TSOP 48 Search Results

Contextual Info: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP

Contextual Info: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM

PC133 registered reference design

Contextual Info: Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM Revision History Revision 0.0 July 29. 1999, Preliminary - First generation of datasheet. REV. 0.0 July. 1999 Shrink-TSOP KMM390S6520BN Preliminary PC133 Registered DIMM KMM390S6520BN SDRAM DIMM

48TS-40D-A6-WEL-S

Abstract: TSOP 48 socket
Contextual Info: CIC-48TS-40D-A6-WEL-S 48-Lead TSOP to a 40-Pin DIP 7/97 EXAMPLES TSOP DEVICES: PIN CONFIGURATION: E28F200CV / B5 E28F400CE / CV / B5 SOCKET: Wells 648-0482211-A31 PRICING: QTY PRICE EACH 1-4 5-9 10-24 25-49 $190.00 $171.00 $161.50 $142.50 TYPICAL DIMENSIONS:

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M08 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M08) 48-pin plastic TSOP (I) (FPT-48P-M08) LEAD No. 48 1 Details of "A" part

MT28F008B3

Abstract: MT28F800B3
Contextual Info: 8Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F008B3 MT28F800B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Eleven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Eight main memory blocks

MT28F002B3

Abstract: MT28F200B3
Contextual Info: 2Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F002B3 MT28F200B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Five erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Two main memory blocks

FPT-48P-M20

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M20 Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 48-pin plastic TSOP I (FPT-48P-M20) 48-pin plastic TSOP (I) (FPT-48P-M20) * : Resin protrusion. (Each side : 0.15 (.006) Max)

FPT-48P-M19

Abstract: 50REF
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 48 PIN PLASTIC FPT-48P-M19 48-pin plastic TSOP I Lead pitch 0.50mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-48P-M19) 48-pin plastic TSOP (I) (FPT-48P-M19) * : Resin protrusion. (Each side : 0.15 (.006) Max)

TSOP-6 material

Abstract: tssop8 thermal performance TSOP-6 175
Contextual Info: TSOP-6—The Next Step for LITTLE FOOTR Cellular telephones, notebook computers, and other portable electronic systems are becoming smaller with each new generation of products. The new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

NTGS3433T1

Abstract: NTGS3433T1G
Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

NTGS3455T1

Abstract: NTGS3455T1G
Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

200B

Abstract: 27C512-12 27C512-15 27C512A
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

NTGS4111P

Abstract: NTGS4111PT1 NTGS4111PT1G
Contextual Info: NTGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space Improved Efficiency for Battery Applications

WED3DG6435V-D1

Contextual Info: WED3DG6435V-D1 -JD1 White Electronic Designs 256MB – 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION The WED3DG6435V is a 32Mx64 synchronous DRAM module which consists of eight 32Mx8 SDRAM components in TSOP II package, and one 2Kb EEPROM in an 8 pin TSOP package for Serial Presence Detect which

tsop 66

Abstract: W3E32M72S-XBX
Contextual Info: White Electronic Designs W3E32M72S-XBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266, 333Mbs 40% SPACE SAVINGS vs. TSOP Package: Reduced part count • 219 Plastic Ball Grid Array PBGA , 32 x 25mm 34% I/O reduction vs TSOP 2.5V ±0.2V core power supply

TSOP 48 pin flash gbit

Abstract: JS28F00AP33BF 1FFC000
Contextual Info: Numonyx Axcell P33-65nm Flash Memory 512-Mbit , 1-Gbit , 2-Gbit Datasheet Product Features  High performance:  TSOP: — 105ns initial access time 512-Mbit, 1-Gbit Easy BGA and TSOP: — Buffered Enhanced Factory Programming at 2.0MByte/s (typ) using 512-word buffer

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M04 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend 28-pin plastic TSOP I (FPT-28P-M04) 28-pin plastic TSOP (I) (FPT-28P-M04) 22 21 Details of "A" part

Contextual Info: W3DG6435V-D1 -JD1 White Electronic Designs 256MB – 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION The W3DG6435V is a 32Mx64 synchronous DRAM module which consists of eight 32Mx8 SDRAM components in TSOP II package, and one 2Kb EEPROM in an 8 pin TSOP package for Serial Presence Detect which are mounted on

MT48LC4M32B2P

Abstract: TP 472
Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

simm 72pin

Abstract: HMD16M36M12EG
Contextual Info: HANBit HMD16M36M12EG 64Mbyte 16Mx36 EDO/with Parity Mode 4K Ref. 72pin-SIMM Design Part No. HMD16M36M12EG GENERAL DESCRIPTION The HMD16M36M12EG is a 16M x 36bit dynamic RAM high-density memory module. The module consists of eight CMOS 16M x 4bit DRAMs in 32-pin SOJ or TSOP packages and four CMOS 16Mx1bit DRAMs in SOJ or TSOP packages

TSOP 48 thermal resistance

Abstract: TSOP-6
Contextual Info: Tem ic S e m i c o n d u c t o r s TSOP-6—The Next Step for LITTLE FOOT Cellular telephones, notebook com puters, and other portable electronic systems are becom ing smaller with each new generation of products. T he new TSOP-6 LITTLE FOOT family anticipates this evolution. Its small size allows the

eprom 27c256 28 PIN DIP 120 NS

Abstract: 27C256-15 200B 27C256 27C256-10 27C256-12 27C256-20
Contextual Info: 27C256 256K 32K x 8 CMOS EPROM TSOP OE A11 A9 A8 A13 A14 VCC 1 2 3 4 5 6 7 VPP A12 A7 A6 A5 A4 A3 8 9 10 11 12 13 14 27C256 A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, SOIC, VSOP or TSOP packaging is