IC189 Search Results

TSOP 54 socket

Abstract: IC189 TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230
Contextual Info: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 042 2 - 025 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65

IC189-0482-077

Contextual Info: CLICK HERE TO GO BACK TO TABLES 48 Pins 37.54±0.05 30.94±0.05 15.00±0.05 24.34±0.05 0.50±0.05 2–∅1.6 +0.1 0.5x23=11.50±0.1 IC189-0482-077 * 48–∅0.7 +0.1 38.00±0.05 STATEMENT OF POLICY: All technical specifications and data contained herein are believed to be reliable.

IC189-0162-019

Contextual Info: o r^ - MODIFICATIONS TOLERANCE PART NUMBER 2954426 PART NUMBER WINSLOW INTERNATIONAL LTD R.S. COMPONENTS PO BOX 99 CORBY NORTHANTS 2954426 DESCRIPTION 1C Socket Adaptor, Yamaichi, SOP, surface mount, IC189-0162-019 0.0 +/-0.1 0.00 17-0.01 0.000 I/-0.001 DIMENSIONS

IC189

Abstract: IC189-0562-067 Layouts IC189 Series SOP 56 socket IC189-0562-078 IC189-0482-077 IC189-0702-074 IC189-0482-094 yamaichi IC Test Socket
Contextual Info: SOPP / SOIC TyOpyppeenI To&&opII IC189 Series Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contacts Design No. Inline Memory Modules Positioning Pin N: Without Positioning Pin

Contextual Info: SOP / SOIC OPEN TOP Type I &Type II IC189 Series FEATURES • Open top low actuation force socket CHARACTERISTICS 1,000MQ min imum 700 VAC RMS for one minute C ontact Resistance 30mO maximum at 10mA O perating Tem perature -40°C ~ +150°C C ontact Force

Contextual Info: MODIFICATIONS TOLERANCE PART NUMBER 2954460 PART NUMBER WINSLOW INTERNATIONAL LTD R.S. COMPONENTS PO BOX 99 CORBY NORTHANTS 2954460 DESCRIPTION 1C Socket Adaptor, Yamaichi, SOP, surface mount, IC189-0322-004 0.0 +/-0.1 0.00 +/- 0.01 0.000 f/-0.001 DIMENSIONS

IC189

Abstract: IC189-0282-042 IC189-0242-021 SOP 56 socket IC189-0162-003 IC189-0382-037 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0202-017 IC189-0322-005 016-2003
Contextual Info: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189 - 016 2 - 003 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

TSSOP YAMAICHI SOCKET

Abstract: IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189 IC189-0422-025 from TSOP Type II ssop40 IC189-0482
Contextual Info: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 040 2 - 068 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

IC189

Abstract: IC189-0562-078 IC189 Series IC189-0282-042 IC189-0162-019 IC189-0482-094 IC189-0162-003 IC189-0382-037 IC189-0442-065 Yamaichi
Contextual Info: SOP / SOIC Type I & II Open Top IC189 Series IC189 - 016 2- 019 * - * Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contacts Design No. Positioning Pin N: Without Positioning Pin

ic189-0882-099

Abstract: IC189-0642-007 IC189-0642 IC189 0642 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0642-041 IC189-0642-069
Contextual Info: IC189 Series Open Top SOP, SSOP, TSOP (Type I and II) Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189 - 064 2 - 007 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

IC189

Abstract: IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0282-042 dead bug IC189-0242-021
Contextual Info: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 016 2 - 019 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65

Contextual Info: SOP / SOIC Type I & II Open Top IC189 Series Socket Series No. of Sides with Contacts Design No. Positioning Pin N: Without Positioning Pin No Mark: With Positioning Pin Material PEI (Glass Filled) Beryllium Copper Gold over Nickel Protection Key K: With Protection Key

tsop 338

Abstract: TSOP 54 socket IC189-0562-078 IC189-0562-067 IC189 TSOP 56 socket IC189-0702-074 tsop 138 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0642
Contextual Info: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 064 2 - 007 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

Contextual Info: OPEN TOP TYPE TEST & BURN-IN IC SOCKETS S.O.P Small Outline Package IC189 Series • SPECIFICATION S • Open top low actuation force socket CHARACTERISTICS Insulation Resistance W ithstanding Voltage Contact Resistance Operating Tem perature Contact Force

IC A 103 GF

Abstract: IC189 yamaichi IC Test Socket
Contextual Info: Yamaichi's IC189 SOP/SOIC Socket for Test & Burn-In Specifications: Insulation Resistance: 1,000M ohms minimum @ 500VDC Withstanding Voltage: 700 VAC for one minute Contact Resistance: 30 ohms max. @ 10mA/20mV Operating Temperature: -40 to +150C Body Material: PEI GF UL94V-0

PC1675G

Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT //PC1675G GENERAL PURPOSE WIDE BNAD AMPLIFIER DESCRIPTION The /¿PC1675G is a silicon monolithic integrated circuit employing small package 4pins mini mold and designed for use as a wide bnad amplifier convers from HF band to UHF band.

IC-1891

Abstract: PC1676G
Contextual Info: DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1676G GENERAL PURPOSE WIDE BNAD AMPLIFIER DESCRIPTION The µPC1676G is a silicon monolithic integrated circuit employing small package 4pins mini mold and designed for use as a wide band amplifier covers from HF band to UHF band.

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

Contextual Info: Receptacles Design Rules Part Number Ordering Procedure Acceptable Socket 51- 1004818- * 1 * 0 Terminal Length Socket Series Code Minimum Pin Length: Maximum Pin Length: Material Socket Contact Type Insulator: Inner Contact: Insulator Plate Thickness Outer Sleeve:

Contextual Info: Design Rules Acceptable Socket pefmJnaTCinpr^ ^Minimum Pin Lengtm Maximum Pin Length: Insulator:"^ Inner Contact: 2.4mm 3.8mm If above 3.8mm, groove is required on the insulator "Polyethenmide (PEI) Beryllium Copper (BeCu) 172 heat treated Gold plating (30p") over Nickel plating (50p”)

CRYSTAL 4MHz smd 2pin

Abstract: MSP430F2618IPM MSP-FET430F5137RF900 SLAU278H YAMAICHI ic357 MSP-TS430PZ100C ic357 MSP430G2452 MSP-TS430PN80USB 32,768 SMD Quarz
Contextual Info: MSP430 Hardware Tools User's Guide Literature Number: SLAU278H May 2009 – Revised December 2011 2 SLAU278H – May 2009 – Revised December 2011 Submit Documentation Feedback Copyright 2009–2011, Texas Instruments Incorporated Contents . 9

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

MSP430 USB-DEBUG

Abstract: SLAU138H MSP-FET430UIF MSP430 IAR Embedded Workbench ide 430 f2370 IO430 MSP-TS430DL48 MSP430F44xIPZ 49P4 eZ430
Contextual Info: MSP-FET430 Flash Emulation Tool FET (For Use With IAR Embedded Workbench Version 3.x) User's Guide Literature Number: SLAU138H June 2004 – Revised September 2007 2 SLAU138H – June 2004 – Revised September 2007 Submit Documentation Feedback Contents