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    68 CERAMIC LEADLESS CHIP CARRIER LCC Search Results

    68 CERAMIC LEADLESS CHIP CARRIER LCC Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    R80186 Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 Visit Rochester Electronics LLC Buy
    5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    MR82510/B Rochester Electronics LLC Serial I/O Controller, 1 Channel(s), CMOS, CQCC28, CERAMIC, LCC-28 Visit Rochester Electronics LLC Buy
    X28C512EM-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Visit Rochester Electronics LLC Buy

    68 CERAMIC LEADLESS CHIP CARRIER LCC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    pkg 4015

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit pkg 4015

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit

    documentation for 32 bit alu in vlsi

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns documentation for 32 bit alu in vlsi CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit

    smj320c25

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C25Ä SGUS007D 68-Pin 100-ns 80-ns smj320c25

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit

    ar716

    Abstract: LACT smj320c25
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit ar716 LACT smj320c25

    SMJ320C25

    Abstract: SMJ320C25-50
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns SMJ320C25 SMJ320C25-50

    LACT

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit LACT

    SMJ320C25

    Abstract: SMJ320C25-50 0006H rfid
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns SMJ320C25 SMJ320C25-50 0006H rfid

    FJ CHEMICALS

    Abstract: SMJ320C25 SMJ320C25-50 MO-066
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 68-Pin 100-ns 80-ns FJ CHEMICALS SMJ320C25 SMJ320C25-50 MO-066

    Untitled

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit

    documentation for 32 bit alu in vlsi

    Abstract: EPROM 27001 TMS320C25 starter
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit documentation for 32 bit alu in vlsi EPROM 27001 TMS320C25 starter

    k534

    Abstract: No abstract text available
    Text: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier


    Original     		PDF SMJ320C25, SMJ320C2550 SGUS007D 100-ns 80-ns 16-Bit 32-Bit k534

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    7142LA25L48B

    Abstract: 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA
    Text: IDT Military Offerings FIFO Military Offerings Logic Military Offerings Multi-Port Military Offerings SRAM Military Offerings May 2005 FIFO Military Offerings FIFO Military Selector Guide by Part Number FIFO Military Selector Guide (by SMD Number) Obsolete Part List and Replacement Guide


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 7200L20TDB 7200L30TDB 7201LA20DB 7201LA30DB 7142LA25L48B 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA

    IDT54FCT541ATDB

    Abstract: 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA
    Text: FIFO MILITARY SELECTOR GUIDE As Of: November 1, 2001 FIFO Military Offerings Page FIFO Military Selector Guide by Part Number . 3-4 FIFO Military Selector Guide (by SMD Number) . 5 Obsolete Part List and Replacement Guide . 6-8


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 72404L15DB 72404L35DB 7200L20TDB 7200L30TDB IDT54FCT541ATDB 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    Z8PE003PZ010SC

    Abstract: 124 008r
    Text: Packaging Product Specification PS007203-0101 ZiLOG Worldwide Headquarters • 910 E. Hamilton Avenue • Campbell, CA 95008 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether


    Original     		PDF PS007203-0101 Z8PE003PZ010SC 124 008r

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package