CY100E494 Search Results

SSC 9101

Abstract: c494 223A10
Contextual Info: EbE D CYPRESS mg • ssa^bba 0004401 y ■ SEMICONDUCTOR CYPRESS . : PRELIM INARY i - •••••• ^ SEMICONDUCTOR T ^ U S -iO CY1E494 JÇŸÎ5SÎÎ1 CY100E494 ■ ■■ . 16,384 x 4 ECL Static RAM • Open em itter output for ease of memory expansion

Contextual Info: CY10E494 CY100E494 CY101E494 CYPRESS SEMICONDUCTOR 16,384x4 ECL Static RAM Features • Capable o f w ithstanding >2001V E SD • 16,384 x 4 bits organization • Open emitter output for ease of memory expansion • Ultra high speed/standard power • Industry-standard pinout

K74 PACKAGE DIAGRAM

Abstract: IR 10e 1h
Contextual Info: = ^~' _ = p r e l im in a r y . ^ SEMICONDUCTOR Features • CY10E494 CY100E494 CY101E494 16,384 x 4 bits organization • Ultra high speed/standard power — tAA = 7 ns — I f E — 180 mA 16,384 x 4 ECL Static RAM • Open emitter output for ease of

1r 10e

Abstract: N25U
Contextual Info: CY10E494 CY100E494 CY101E494 " 'Y P P F Ç Ç 1 6 ,3 8 4 x 4 ECL Static RAM SEMICONDUCTOR Features • 16,384 x 4 bits organization • Ultra high speed/standard power — tAA = 7 n s — IEK = 180 mA • Low-power version — tAA = 12 ns — I e e = Î35 mA

Contextual Info: r CYPRESS SEMICONDUCTOR Features • Open em itter output for ease of memory expansion • 16,384 x 4 bits organization • Ultra high speed/standard power • — tAA = 7 ns Industry standard pinout Functional Description — IE E = 180 mA • CY1E494 CY10E494

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the

CY7C2901

Contextual Info: ÌB Ìcy p ress • Table 10. Die Sizes of Cypress Devices continued P a rt N um ber Size (mil2) P a rt N um ber Size (mil2) ECL Logic CY 2909A 7968 CY100E301L 14875 CY2910A 21750 CY100E302L 14875 CY2911A 7968 CY100E422 6960 11800 CY100E474 10830 CY7C510