TSOP PACKAGE Search Results

tsop series

Abstract: TSOP-16 TSOP tsop datasheet mitsumi transistor 20a mitsumi 22 TSOP-20A
Contextual Info: Package MITSUMI Packages TSOP Series Units : mm TSOP-16B 0.15+0.10 -0.05 5.0±0.3 0.5±0.2 9 4.4±0.2 16 1 8 0.65 0~10° 0.10 0.22±0.10 TSOP-20A TSOP-24A 0.10 0.10±0.05 1.1±0.1 (1.0) 0.525 max. 6.4±0.3 TSOP-16A

atmel 134

Abstract: TSOP 28 SPI memory Package 3316F tsop 17 atmel tsop
Contextual Info: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 40-lead TSOP and smaller TSOP packages can be

TSOP 48 LAYOUT

Abstract: TSOP 28 SPI memory Package tsop 38 atmel 134
Contextual Info: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 48-lead TSOP and smaller TSOP packages can be

TSOP-20A

Abstract: TSOP-16A
Contextual Info: MITSUMI Packages Packages Units : mm SSOP-24A TSOP-16A TSOP-20A

tsop6

Abstract: TSOP-6 SI3443DV TSOP-6 Marking Marking information part marking information 036 marking TSOP66
Contextual Info: Si3443DV Package Outline TSOP-6 Part Marking Information TSOP-6 6 www.irf.com

land pattern for TSOP

Abstract: land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package
Contextual Info: Recommended Land Pattern for SST TSOP Devices Recommended Land Pattern for SST TSOP Devices Application Note October 2001 INTRODUCTION Designing in the 8mm x 14mm TSOP Package SST offers an 8mm x 14mm TSOP package for our bulk erase, Byte-Program SuperFlash MTP products and the

H2JTDG8UD2MBR

Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
Contextual Info: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

2 pin male connector 5mm pitch

Abstract: tsop 48 PIN SOCKET CLIP-048-TS01-FLEX TSOP 48 socket TSOP 50 socket TSOP 56 socket HASL board TS02 TS04 TSOP 48 Package
Contextual Info: TSOP Clip TSOP Clip™ CLIP-048-TS01-FLEX Introducing the first clip designed especially for TSOP packages w w w w w World Leader in Adapters, Clips, and Test Accessories Minimum clearance of .030" 0.76mm for side-by-side connection Uses directionally conductive elastomeric connectors instead of pins

TSOP 32 socket

Abstract: Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket
Contextual Info: SOCKETS/SOCKET TOOLS INTEL TSOP Precision Vacuum Wand • ■ ■ ■ ■ ■ ■ Reduces bent leads Increases process throughput time Minimizes handling Utilizes guide pins Eliminates manual alignments Works with Yamaichi* TSOP sockets and Intel TSOP trays

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

pd0008

Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
Contextual Info: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

TSOP 86 Package

Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
Contextual Info: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16

KM416S8030BN

Abstract: KM416S8030B
Contextual Info: shrink-TSOP KM416S8030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 Aug. 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.1 Aug. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

48-PIN

Abstract: FBGA048-P-0808 LH28F800BGH-L LH28F800BG-L TSOP048-P-1220
Contextual Info: SHARP LH28F800BG-L/BGH-L FOR TSOP, CSP LH28F800BG-L/BGH-L (FOR TSOP, CSP) CONTENTS DESCRIPTION. 447 COMPARISON TABLE. 448

Contextual Info: c Mounting pad of TSOP (type I) The nominal dimensions of the TSOP (thin small outline package) (type I) are determined by the combination of the width of the plastic body (E) and the total length (HD). For example, “32-pin 8 x 20 TSOP (type I)” means that the package width is 8 mm, and that the total

PA32TS14-OT

Abstract: 32TS14
Contextual Info: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.