SOT710 Search Results
SOT710 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT710-1 |
|
Plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm | Original | 252.11KB | 1 | ||
| SOT710-1 |
|
Footprint for reflow soldering SOT710-1 | Original | 11.54KB | 1 |
SOT710 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T e R P N M L K e2 J H G F E D C B A shape optional 4x 1 2 3 4 5 |
Original |
BGA217: OT710-1 MS-034 | |
BGA217
Abstract: MS 034 SOT710-1 MS-034 sot710
|
Original |
BGA217: OT710-1 MS-034 BGA217 MS 034 SOT710-1 MS-034 sot710 | |
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA217 package SOT710-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
BGA217 OT710-1 OT710-1 |