27X27 Search Results

Contextual Info: LIGHT BAR 27X27 9 LED DATA SHEET 27 Face Length MM 27.0 Face Width MM 27.0 Height MM 11.0 Pin Spacing MM 5.1 Row Spacing MM No.of pins Pins KLLB 274X 27.0 1 2 2 1 27.0 2 2.0 Seg. Vf @10mA Volts KLLB 274X KLLB274X 11.0 (5.1) Tolerance ± 0.2 mm Note : All Dimensions are in mm

PBGA-316

Abstract: PRBG0316DB-A 316F
Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DB-A D Previous Code 316F7A MASS[Typ.] 2.6g A ZD A B D1 φb φx M S AB e y S Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 1011121314151617181920 S Index mark Reference Symbol

Contextual Info: Label sheet, DIN A4 - BMKL 27X27 SR - 0803692 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid

Contextual Info: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical

Contextual Info: 256 PIN PLASTIC BGA 27x27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of

PRBG0449FA-A

Contextual Info: JEITA Package Code P-BGA449-27x27-1.00 RENESAS Code PRBG0449FA-A D Previous Code 449F7T MASS[Typ.] 3.0 A D1 b B A S AB ZD e ZE AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S 1 2 3 4 5 6 7 8 9 10111213141516171819202122232425 S Index mark

P-BGA256-27x27-1

Abstract: PRBG0256DA-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

PRBG0316DA-A

Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DA-A D Previous Code 316F7X-A A MASS[Typ.] 2.6g A B D1 ZD b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

PRBG0256DD-A

Abstract: 2.5G P-BGA-256-2
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

PRBG0425FB-A

Contextual Info: JEITA Package Code P-BGA425-27x27-1.00 RENESAS Code PRBG0425FB-A D Previous Code 425F7T MASS[Typ.] 2.3g A D1 φb B A φx M S AB ZD e y S AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 10111213141516171819202122232425

BP-256

Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5

Contextual Info: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S y A1 e S φb φ x1 M S A B φ x2 M S S DIMENSIONS 27.00±0.20 D1 24.00

27x27

Abstract: 225-PIN
Contextual Info: 225-PIN PLASTIC BGA 27x27 A S B C Index mark 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E D C B A P J R I H K L φM S F E S G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.

Contextual Info: 256 PIN TAPE BGA HEAT SPREADER TYPE (27x27) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M detail of A part E S A B *1 S *2 detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.

GT-64120A

Abstract: IEEE754 RM7000 RM7065A mips uart
Contextual Info: RM7065A • PACKAGING • Fully Static 0.18µ CMOS design with dynamic power down logic • 256 pin TBGA package, 27x27 mm DEVELOPMENT TOOLS • Operating Systems: • Linux by MontaVista and Red Hat • VxWorks by Wind River Systems • Nucleus by Accelerated Technology

d 1047

Contextual Info: 256 PIN TAPE BGA 27x27 A U B A B W A1 A2 V D X C Y Index mark J A S H B G F L E M M S A B *1 P M S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Extract from the online catalog BMKL 27X27 SR Order No.: 0803692 The figure shows a version of the article Label sheet for laser printer, sheet format: DIN A4, 1 sheet = 54 labels,

Contextual Info: 256-PIN PLASTIC BGA 27x27 D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D A 30° A2 y1 S S y A1 e S φb φ x1 M S A B φ x2 M S DIMENSIONS 27.00±0.20 D1 24.00

Contextual Info: 544-PIN PLASTIC BGA 27x27 D w S A D1 ZD ZE A 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 B E1 E w S B INDEX MARK (UNIT:mm) A y1 ITEM D A2 S S y A1 e S φb φx M S AB AE AC AA W U R N L J G E C A AF AD AB Y V T P M K H F D B D1 E

PBGA225

Abstract: PRBG0225CB-A
Contextual Info: JEITA Package Code P-BGA225-27x27-1.50 RENESAS Code PRBG0225CB-A D Previous Code 225F7X-B MASS[Typ.] 2.0g A D1 b S AB B A ZD e e A1 R P N M L K H G F E D C ZE E E1 J B A y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Reference Symbol D E A A1 e b x y

Contextual Info: Snap-in markers - UC-EMP 27X27 - 0825451 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid

RM7065C

Abstract: IEEE754 RM7065A
Contextual Info: RM7065C PACKAGING • • Fully Static 0.13µ CMOS design with dynamic power down logic 256 pin TBGA package, 27x27mm on Ex pe rt on Th ur sd ay ,0 8A ug us t, • Dual issue symmetric superscalar microprocessor with instruction prefetch optimized for system level

CG717

Contextual Info: R Ceramic Column Grid Array CG717 Package PK086 (v1.0) January 18, 2006 27X27-COLUMN CERAMIC CGA, 1.27MM PITCH (CG717) 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

27X27

Abstract: BGA 27X27
Contextual Info: 225-PIN PLASTIC BGA 27x27 A S B C Index mark 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E D C B A P J I R H K L φM S F S E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.