BGA21 Search Results

SF-BGA216A-B-11

Contextual Info: D Package Code: BGA216A C 30.48mm [1.200"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 1.27mm [0.050"] X 30.48mm [1.200"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 1.27mm [0.050"] 5.33mm 3.74mm [0.147"]

Contextual Info: Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T e R P N M L K e2 J H G F E D C B A shape optional 4x 1 2 3 4 5

h7673

Abstract: 360-Pin MPSU 60 transistor tray dimensions BGA21
Contextual Info: TRAY CONTAINER UNIT : mm 5 x 12=60 20.15 135° C MAX. 23.90 BGA21 × 21A A' 21.20 23.90 26.05 21.20 NEC 95.6 135.9 MPSU A 262.9 315.0 322.6 SECTION A-A' (4.62) 6.35 7.62 21.20 Applied Package Quantity (pcs) 360-pin Plastic BGA (21×21) (FLIP CHIP TYPE)

BGA217

Abstract: MS 034 SOT710-1 MS-034 sot710
Contextual Info: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T e R P N M L K e2 J H G F

337 BGA

Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
Contextual Info: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA217 package SOT710-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

BGA217

Abstract: SF-BGA217A-B-11
Contextual Info: D Package Code: BGA217A C 20.32mm [0.800"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 20.32mm [0.800"] Top View reference only 2 1.27mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

Contextual Info: P-BGA216-2323-1.00A3K Uniti nn Jul.2003

SF-BGA213A-B-11

Contextual Info: D Package Code: BGA213A C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

Contextual Info: AT91SAM ARM-based Embedded MPU SAM9X35 SUMMARY DATASHEET Description The SAM9X35 is a highly-integrated 400 MHz ARM926EJ-S embedded MPU, featuring an extensive peripheral set and high bandwidth architecture for industrial applications that require refined user interfaces and high-speed communication.

Contextual Info: ARM-based Embedded MPU SAM9G35 DATASHEET Description The SAM9G35 is a member of the Atmel series of 400 MHz ARM926EJ-S embedded MPUs that support high bandwidth communication and advanced user interfaces and are optimized for industrial applications such as building automation,

Contextual Info: ARM-based Embedded MPU SAM9N12 SAM9CN11 SAM9CN12 SUMMARY DATASHEET Description Based on the ARM926EJ-S processor, the Atmel SAM9N12/CN11/CN12 devices offer the frequently-requested combination of user interface functionality and high data rate connectivity, with LCD Controller, resistive touch-screen, multiple UARTs, SPI,

ATMEL 234

Abstract: how to derive sim 900 ARM926EJ-S AT91SAM ISO7816
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16-Kbyte Data Cache, 16-Kbyte Instruction Cache, Write Buffer

SAMSUNG MCP

Abstract: samsung K5 MCP BA35 BA4110 ba4410 BA651 Flash Memory SAMSUNG k5
Contextual Info: Preliminary MCP MEMORY K5A3x40YT B B Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History 0.0 Initial Draft Draft Date Remark February 22, 2002 Preliminary

Contextual Info: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,

Contextual Info: Features • Core • • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,

6242E

Abstract: 4583 dual schmitt trigger 6242b la 4508 ic pin diagram R1100D121C AT91Bootstrap CS 5609 ARM926EJ-S ISO7816 5609 dec
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer

BATM Advanced Communications

Abstract: ARM926EJ-S ISO7816 0x0792603F
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer

at91sam9g10

Abstract: AT91SAM9G10-CU 16-KB ARM926EJ-S ISO7816
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer

Contextual Info: Features • Core • • • • • • – ARM926EJ-S ARM Thumb® Processor running at up to 400 MHz @ 1.0V +/- 10% – 16 Kbytes Data Cache, 16 Kbytes Instruction Cache, Memory Management Unit Memories – One 64-Kbyte internal ROM embedding bootstrap routine: Boot on NAND Flash,

AT91SAM9260B-CU

Abstract: AT91SAM9260 Electrical Characteristics AT91SAM9260B AT91SAM9260 pwm AT91SAM9260-CU AT91SAM9260B-QU 217-LFBGA d1159 AT91SAM9260 AT91SAM9260-QU ethernet controller
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • • • – DSP Instruction Extensions, ARM Jazelle® Technology for Java® Acceleration – 8-KByte Data Cache, 8-KByte Instruction Cache, Write Buffer

37 PIN TFT MOBILE DISPLAY 8K

Abstract: ARM926 ISO7816 ARM926EJ-S 0X004 Universal Transceivers VIA ARM926 LCDD0-LCDD23
Contextual Info: Features • Incorporates the ARM926EJ-S ARM Thumb® Processor • • • • • • • • • • – DSP Instruction Extensions – ARM Jazelle® Technology for Java® Acceleration – 16 Kbyte Data Cache, 16 Kbyte Instruction Cache, Write Buffer