TSOP 6 Search Results

tsop6

Abstract: TSOP-6 SI3443DV TSOP-6 Marking Marking information part marking information 036 marking TSOP66
Contextual Info: Si3443DV Package Outline TSOP-6 Part Marking Information TSOP-6 6 www.irf.com

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP

M312L5623MTS

Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Contextual Info: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

H2JTDG8UD2MBR

Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
Contextual Info: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B

Contextual Info: CIC-40TS-40D-F6-YAM-S 40-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F004B3 E28F008B3 E28F016B3 SOCKET: BASE 40-Pin DIP PIN NAMES SOCKET 40-Lead TSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP-6 material

Abstract: tssop8 thermal performance TSOP-6 175
Contextual Info: TSOP-6—The Next Step for LITTLE FOOTR Cellular telephones, notebook computers, and other portable electronic systems are becoming smaller with each new generation of products. The new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

71406

Abstract: tsop6 package solder mask 1206 8 ChipFET AN818 AN826 AN-818
Contextual Info: AN818 Vishay Siliconix Using the Single-Channel TSOP-6 As a Second-Source for the 1206-8 Single-Channel ChipFETr Kandarp Pandya INTRODUCTION The Vishay Siliconix ChipFET is a state-of-the-art package that evolved from the TSOP-6 format. Despite the improved

200B

Abstract: 27C512-12 27C512-15 27C512A
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

k4h510438b

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM Pb-Free DDR SDRAM DDR SDRAM Registered Module 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC 66 TSOP II with Pb-Free (RoHS compliant) Revision 1.2 Oct. 2004 Revison 1.2 Oct. 2004

Contextual Info: STATIC SRAM RAM Random Access Memory TSOP LH5164AT-80L CMOS 64K 8K x 8

PC133 registered reference design

Contextual Info: Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM Revision History Revision 0.0 July 29. 1999, Preliminary - First generation of datasheet. REV. 0.0 July. 1999 Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM KMM390S6520BN SDRAM DIMM

sf 118 d

Contextual Info: NTGS3441B Power MOSFET -20 V, -3.5 A, Single P-Channel, TSOP-6 Features •ăLow RDS on in TSOP-6 Package •ă2.5 V Gate Rating •ăThis is a Pb-Free Device http://onsemi.com Applications •ăBattery Switch and Load Management Applications in Portable

Contextual Info: White Electronic Designs W3E64M72S-XSBX 64Mx72 DDR SDRAM BENEFITS FEATURES „ Data rate = 200, 250, 266 and 333Mbs* „ 66% Space Savings vs. TSOP „ Package: „ Reduced part count • 219 Plastic Ball Grid Array PBGA , 25 x 32mm „ 55% I/O reduction vs TSOP

TSOP 48 pin flash gbit

Abstract: JS28F00AP33BF 1FFC000
Contextual Info: Numonyx Axcell P33-65nm Flash Memory 512-Mbit , 1-Gbit , 2-Gbit Datasheet Product Features  High performance:  TSOP: — 105ns initial access time 512-Mbit, 1-Gbit Easy BGA and TSOP: — Buffered Enhanced Factory Programming at 2.0MByte/s (typ) using 512-word buffer

48TS-40D-A6-WEL-S

Abstract: TSOP 48 socket
Contextual Info: CIC-48TS-40D-A6-WEL-S 48-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F200CV / B5 E28F400CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $190.00 $171.00 $161.50 $142.50 TYPICAL DIMENSIONS:

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)