144 CERAMIC PIN GRID ARRAY CPGA Search Results

CPGA144

Abstract: SOT26 sot260
Contextual Info: PDF: 2002 Nov 04 Philips Semiconductors Package outline SOT260-2 CPGA144: ceramic pin grid array package; 144 pins; body 40 x 40 x 2.3 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e R e P N M L K J H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

CERAMIC PIN GRID ARRAY 120 pins

Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
Contextual Info: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

CX3001

Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
Contextual Info: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

Contextual Info: •A M I Packaging Availability AMERICAN MICROSYSTEMS, INC. August 1996 AMI offers you space-saving and cost-effective packages and package processes spanning a broad spectrum of capabilities. AMI can meet your package requirements in a variety of ways. You can choose from ten basic package

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

CERAMIC QUAD FLATPACK CQFP 14 pin

Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
Contextual Info: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.

CQ208

Abstract: CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CF160 CERAMIC PIN GRID ARRAY 120 pins TQFP Package 44 lead PB256 PF100 PF144 PL84
Contextual Info: HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP. The TQFP package has a nominal thickness of only

tray matrix bga

Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
Contextual Info: u Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Revision Status Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A 3/1/03 1-1 u Chapter 1 Codes and Carrier Options REVISION STATUS

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year

CY7C386A-1AC

Abstract: CY7C386A-0AC 7C385A CY7C385A-2AC
Contextual Info: CY7C385A CY7C386A Very High Speed 4K 12K Gate CMOS FPGA Features D Very high speed D D D D D Ċ Loadable counter frequencies greater than 150 MHz Ċ ChipĆtoĆchip operating frequencies up to 110 MHz Ċ Input + logic cell + output delays under 6 ns Unparalleled FPGA performance for

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

m6845

Abstract: NA51 transistor AMI 52 732 V DL651 M82530 MXI21 dl541 DF421 DF101 grid tie inverter schematics
Contextual Info: “The new 0.6µm gate array and standard cell families from AMI provide outstanding quality and selection . . . setting performance standards in 0.6µm ASIC products . . . ” • 130 ps gate delays fanout = 2, interconnect length = 0mm ■ Double and Triple Metal Interconnect; up to 900,000 gate

P/N146071

Contextual Info: /u o o /d /o d . 1»»*+ lu w ò u d y , iv id y Revision: Friday, June 24,1994 3f CYPRESS PRELIMINARY Very High Speed 8K 24K Gate CMOS FPGA — 16-bit counter operating at 100 MHz consumes 50 mA — Minimum Iol of 12 mA and Ioh of 8mA • Flexible logic cell architecture

Contextual Info: m e iid iiitu v iu iiu ciy , ü u iiü io , i» » £ Revision: Tuesday, May 10,1994 CY7C385A CY7C386A CYPRESS Features • Very high speed — Loadable counter frequencies greater than 100 MHz — Chip-to-chip operating frequencies up to 85 MHz — Input + logic cell + output delays

CPGA large cavity

Contextual Info: MECHANICAL DATA MCPG004 – OCTOBER 1994 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

Contextual Info: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)

Contextual Info: CY7C385A CY7C386A i f CYPRESS Very High Speed 4K 12K Gate CMOS FPGA — Fast, fully automatic place and route — Waveform simulation with back an­ notated net delays — PC and workstation platforms Robust routing resources — Fully automatic place and route of