TRAY BGA 27 Search Results

tray datasheet bga

Abstract: 4545
Contextual Info: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)

ADV0505

Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The

BGA package tray 40 x 40

Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09

676 BGA package tray

Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)

676 BGA package tray

Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Contextual Info: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)

27B1

Abstract: BGA27 BGA package tray 625-Pin
Contextual Info: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)

a 2530

Abstract: JEDEC tray standard JEDEC TRAY DIMENSIONS tray bga BGA package tray tray jedec BGA 550-PIN
Contextual Info: TRAY CONTAINER 19.80 135° C MAX. A A' 25.30 NEC 96.3 BGA30 x 25ESP 32.10 135.9 PPE 4 × 9=36 UNIT : mm 30.30 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.30 (5.88) (5.62) 7.62 30.00 Applied Package Quantity (pcs) 420-pin Plastic BGA (30×25) 464-pin Plastic BGA (30×25)

337 BGA

Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Contextual Info: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)

tray datasheet bga

Abstract: tray bga
Contextual Info: 150°C MAX 135.9 80 BGA 45 x 45 2 × 6 = 12 PPE 7 HEAT PROOF Unit : mm 45.3 A 48 37.5 45.3 240 315 322.6 SECTION A – A' 45.3 44 4.72 7.62 6.35 27.95 A' BGA 45 × 45 Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C 12 less than 1 × 10 Ω /

tray bga

Abstract: tray datasheet bga NEC 2732 jedec bga tray tray jedec BGA JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 4 x 9=36 19.80 135° C MAX. 25.30 NEC 96.3 A' BGA30.5×25ESP 32.10 135.9 PPE A 30.80 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.80 (5.87) (5.62) 7.62 30.50 Applied Package Quantity (pcs) 559-pin Plastic BGA (30.5×25) 36 MAX.

tray datasheet bga

Abstract: TRAY DIMENSIONS tray bga
Contextual Info: 87.6 24.15 29.20 135.9 UNIT : mm 27.2 A' A 27.2 29.2 26.10 262.8 315.0 322.6 SECTION A-A' 6.42 6.35 7.62 27.12 Applied Package Quantity (pcs) 256-pin Plastic BGA MAX. 40 Tray Material Heat Proof Temp. Surface resistance T-651 Carbon PES 135°C less than 1x1012Ω/

Contextual Info: TRAY CONTAINER UNIT : mm 3 x 7=21 NEC 80.0 135° C MAX. A' 37.70 40.00 37.50 37.70 27.95 7 BGA37.5 × 37.5A 40.00 135.9 PPE A 240.0 315.0 322.6 SECTION A-A' 3.92 (6.35) 7.62 37.70 Applied Package Quantity (pcs) 1296-pin Plastic BGA (37.5×37.5) (FLIP CHIP TYPE)

nec 2505

Abstract: tray datasheet bga BGA 927 tray bga nec 3131
Contextual Info: TRAY CONTAINER UNIT : mm 3 x 9=27 85.8 NEC 135° C MAX. 31.25 25.05 BGA31 × 31A-1 42.90 135.9 PPE A A' 31.25 33.90 21.90 271.2 315.0 322.6 SECTION A-A' 4.32 (6.35) 7.62 31.25 Applied Package Quantity (pcs) 840-pin Plastic BGA (31×31) (FLIP CHIP TYPE)

BGA25

Abstract: TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm A' 7 25.50 27.50 20.00 25.50 135°C MAX. 26.70 BGA25x25ESP 27.50 NEC 82.5 135.9 4×11=44 PPE A 275.0 315.0 322.6 SECTION A – A' 25.50 (6.01) (6.35) 7.62 25.00 Applied Package Quantity (pcs) 240-pin Plastic BGA (25×25) (CAVITY DOWN ADVANCED TYPE)

jedec bga tray

Abstract: 784-pin 12Surface tray bga BGA package tray
Contextual Info: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)

256-pin

Contextual Info: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of

WY transistor

Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
Contextual Info: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of

tray datasheet bga

Abstract: 256-pin BGA BGA L WY transistor
Contextual Info: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

56mm carrier tape

Abstract: 28 pin ic TM 1628
Contextual Info: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03

CCGA

Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
Contextual Info: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:

S146

Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Contextual Info: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,