. This chip set enables the development of low cost wireless digital audio