MC100LVEP16 Search Results

D1875

Abstract: HVP16 KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

100LVEP16

Abstract: KVP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16 2015 soic8
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16 marking code 5y
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 8 HVP16 AYWWXG G 8 1 Features TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical

Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 8 HVP16 AYWWXG

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V

KVP16

Abstract: HVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3VĄECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

a1760

Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 100H646
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

CML ECL termination

Abstract: MC100EP16 MC100EP16F MC100EP16VS MC100EP16VT MC100LVEP16 MC10EP16 MC10EP16T MC10LVEP16 NBSG16
Contextual Info: SGD508/D Jan-2002 Rev 0 1 to 12 GHz Differential Receiver/Drivers Bandwidth GHz Gain Input Termination (50Ω) Open Input Default State (D, D) Input Level Output Level Output Enable LOW, HIGH ECL, CMOS, CML, LVDS RSECL(3) No 1 FCBGA 16 Yes(1) LOW, HIGH ECL, CMOS,

CS5170

Abstract: mps2112 MPS2112ZL1 100A 300V IGBT MC3346P CS4124YDW16 ON Semiconductor PRICE BOOK 12V to 220V smps inverter bd234 igbt ac motor speed control
Contextual Info: SGD501/D REV 8, January 5, 2002 NORTH AMERICA SALES AND DISTRIBUTION ON Semiconductor PRICE BOOK THIS BOOK IS IN COMPUTER SORT PRODUCT CLASSIFICATION – Please see General Information Section EFFECTIVE DATE: JANUARY 5, 2002 General Information Elimination Of Ozone Depleting Chemicals . . . .

Contextual Info: 16-Bit, 400 MSPS Digital-to-Analog Converter AD9726 FEATURES FUNCTIONAL BLOCK DIAGRAM CLK+ CLK– CLOCK DISTRIBUTION AND CONTROL SCLK DCLK_OUT– DB[0]– DCLK_IN+ IOUTB REFIO FSADJ Figure 1. . GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The AD9726 is a 16-bit digital-to-analog converter DAC

KLT20

Abstract: k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139
Contextual Info: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and

32K243-40M

Abstract: MC100EL23D MC10EL3 MC10EL32 nb6l11d MC10EP08D MC100EL23 32K2 MC100EP89
Contextual Info: ECLSOIC8EVB Evaluation Board User's Manual for High Frequency SOIC 8 http://onsemi.com EVAL BOARD USER’S MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers

3335

Abstract: MC100EL91 MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

HDMI to vga pinout

Abstract: MAX9180 lvds 26 pin MAX9259 MAX9374 MAX9384 Video sync splitter vga SK4401 HDMI to VGA Cable diagram MAX9324
Contextual Info: High-Speed Interconnect 8th Edition February 2009 Industry’s most versatile portfolio of high-speed interface ICs Automotive SerDes for video and audio data Rear-Seat Entertainment Navigation Safety Cameras Fanout buffers, muxes, and crosspoint switches for clock and data distribution

motorola HEP cross reference

Abstract: EPT 4045 KPT23 motorola HEP 320 cross reference vef 202 manual KEP52 MC10EP016 HEP 801 hep51 HEP64
Contextual Info: BR1513/D Rev. 2, Apr-2001 ECLinPS Plus Device Data ECLinPS Plus Device Data Advanced ECL in Picoseconds BR1513/D Rev. 2, Apr–2001  SCILLC, 2001 Previous Edition  2000 “All Rights Reserved” ECLinPS, ECLinPS Lite, and ECLinPS Plus are trademarks of Semiconductor Components Industries, LLC.

kvt22

Abstract: KVL11 KPT23 ON Semiconductor marking k1648 KLT20 HEL16 KEL32 KEL01 xaa9646
Contextual Info: AND8002/D ECLinPS, ECLinPS Lite and ECLinPS Plus Device Type and Date Code Marking Guide Gary Richards, ECL Logic Product Engineering http://onsemi.com APPLICATION NOTE need ON Semiconductor’s marking spec 12MON00232D and S.O.P. 7–19 ID of Products to Location of

SC64046

Abstract: SC64046FNG SC64046FN SC64029FN SB99026MNG SB99026MNR2G MC100EP016A sb99026mn SC6404 MC100EP101
Contextual Info: EO1_LISTED_PART_ID MC100ELT23D MC100ELT23DG MC100ELT23DR2 MC100ELT23DR2G MC100ELT23DT MC100ELT23DTG MC100ELT23DTR2 MC100ELT23DTR2G MC100H600FN MC100H600FNG MC100H600FNR2 MC100H600FNR2G MC100H601FN MC100H601FNG MC100H601FNR2 MC100H601FNR2G MC100H602FN MC100H602FNG

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 E1651
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION Normal operation of Integrated Circuits will cause electrical power, P, to be converted into heat by the die

AD9726

Abstract: MC100LVEP16 DB10 logic ic 7676 pin diagram MC597X4-015W-32.768000MHZ
Contextual Info: 16-Bit, 400 MSPS D/A Converter AD9726 FEATURES FUNCTIONAL BLOCK DIAGRAM CLK+ CLK– CLOCK DISTRIBUTION AND CONTROL CSB SCLK SPI DCLK_OUT– SDO LVDS OUTPUT DRIVER RESET CALIBRATION MEMORY DB[0]+ DB[0]– DCLK_IN+ APPLICATIONS DATA SYNCHRONIZATION DB[15]+ DB[15]–