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    SOT26 Price and Stock

    Toshiba America Electronic Components HN2D03F(TE85L,F)

    Diodes - General Purpose, Power, Switching SOT26-6 EPITAXIAL DIODE 400V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI HN2D03F(TE85L,F) Reel 3,000
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    SOT26 Datasheets (17)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT261-2 NXP Semiconductors Footprint for wave soldering Original PDF
    SOT261-2 NXP Semiconductors Plastic leaded chip carrier; 28 leads Original PDF
    SOT261-3 NXP Semiconductors Footprint for wave soldering Original PDF
    SOT261-3 NXP Semiconductors Plastic leaded chip carrier; 28 leads; pedestal Original PDF
    SOT262A1 NXP Semiconductors Flanged double-ended ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT262A2 NXP Semiconductors Flanged double-ended ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT262B NXP Semiconductors Flanged double-ended ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT263 Philips Semiconductors Package outline Original PDF
    SOT263-01 NXP Semiconductors Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option Original PDF
    SOT263B NXP Semiconductors Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 Original PDF
    SOT263B-01 NXP Semiconductors Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option Original PDF
    SOT266-1 NXP Semiconductors Footprint for reflow soldering Original PDF
    SOT266-1 NXP Semiconductors Plastic shrink small outline package; 20 leads; body width 4.4 mm Original PDF
    SOT266-1 NXP Semiconductors Footprint for reflow soldering SOT266-1 Original PDF
    SOT266-1_118 NXP Semiconductors SSOP20; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT268A NXP Semiconductors Flanged double-ended ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT268A_112 NXP Semiconductors CDFM4; blister pack; standard product orientation 12NC ending 112 Original PDF