SIDE BRAZED CERAMIC DUAL-IN-LINE PACKAGES Search Results

LT1460BCS3-10

Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

DD 127 D TRANSISTOR

Abstract: FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

Contextual Info: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: A = Solder (C) = Gold (X) = Optional Screening: (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP (U) = 14-lead ceramic bottom-brazed dual-in-line Flatpack

Contextual Info: Precision, ±5 g, Dual-Axis, High Temperature iMEMS Accelerometer ADXL206 FEATURES GENERAL DESCRIPTION High performance, dual-axis accelerometer on a single IC −40°C to +175°C ambient temperature range Long life: guaranteed 1000 hours at TA = 175°C 13 mm x 8 mm × 2 mm side-brazed ceramic dual in-line

Contextual Info: Precision, ±5 g, Dual-Axis, High Temperature iMEMS Accelerometer ADXL206 FEATURES GENERAL DESCRIPTION High performance, dual-axis accelerometer on a single IC −40°C to +175°C ambient temperature range Long life: guaranteed 1000 hours at TA = 175°C 13 mm x 8 mm × 2 mm side-brazed ceramic dual in-line

HEXFETs FETs

Abstract: I-242 I-239 160 P2 0 075A 5V 2N7335 IRFG110 IRFG9110 JANTXV2N7335 fg91
Contextual Info: Data Sheet No. PD-9.397E INTERNATIONAL RECTIFIER I R HEXFET TRANSISTORS 4PCHANNEL POWER MOSFETb 14 LEAD DUAL-IN-LINE QUAD CERAMIC SIDE BRAZED PACKAGE -100 Volt, 1.4 Ohm (P-Channel) IRFG9HO 2N 7335 JANTXSN7335 JANTXVSN7335 [REF: MIL-S-1S500/59S] Product Summary

AX2022

Abstract: TACT2150 D6142
Contextual Info: TACT2150 512 X 8 CACHE ADDRESS COMPARATOR D 2 9 9 3 . JA N U A R Y 1 9 8 7 - R E V IS E D SEPTEM BER 1967 Address to MATCH Valid Time TACT2150-20 . . . 20 ns max TACT2150-30 . . . 30 ns max DW, JD . OR NT PACKAGE 300-Mil 24-Pin Ceramic Side-Brazed or Plastic Dual-In-Line or Small Outline

Contextual Info: 27C64 M ic r o c h ip 64K 8K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance —120 ns access time available • CMOS Technology for low power consumption —20 mA Active current — 100 nA Standby current • Factory programming available

AY0438/P001

Contextual Info: AY0438 M ic r o c h ip 32-Segment CMOS LCD Driver FEATURES PIN CONFIGURATION 40-LEAD DUAL INLINE • Drives up to 32 LCD segments of arbitrary configuration • CMOS process for: wide supply voltage range, lowpower operation, high-noise immunity, wide temperature range

AA10

Abstract: PIC16C54 32816 C038A
Contextual Info: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: Examples: XXXXXXXXXX - XX X/XX XXX QTP, SQTP, or ROM Code or Special Requirements Case D J K L P S W CB JN JW PQ SJ SL SM SN SO SP SS TS VS 27C256T - 15I/J PIC16C54 - RCI/SO

191 ISOLATION TRANSFORMER

Abstract: HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 HI-1569 Holt Applications Note AN-500
Contextual Info: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers November 2004 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

Contextual Info: $ M 27C512 ic r o c h ip 512K 64K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance — 90 ns access time available • CMOS Technology for low power consumption — 35 mA Active current — 100 |iA Standby current • Factory programming available

HI-1573PST

Abstract: HI-1573PSI HI-1573PCT HI-1573 hi-1573pci HI-1574PCT HI-1573CDM HI_1573PSI HI1573PSI HI-1573CDI
Contextual Info: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

HI1574PSI

Abstract: 1573PCI HI1573PS HI-1573PCT HI-1574CDI HI-1573CDI
Contextual Info: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers August 2005 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

68A40

Abstract: timer 6840 Thomson TV tuner module 68B40 EF68A40 EF68A40CM EF68B40 EF68A40JM EF6840CV ds1906
Contextual Info: 1 O THOMSON COMPOSANTS MILITAIRES ET SPATIAUX EF 6840 NMOS PROGRAMMABLE TIMER MODULE PTM DESCRIPTION The EF 6840 is a programmable subsystem component of the 6800 family designed to provide variable system time in­ tervals. The EF6840 has three 16-bit binary counters, three corres­

c1651

Abstract: 200B 28CXX CLCC footprint 14047 Packaging Diagrams HA 1100 soic
Contextual Info: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products

Contextual Info: ^EDI High Density ZIP Electronic Design« Inc. • Superior Vertical Packaging With ever increasing memory speeds and corresponding higher speed drivers, engineers must consider any and all .100" ZIP aspects of board level performance optimization, while also

voltage follower

Abstract: ICL7664 723C 8001C 8001M ICL7660 ICL7663 ICL7665 LH2110 LH2111
Contextual Info: Voltage Followers Type Vos mV Description •in ("A) Slew Output Rate Swing (V/pS) (V) Av (min) 3 dB B/W (V/V) (MHz) Ta (°C) •supp (mA) Packages* 0.999 — — ±10 4.0 - 5 5 , +125 F, T 0.999 — — ±10 — - 5 5 , +125 J, F, T 0.9985 15 30 ±10 4.0

TO metal package aluminum kovar

Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Contextual Info: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/

Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 February 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus

HI-8482

Contextual Info: HI-8482 HOLE INTEGRATED CIRCUITS ARINC 429 DUAL LINE RECEIVER PIN CONFIGURATIONS GENERAL DESCRIPTION The HI-8482 bus interface unit is a silicon gate CMOS de­ vice designed as a dual line receiver in accordance with the requirements of the ARINC 429 bus specification. It

HI-3182

Abstract: HI-3183 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383 HS-3182
Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 March 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus

0-100KBPS

Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 February 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus

3188 diode

Abstract: 124 008r
Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER December 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus