400MIL21 Search Results

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H J I G N C S B L S K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H I S G C D N M J L S K B M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 E 5°±5° F detail of lead end 1 25 A H J K G I N D L B C M M S50G5-80-7JF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

U 821 B

Abstract: 0020L
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end S T R 1 A∗3 L Q 25 U H N C S J I S G B K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E 5°±5° detail of lead end 1 25 A D M M C B L G K N I J H S50G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E 1 P 25 A M D M K N C S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Contextual Info: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E P 1 25 A M D M K C N S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS JEDEC tray standard tsop TRAY TSOP TSOP package tray H6115 TSOP TRAY TRAY DIMENSIONS SSD-A-H6115-2
Contextual Info: TRAY CONTAINER HEAT PROOF A' 12.00 7 135°C MAX. PPE 109.36 13.67 13.27 A NEC TSOP 2 400MIL21 9x13=117 21.10 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.10 5.62 (6.35) 18.00 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 32-pin Plastic TSOP (II)

0038 tsop

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

TSOP 54 tray

Abstract: tsop 0038
Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

U 821 B

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end U Q L R T 1 25 A∗3 D M S M K C N G S B S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TSOP package tray

Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Contextual Info: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case