TSOP 48 STACKED DIE PACKAGE Search Results

48-PIN

Abstract: LRS1338A 1338a2
Contextual Info: LRS1338A Data Sheet Stacked Chip 8M Flash Memory and 2M SRAM FEATURES PIN CONFIGURATION • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP TSOP48-P-1014 plastic package 48-PIN TSOP TOP VIEW S-A16/F-A15 1 48 S-A17/F-A16 S-A15/F-A14

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America

Contextual Info: HIGH-DENSITY PACKAGE • TCP/COB/CSP/STACKED PACKAGE igh density packages, TCP and COB are designed to respond to the demands for thinner, more compact and lower cost of systems. They are superior to conventional packages in space requirements, thickness and cost as

q1257

Abstract: Q1129 Q4331 TSOP66 Q4311 tsop 4021 tsop ddr2 ram DDR RAM 512M DRAM spectrum infineon TSOP-66
Contextual Info: 2002791-D-RAM–hoch17 11.09.2003 15:07 Uhr Seite 1 Product Information 2003 / 2004 DRAM SPECTRUM www.infineon.com Never stop thinking. 2002791-D-RAM–hoch17 11.09.2003 15:07 Uhr Seite 2 Introduction September 2003. This edition of the DRAM Spectrum has been developed

Contextual Info: V437464S24VD 3.3 VOLT 64M x 72 HIGH PERFORMANCE UNBUFFERED ECC SDRAM MODULE Features Description • 168 Pin Unbuffered ECC 67,108,864 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S

sdram pcb layout gerber

Abstract: 512M ProMOS
Contextual Info: V437432S24VD 3.3 VOLT 32M x 72 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM ECC MODULE Features Description • 168 Pin Unbuffered ECC 33,554,432 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S

128 DDR PC400

Abstract: V8266
Contextual Info: V826632K24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features Description • 184 Pin Unbuffered 33,554,432 x 64 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages ■ Single +2.5V ± 0.2V Power Supply

DPDD64MX16XCY8

Contextual Info: ADVANCE D COM P ON E NTS PACKAG I NG 1 Gigabit CMOS DDR SDRAM DPDD64MX16XCY8 DESCRIPTION: DuraStack uses DPAC's innovative technology patent pending to stack memory devices with a direct lead-on-lead, creating a metallurgical bond. As no substrate interface material is required, the length and width of the stack is comparable to a TSOP type-II

diagrams hitachi ecu

Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

Contextual Info: V826664K24SA 64M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features Description • 184 Pin Unbuffered 67,108,864 x 64 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages ■ Single +2.5V ± 0.2V Power Supply

ddr2 laptop pin

Abstract: DDR3 Infineon microDIMM 214 DDR3 miniDIMM JEDEC DDR2 DIMM 240 pinout DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR333
Contextual Info: Product Information 2004 MEMORY DRAM Modules Including DDR2 Modules w w w. i n f i n e o n . c o m / m e m o r y Never stop thinking. Introduction One-Stop-Shopping for DRAM Modules J U N E 2 0 0 4 . As a leading memory products supplier, we offer an extensive range of leading-edge DRAM modules.

S34ML08G

Abstract: S34ML08G2 S34ML04G2 S34ML04G s34ml01g S34ML08G201 NAND FLASH BGA
Contextual Info: S34ML08G2 NAND Flash Memory for Embedded 8 Gb, 4-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G2 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

S34ML08G

Abstract: S34ML08G2 Spansion S34ML08G2 s34ml Spansion NAND Flash slc NAND FLASH BGA NAND Flash Memory 2013
Contextual Info: S34ML08G2 NAND Flash Memory for Embedded 8 Gb, 4-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G2 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

RISC-Processor s3c2410

Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Contextual Info: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH

microDIMM

Abstract: UGM32T66G6LA-PL NC143 VSS75
Contextual Info: UGM32T66G6LA-PL Data sheets can be downloaded at www.unigen.com 256M Bytes 32M x 64 bits SYNCHRONOUS DRAM MODULE PC133 SDRAM Unbuffered MicroDIMM based on 4 pcs 32M x 16 Stacked SDRAM with LVTTL, 4 banks & 8K Refresh PIN ASSIGNMENT (Front View) 144-Pin MicroDIMM

S34ML08G101

Abstract: S34ML08G S34ML08G1 VBM063 Spansion NAND Flash DIE S34ML01G1_04g1 S34ML Spansion NAND S34ML01G1 S34ML04G
Contextual Info: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

DDR2 SDRAM DIMM

Contextual Info: V826632G24SA 256 MB 200-PIN DDR UNBUFFERED SODIMM 32M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 33,554,432 x 64 bit organization. ■ Utilizes High Performance 32M x 8 DDR SDRAM in TSOPII-66 Packages

S34ML08G1

Abstract: 48 - tsop1 pcb layout S34ML08G Spansion NAND Flash DIE JEDEC TRAY TSOP1 jedec mo-142 footprint Spansion NAND Flash S34ML01G1 nand flash ONFI 3.0 NAND Flash Qualification Reliability Spansion NAND Flash
Contextual Info: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O and 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

SF 150 U11 4K

Contextual Info: V826664G24SA 512 MB 200-PIN DDR UNBUFFERED SODIMM 64M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 67,108,864 x 64 bit organization. ■ Utilizes High Performance 32M x 8 DDR SDRAM in SOC Packages

jedec mo-142

Contextual Info: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O, 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

Contextual Info: S34ML08G1 NAND Flash Memory for Embedded 8 Gb, 1-bit ECC, x8 I/O, 3V VCC Data Sheet Advance Information S34ML08G1 NAND Flash Memory for Embedded Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion

Contextual Info: V826632M24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MICRODIMM MODULE Features Description • 172 Pin Unbuffered 33,554,432 x 64 bit Organization DDR MICRODIMM Modules ■ Utilizes High Performance 32M x 8 DDR SDRAM in SOC Packages ■ Single +2.5V ± 0.2V Power Supply

S25FL256

Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
Contextual Info: Spansion Product Selector Guide April 2012 Spansion ® Products Portfolio Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including: