TSOP 6 Search Results

H2JTDG8UD2MBR

Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
Contextual Info: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

Contextual Info: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor

71406

Abstract: tsop6 package solder mask 1206 8 ChipFET AN818 AN826 AN-818
Contextual Info: AN818 Vishay Siliconix Using the Single-Channel TSOP-6 As a Second-Source for the 1206-8 Single-Channel ChipFETr Kandarp Pandya INTRODUCTION The Vishay Siliconix ChipFET is a state-of-the-art package that evolved from the TSOP-6 format. Despite the improved

s29al004d55

Abstract: S29AL016D70TFI010 am29LV8000 S29PL064J70BFI120 S29AL016D70BFI020 Am29LV8000B S29JL064H90TFI000 S29AL008D70TFI020 S29JL032H70TFI020 S29JL032
Contextual Info: ORDERING PART NUMBER MAPPING GUIDE March, 2005 Release AMD PRODUCTS FUJITSU PRODUCTS SPANSION PRODUCTS Am29LV400B S29AL004D Am29LV800B/D S29AL008D Am29LV160D MBM29LV160TE/BE S29AL016D Am29LV160M S29AL016M Am29DL32xG TSOP MBM29DL32xE • MBM29DL32F • MBM29DL34F (TSOP)

W9759

Abstract: MBM29F010 29C101T15 intel 28F020 intel 28F010 28F010T AM29F010 28F020T 28F001BX-B 28F001BX-T
Contextual Info: Created in DoubleCAD XT, www.DoubleCAD.com 17.78 mm 6.42 mm 32 pin TSOP to 32 pin DIP 22.04 mm Part Number W9759 Product Group Programmer Adapters Top Package TSOP Top Pitch 0.5mm Bottom Package DIP Bottom Pitch 0.6" Top Pins 32 Bottom Pins 32 15.24 mm 2.54 mm

Contextual Info: NTGS3130N Power MOSFET 20 V, 5.6 A Single N-Channel, TSOP-6 Features •ăLeading Edge Trench Technology for Low On Resistance •ăLow Gate Charge for Fast Switching •ăSmall Size 3 x 2.75 mm TSOP-6 Package •ăThis is a Pb-Free Device http://onsemi.com

Contextual Info: NTGS3447P Power MOSFET -12 V, -5.3 A, Single P-Channel, TSOP-6 Features •ăLow RDS on in TSOP-6 Package •ă1.8 V Gate Rating •ăThis is a Pb-Free Device http://onsemi.com V(BR)DSS Applications •ăBattery Switch and Load Management Applications in Portable

Contextual Info: Shrink-TSOP KMM377S6520BN Preliminary 512MB Registered DIMM 512MB Registered DIMM based on 128Mb SDRAM sTSOP2 Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 Shrink-TSOP KMM377S6520BN

TSOP package tray

Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Contextual Info: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117

JEDEC tray standard tsop

Abstract: TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS
Contextual Info: UNIT : mm HEAT PROOF 7 109.36 PPE NEC 135°C MAX 13.67 13.27 TSOP 2 400MIL18 18.8 A' 20.42 14.56 285.88 315.0 (322.6) SECTION A-A' 18.8 5.62 (6.35) 15.0 7.62 135.9 9x15=135 12.2 A Applied Package Quantity (pcs) 28-pin Plastic TSOP(II)(400mil) MAX. 135 Material

wells 648-0482211

Abstract: 648-0482211 648-0482211-A31
Contextual Info: CIC-48TS-44D-A6-WEL-S 48-Lead TSOP to a 44-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: BASE 44-Pin DIP E28F200CV / B5 E28F400CE / CV / B5 E28F800CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $195.00 $175.50

MT48LCM32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

Contextual Info: DRAM PART NUMBERING HY 51 X XX XXX X XX XX - XX HYUNDAI SPEED Memory Products 45 45ns 50 50ns 60 60ns 70 70ns PRODUCT GROUP 51 : DRAM PACKAGE PROCESS & POWER SUPPLY BLANK : CMOS, 5.0V J 300mit SOJ V : CMOS, 3.3V JC 400mit SOJ T 300mil TSOP-II TC 400mil TSOP-il

MT48LC2M32B2P

Contextual Info: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free

648-0482211

Abstract: wells 648-0482211 wells 648-0482211-A31 648-0482211-a31
Contextual Info: CIC-48TS-44D-A6-WEL-S 48-Lead TSOP to a 44-Pin DIP 9/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: BASE 44-Pin DIP E28F200CV / B5 E28F400CE / CV / B5 E28F800CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $195.00 $175.50

Contextual Info: NTGS3455T1 MOSFET -3.5 Amps, -30 Volts P−Channel TSOP−6 Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available http://onsemi.com Applications V(BR)DSS

hyundai

Abstract: 9734 CEL9200 8361H 37159 140C JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97348 VERSION 1.0 January, 1998 32 Ld TSOP Package Hyundai, Korea Assembly Cypress Semiconducto Assembly: Hyundai, Korea Package: 32 Ld TSOP QTP# 97348, V. 1.0 Page 2 of 4 January, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

STT 433

Abstract: V62C5181024 RB800 RM302 Z010
Contextual Info: M O SEL VITELIC PRELIMINARY V62C5181024 128K X 8 STATIC RAM Features • Packages - 32-pin TSOP Standard - 32-pin TSOP (Reverse) - 32-pin 600 mil PDIP - 32-pin 300 mil SOP (450 mil pin-to-pin) - 32-pin 440 mil SOP (525 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns

NTGS3433T1

Abstract: NTGS3433T1G
Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: n AMENDMENT Advanced Micro Devices CMOS Memory Products 1991 Data Book Handbook Publication: Am27C256 PID# 08007F/1 Page 2-40 Amend this data sheet to add information on the TSOP package that is now available for this product. CONNECTION DIAGRAM TSOP Packages

D0000H-DFFFFH

Contextual Info: 2Meg SRAM/8Meg FLASH, 70ns, TSOP STACK 30A193-00 C 2 Megabit SRAM / 8 Megabit FLASH DP3SZ128512X16NY5 ADVANCED INFORMATION DESCRIPTION: The DP3SZ128512X16NY5 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ TSOP stacking technology. The Module packs 2-Megabits of

Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

simm 72pin

Abstract: HMD16M36M12EG
Contextual Info: HANBit HMD16M36M12EG 64Mbyte 16Mx36 EDO/with Parity Mode 4K Ref. 72pin-SIMM Design Part No. HMD16M36M12EG GENERAL DESCRIPTION The HMD16M36M12EG is a 16M x 36bit dynamic RAM high-density memory module. The module consists of eight CMOS 16M x 4bit DRAMs in 32-pin SOJ or TSOP packages and four CMOS 16Mx1bit DRAMs in SOJ or TSOP packages