144 CERAMIC PIN GRID ARRAY CPGA Search Results

CPGA144

Abstract: SOT26 sot260
Contextual Info: PDF: 2002 Nov 04 Philips Semiconductors Package outline SOT260-2 CPGA144: ceramic pin grid array package; 144 pins; body 40 x 40 x 2.3 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e R e P N M L K J H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

CERAMIC PIN GRID ARRAY 120 pins

Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

CX3001

Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
Contextual Info: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

CERAMIC QUAD FLATPACK CQFP 14 pin

Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
Contextual Info: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.

BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year

m6845

Abstract: NA51 transistor AMI 52 732 V DL651 M82530 MXI21 dl541 DF421 DF101 grid tie inverter schematics
Contextual Info: “The new 0.6µm gate array and standard cell families from AMI provide outstanding quality and selection . . . setting performance standards in 0.6µm ASIC products . . . ” • 130 ps gate delays fanout = 2, interconnect length = 0mm ■ Double and Triple Metal Interconnect; up to 900,000 gate

P/N146071

Contextual Info: /u o o /d /o d . 1»»*+ lu w ò u d y , iv id y Revision: Friday, June 24,1994 3f CYPRESS PRELIMINARY Very High Speed 8K 24K Gate CMOS FPGA — 16-bit counter operating at 100 MHz consumes 50 mA — Minimum Iol of 12 mA and Ioh of 8mA • Flexible logic cell architecture

Contextual Info: m e iid iiitu v iu iiu ciy , ü u iiü io , i» » £ Revision: Tuesday, May 10,1994 CY7C385A CY7C386A CYPRESS Features • Very high speed — Loadable counter frequencies greater than 100 MHz — Chip-to-chip operating frequencies up to 85 MHz — Input + logic cell + output delays

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

TTL 740 NAND propagation delay

Abstract: NA51 equivalent transistor AMI8G65 OB83 G392 IB09X1 MG82C54 MICROCONTROLLER-8051 NA21 na52 transistor
Contextual Info: "AMI’s 0.8µm Gate Array family is simply the best 0.8µm on the market . . . one of the highest performance, yet lowest cost array products available today . . ." • Designed for 3V, 5V, or 3V/5V mixed supplies ■ 210 ps gate delays fanout = 2 ■ 5,000 to 663,000 available gate densities

FPGA 144 CPGA 172 PLCC ASIC

Abstract: A144 CY7C386A CY7C387A CY7C387A-2GC CY7C388A CY7C387A2AI
Contextual Info: CY7C387A CY7C388A PRELIMINARY CYPRESS Very High Speed 8K 24K Gate CMOS FPGA Features — 16-bit counter operating at 100 MHz consumes 50 mA — Minimum I o l of 12 mA and Ioh °f • Very high speed — Loadable counter frequencies greater than 100 MHz — Chip-to-chip operating frequencies

clcc 68

Abstract: CLCC 44 CLCC 84 JFGE6300 LCC 44 Fairchild 100K series ECL FGE0500 CLCC 100 F100K CPGA
Contextual Info: Gate Array 9 ^ ° Products FAIRCHILD A Schlumberger Company CVyxa 005595 £5$ S ' /= < S ^ First/Second Quarter 1986 Gate Array Division Fairchild Gate Array Division offers complete in-house design and production capabilities for high performance ECL and

Contextual Info: n Military Logic CeN Arrays XC2018B, XC3020B, XC3042B, XC3090B Product Specifications INTRODUCTION Xilinx introduced the first field programmable gate array FPGA in 1985. The development of the PGA was the result of a number of technical breakthroughs and truly

clcc 68

Abstract: CLCC 44 Fairchild 100K series ECL CPGA routing CLCC 24 layout CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC leaded CHIP CARRIER CLCC 68 CPGA132 CPGA CLCC 84
Contextual Info: Gate Array Products FAIRCHILD A Schlum berger Com pany First/Second Q uarter 1986 Gate Array Division Fairchild Gate Array Division offers com plete in-house design and production capabilities for high perform ance ECL and CMOS gate arrays. Featured with all Fairchild ECL gate arrays are speed/power

atmel 838

Abstract: atmel 906 ATMEL 712 atmel 532 ATMEL 706 atmel 751 BGA 168 atmel 635 atmel 344 verilog code for 32 bit risc processor
Contextual Info: Features • High-speed - 100 ps Gate Delay - 2-input NAND, FO = 2 nominal • Up to 6.9 Million Used Gates and 976 Pins • System Level Integration Technology – Cores: ARM7TDMI and AVR RISC Microcontrollers, OakDSP™ and LodeDSPCores™, 10T/100 Ethernet MAC, USB and PCI Cores

CM4081

Abstract: CY7C385A-1AI CY7C385A CY7C386A
Contextual Info: CY7C385A CY7C386A CYPRESS Very High Speed 4K 12K Gate CMOS FPGA — Fast, fully automatic place and route — Waveform simulation with back an­ notated net delays — PC and workstation platforms Robust routing resources — Fully automatic place and route of

Arm processor vlsi technology

Abstract: PC302 QFP 128 bonding
Contextual Info: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec

proteus

Abstract: HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208
Contextual Info: FPGA Replacement for 3.3-Volt Xilinx Products Introduction Proteus is a Chip Express FPGA • replacement program. In its initial release, supplies Proteus is available as a 5-volt product family serving the needs of specific Xilinx 4000E/EX devices and a Proteus 3.3-volt

atmel 0945

Abstract: atmel 428
Contextual Info: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3