CY7C911 Search Results

CY7C909

Abstract: CY7C911-30JC cy7c911
Contextual Info: CY7C909 CY7C911 CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers Features • Fast — CY7C909/11 has a 30 ns min. clock to output cycle time; commercial and military • Low Power — I c e (max.) = 55 mA; commercial and military • V'cc margin — 5 V ± 10%

Contextual Info: CY7C909 CY7C911 CYPRESS SEMICONDUCTOR Features • Fast — CY7C909/11 has a 30-ns min. clock-to-output cycle time (com­ mercial and military) • Low power — Ic c (max.) = 55 mA (commercial and militaiy) • V cc margin — 5V+10% — All parameters guaranteed over

CY7c911

Abstract: CY7C909 stk 654 C909 CY7C911-30PC Register push pop
Contextual Info: CY7C909 CY7C911 CMOS Micro Program Sequencers CYPRESS SEMICONDUCTOR Features • Fast — CY7C909/11 has a 30-ns min. clock-to-output cycle time (com­ mercial and military) • Low power — Icc (max.) = 55 mA (commercial and military) • V<x' margin —5V+1»%

CY7C9116-35DC

Abstract: A2ND CY7C9116 CY7C9116-45DC CY7C517 CP4043 CP-59 CY7C9116-65DC DA1215 7C9115
Contextual Info: CY7C9115 CY7C9116/CY7C9X17 ¡s ZÆ , S jS W J ^ y p p p q c ; — •- - CMOS 16-Bit Microprogrammed ALU SEMICONDUCTOR Features • Fast — 35-ns worst-case propagation delay, Ito Y • Low power CMOS — Ice (max. at 10 MHz = 145 mA (commercial) — Icc (max. static) = 6 8 mA

YJ 1100 6

Abstract: scr 9117 Inverter YEC
Contextual Info: CY7C9115 CY7C9116/CY7C9117 CYPRESS SEMICONDUCTOR Features • Fast — 35-ns worst-case propagation delay, I to Y • Low power CMOS — I c c max. at 10 MHz = 145 mA (commercial) — I c e (max. static) = 68 mA (commercial) CMOS 16-Bit Microprogrammed ALU

A2ND

Abstract: CY7C9116 7C9116 7C9115
Contextual Info: CY7C9115 CY7C9116/CY7C9117 CYPRESS SEMICONDUCTOR CMOS 16-Bit Microprogrammed ALU CY7C9117 separate I/O — One and two operand arithmetic and logical operations — Bit m anipulation, field insertion/ extraction instructions — Eleven types of instructions

CY7C911

Abstract: 7c909
Contextual Info: CY7C909 CY7C911 CYPRESS SEMICONDUCTOR CMOS Micro Program Sequencers • Capable o f withstanding > 2001V stat­ ic discharge voltage Features • Fast — C Y7C909/U has a 30-ns min. clock-to-output cycle time (com­ mercial and military) • Low power — I(X (max.) = 55 mA (commercial

AXP 209

Abstract: UPD65031 UPD65070 UPD65006 intel 80487 SCX6206 HG62B40 UPD65022 mb86901 UPD71641
Contextual Info: _► ADVANCED Device to PGA Socket Cross Reference INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 ■Email advintcorp@aol.com ■Internet http://www.advintcorp.com Actel Device#

cy7c9101

Abstract: CY2901 CY7C190 PLD20RA10 CY2149 CY7C122 CY7C148 CY7C149 CY7C150 22V10-Macrocell
Contextual Info: Military Product Selector Guide Static RAMs Size Organization 64 64 1K 1K 4K 4K 4K 4K 4K 8K 8K 16K 16K 16K 16K 16K 16K 16K 16K 16K 32K 32K 32K 32K 32K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 64K 256K 256K 256K 256K 256K 256K 256K 1M 1M

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

NEC B1100

Abstract: b1100 nec UPD65031 PD65031 UPD650 MCA600ECL upd65022 UPD65012 upd65051 UPD65006
Contextual Info: ADVANCED . INTERCONNECTIONS « Device To PGA Socket Cross Reference 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 . Tel. 4 0 1 -8 23 -52 0 0 • FAX 401-823-8723 Device To PGA Socket Cross Reference Altera Device # Footprint # EP1800 EPM 5128 EPM5192

HD68HCOOOY12

Abstract: HD64400 ad 7137 CY7C9101 8207 siemens MOTOROLA 68012
Contextual Info: SOCKETS S E M I-C O N D U C T O R CRO SS REFERENCE AMD Device P/N AM29030 AM29117 AM29325 AM29331 AM 29334 3500 SERIES AM80186 AM80286 A9850 AM95C60 AM 29000 AM29050 RN P/N PGA-146CH3-S PGA-068CH3-S PGA-145AH3-5 PGA-120BH3-S PGA-120BH3-S PGA-169BH3-S PGA-068CH3-S

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the

CY7C2901

Contextual Info: ÌB Ìcy p ress • Table 10. Die Sizes of Cypress Devices continued P a rt N um ber Size (mil2) P a rt N um ber Size (mil2) ECL Logic CY 2909A 7968 CY100E301L 14875 CY2910A 21750 CY100E302L 14875 CY2911A 7968 CY100E422 6960 11800 CY100E474 10830 CY7C510