84-1LMI
Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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400-mils320cr84-1lmigold1021-zsc+8cy7c1021-zscablebond 84-1lmitsop 48 thermal resistanceablebond841lmi140cjesd22moisture sensitivity
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CEL9200
Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97416 VERSION 1.0 June, 1998 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V 64K x 16 Static RAM CY7C1019V 128K x 8 Static RAM Cypress Semiconductor, Inc. 1 Meg SRAM - R42D Technology - Fab 4 Device: CY7C1021V/CY7C1019V 7C1321D/7C1319D
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cy7c1021vcy7c1019vcy7c1021v/cy7c1019v7c1321d/7c1319d+644-pincy7c102132-pincy7c1019cel9200sumitomo silver epoxy
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