TSOP-II 44 Search Results

TSOP Type II

Abstract: 9749 cel 9200 140C 8361H JESD22 Cypress 44LD
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97491, Version 1.0 March, 1998 44 Ld TSOP Type II OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type II QTP# 97491, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

84-1LMI

Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

TSOP 44 Package

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)

FPT-44P-M08

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M08) 44-pin plastic TSOP (II) (FPT-44P-M08)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) 44-pin plastic TSOP (II) (FPT-44P-M18)

TSOP044-P-0400-1

Abstract: MAX4435
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 44-pin plastic TSOP II (FPT-44P-M07) 44-pin plastic TSOP (II)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80mm Package width 300mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17) 44-pin plastic TSOP (II) (FPT-44P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)

TSOP044-P-0400-3

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-44P-M09) 44-pin plastic TSOP (II)

TSOP 86 Package

Abstract: tsop 86
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)

TSOP 62 Package

Abstract: TSOP-II 44 TSOP package tray
Contextual Info: UNIT : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 PP 137.5±0.5 A A' 13.1 180±1.0 21.25±0.5 32±0.1 NEC LA–2541B–1 HEAT PROOF 24.3 SECTION A – A' 24.3 6.2 5.8 8.8 21.3 Applied Package 28-pin Plastic TSOP II (400mil) 44-pin Plastic TSOP (II)(400mil)

Contextual Info: MEMORY ICS FUNCTION GUIDE 2. PRODUCT GUIDE Density 4M bit Org. Power Supply 512KX 3 5V±10% Part Number KM29N040T Speed Features Package = 32B Page Mode 4KB Block size 44 40 TSOP II 256B Page Mode 4KB Block size 44(40) TSOP II tR 15US tR C = 1 2 0 n s 3.3V±10%

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

TSOP 86 Package

Abstract: 86-PIN TSOP 400 86
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01)

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

Contextual Info: HYUNDAI HYM5V72A220A X-Series 1M X 7 2-b it CMOS DRAM MODULE DESCRIPTION The HYM5V72A220A is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of four HY51V4400B in 20/26 pin TSOP-II, eight HY51V18160B 44/50pin TSOP-II and four 16-bit BiCMOS line driver in TSSOPon a 168 pin

ECO6

Contextual Info: HYUNDAI HYM572A220 X-Series 2M x 72-bit CMOS DRAM MODULE DESCRIPTION The HYM572A220 is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of four HY514400A in 20/26 pin SOJ or TSOP-II, eight HY5118160 42/42 pin SOJ or 44/50 pin TSOP-II and two 16-bit BiCMOS line driver in

Contextual Info: 'HYUNDAI HYM572A124A R-Series Unbuffered 1M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM572A124A is a 1M x 72-bit EDO mode CMOS DRAM module consisting of two HY514404B in 20/26 pin SOJ or TSOP-II, four HY5118164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168 pin

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC2M32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

HY5118160

Contextual Info: HYUNDAI HYM572A120 X-Series 1M X 72-bit CMOS DRAM MODULE DESCRIPTION The HYM572A120 is a 1M x 72-bit Fast page m ode CMOS DRAM m odule consisting of tw o HY514400A in 20/26 pin SOJ o r TSOP-II, four HY5118160 42/42 pin SOJ o r 44/50 pin TSOP-II and two 16-bit BiCMOS line driver in

RAS 0610

Abstract: ras - 0610 RAS- 0610 PA 0610 D5 HY51V18164 hy51v18164b
Contextual Info: »HYUNDAI HYM5V72A124A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The HYM5V72A124A is a 2M x 72-bit EDO m ode CMOS DRAM m odule consisting of two HY51V4404B in 20/26 pin SOJ or TSOP-II, four HY51V18164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048bit EEPROM on a 168

MT48LCM32B2P

Abstract: MT48LCM32B2 x32s
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

MT48LC2M3B2b5

Abstract: MT48LCM32B2 MT48LCM32B2P MT48LC2M3B2 MT48LCM32 SMD MARKING code tac 63 ball fbga thermal resistance micron MT48LC4M16A2B4-6A IT 64Mb SDRAM is a high-speed CMOS
Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free